Stress Controlled Silicon Nitride Thin Film Deposited by Plasma Enhanced Chemical Vapour Deposition

SiN, films are deposited on silicon wafers through plasma enhanced chemical vapor deposition （PECVD）. The relationship between the film stress and deposition factors is investigated. It is found that low stress films would be obtained by adjusting the ratio of low frequency（LF） power to high frequency（HF） power pulse time or the chamber pressure. The best of the two methods to control stress in the film is changing the percentage of LF power pulse time. The low stress condition is achieved when the percentage of low frequency power pulse time in total time（LF and HF pulse time） is close to 40%, The low stress cantilever of tunable vertical cavity surface emitting laser is obtained by using this deposition condition,     

Preparation and characterization of cubic lattice ZnS：Na Films with （111） preferred orientation

ZnS：Na thin films with （111） preferred orientation were deposited on glass substrates by vacuum evaporation method. The as-prepared films were annealed in flowing argon at 400--500 ℃ to improve the film crystallinity and electrically activate the dopants. The structural, optical and electrical properties of ZnS：Na films are investigated by X-ray diffrac- tion （XRD）, photoluminescence （PL）, optical transmittance measurements and the four-point probe method. Results show that the as-prepared ZnS：Na films are amorphous, and exhibit （111） preferred orientation after annealing at 400 --500 ℃. The PL emissions at 414 nm and 439 nm are enhanced due to the increase of the intrinsic defects induced by the thermal annealing. However, all the samoles exhibit high resistivitv due to the heavy self-compensation.     

衬底温度对In掺杂CdO薄膜的结构和性能的影响

Transparent indium-doped cadmium oxide（In-CdO） thin films were deposited on quartz glass substrates by pulsed laser deposition（PLD） from an ablating Cd-In metallic target.The effect of substrate temperature on the structural,optical and electrical properties of In-doped CdO thin films were studied in detail.The optical transmittance of In doped CdO films are obviously influenced by the substrate temperature.All films exhibit a transmittance higher than 75%in the visible region.More significantly,In-doping leads to an evident widening of optical band gap from 2.56 to 2.91 eV;and the increase in optical band gap is found to depend on the deposition temperature.It is also seen that the electrical properties of these films strongly depend on the substrate temperature. The In-CdO thin film grown at 300℃has low resistivity(1.15×10^-4Ω·cm),high carrier concentration(5.35×10²⁰ cm^-3),and high mobility（101.43 cm²/（V·s））.     

Preparation and characterization of transparent conducting ZnO:W films by DC magnetron sputtering

Tungsten-doped zinc oxide（ZnO:W） films with low resistivity and high transmittance were successfully deposited on glass substrates by direct current magnetron sputtering at low temperature.The deposition pressure is varied from 12 to 21 Pa.The X-ray diffraction results show that all of the deposited films are polycrystalline and have a hexagonal structure with a preferred c-axis orientation.The crystallinity,morphologies and resistivity of ZnO:W films greatly depend on deposition pressure while the optical properties including optical transmittance, optical band gap as well as refractive index are not sensitive to deposition pressure.The deposited films with an electrical resistivity as low as 1.5×10^-4Ω·cm,sheet resistance of 6.8Ω/□and an average transmittance of 91.3% in the visible range were obtained at a deposition pressure of 21 Pa and sputtering power of 130 W.     

有源层溅射温度对非晶铟镓锌氧薄膜晶体管电学特性的影响

The effect of active layer deposition temperature on the electrical performance of amorphous InGaZnO （a-IGZO） thin film transistors （TFTs） is investigated. With increasing annealing temperature, TFT performance is firstly improved and then degraded generally. Here TFTs with best performance defined as ＂optimized-annealed＂ are selected to study the effect of active layer deposition temperature. The field effect mobility reaches maximum at deposition temperature of 150℃ while the room-temperature fabricated device shows the best subthreshold swing and off-current. From Hall measurement results, the carrier concentration is much higher for intentional heated a-IGZO films, which may account for the high off-current in the corresponding TFT devices. XPS characterization results also reveal that deposition temperature affects the atomic ratio and Ols spectra apparently. Importantly, the variation of field effect mobility of a-IGZO TFTs with deposition temperature does not coincide with the tendencies in Hall mobility of a-IGZO thin films, Based on the further analysis of the experimental results on a-IGZO thin films and the corresponding TFT devices, the trap states at front channel interface rather than IGZO bulk layer properties may be mainly responsible for the variations of field effect mobility and subthreshold swing with IGZO deposition temperature.     

厚度对柔性衬底上制备的ZnO:Zr透明导电薄膜性能的影响

Transparent conducting zirconium-doped zinc oxide （ZnO：Zr） thin films with high transparency, low resistivity and good adhesion were successfully prepared on water-cooled flexible substrates （polyethylene glycol terephthalate, PET） by RF magnetron sputtering. The structural, electrical and optical properties of the films were studied for different thicknesses in detail. X-ray diffraction （XRD） and scanning electron microscopy （SEM） revealed that all the deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate. The lowest resistivity achieved is 1.55 × 10-3 Ω·cm for a thickness of 189 nm with a Hall mobility of 17.6 cm2/（V·s） and a carrier concentration of 2.15×1020 cm-3. All the films present a high transmittance of above 90% in the wavelength range of the visible spectrum.     

Stress control of silicon nitride films deposited by plasma enhanced chemical vapor deposition

Stress controllable silicon nitride(Si Nx) films deposited by plasma enhanced chemical vapor deposition(PECVD) are reported. Low stress Si Nx films were deposited in both high frequency(HF) mode and dual frequency(HF/LF) mode. By optimizing process parameters, stress free(-0.27 MPa) Si Nx films were obtained with the deposition rate of 45.5 nm/min and the refractive index of 2.06. Furthermore, at HF/LF mode, the stress is significantly influenced by LF ratio and LF power, and can be controlled to be 10 MPa with the LF ratio of 17% and LF power of 150 W. However, LF power has a little effect on the deposition rate due to the interaction between HF power and LF power. The deposited Si Nx films have good mechanical and optical properties, low deposition temperature and controllable stress, and can be widely used in integrated circuit(IC), micro-electro-mechanical systems(MEMS) and bio-MEMS.     

P-type ZnO thin films prepared by in situ oxidation of DC sputtered Zn3N2:Ga

The feasibility of a new fabrication route for N and Ga codoped p-type ZnO thin films on glass substrates, consisting of DC sputtering deposition of Zn3N2:Ga precursors followed by in situ oxidation in high purity oxygen, has been studied. The effects of oxidation temperature on the structural, optical and electrical properties of the samples were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), optical transmittance and Hall effect measurements. The results were compared to a control film without Ga. XRD analyses revealed that the Zn3N2 films entirely transformed into ZnO films after annealing Zn3N2 films in oxygen over 500 ℃ for 2 h. Hall effect measurements confirmed p-type conduction in N and Ga codoped ZnO films with a low resistivity of 19.8 Ω?cm, a high hole concentration of 4.6E18 cm3 and a Hall mobility of 0.7 cm2/(V s). These results demonstrate a promising approach to fabricate low resistivity p-type ZnO with high hole concentration.     

Effects of Annealing Temperature on Properties of ZnO Thin Films Grown by Pulsed Laser Deposition

ZnO thin films are deposited on n-Si（111） substrates by pulsed laser deposition（PLD） system. Then the samples are annealed at different temperatures in air ambient and their properties are investigated particularly as a function of annealing temperature. The microstructure, morphology and optical properties of the as-grown ZnO films are studied by X-ray diffraetion（XRD）. atomic force mieroseope（AFM）, Fourier transform infrared spectroscopy（FTIR） and photoluminescence（PL） spectra. The results show that the as- grown ZnO films have a hexagonal wurtzite structure with a preferred c-axis orientation. Moreover, the diameters of the ZnO crystallites become larger and the crystal quality of the ZnO fihns is improved with the increase of annealing temperature.     

Growth and microstructure properties of microcrystalline silicon films deposited using jet-ICPCVD

Microcrystalline silicon films were deposited at a high rate and low temperature using jet-type inductively coupled plasma chemical vapor deposition(jet-ICPCVD).An investigation into the deposition rate and microstructure properties of the deposited films showed that a high deposition rate of over 20 nm/s can be achieved while maintaining reasonable material quality.The deposition rate can be controlled by regulating the generation rate and transport of film growth precursors.The film with high crystallinity deposited at low temperature could principally result from hydrogen-induced chemical annealing.     

利用物理气相淀积工艺制备的HfTaON薄膜热力学稳定性研究

We investigate the thermal stability of HfTaON films prepared by physical vapor deposition using high resolution transmission electronic microscope （HRTEM） and X-ray photoelectron spectroscopy （XPS）. The results indicate that the magnetron-sputtered HfTaON films on Si substrate are not stable during the post-deposition annealing （PDA）. HfTaON will react with Si and form the interfacial layer at the interface between HfTaON and Si substrate. Hf-N bonds are not stale at high temperature and easily replaced by oxygen, resulting in significant loss of nitrogen from the bulk film. SiO2 buffer layer introduction at the interface of HfraON and Si substrate may effectively suppress their reaction and control the formation of thicker interfacial layer. But SiO2 is a low k gate dielectric and too thicker SiO2 buffer layer will increase the gate dielectric＇s equivalent oxide thickness. SiON prepared by oxidation of N-implanted Si substrate has thinner physical thickness than SiO2 and is helpful to reduce the gate dielectric＇s equivalent oxide thickness.     

PVT法CdS单晶生长

Based on the physical vapor transport （PVT） method, the growth of large-size CdS crystals inside a vertical semi-closed tube is studied. Firstly, in order to ensure 1D diffusion-advection transport, multi-thin tubes are used in the growth tube. The XRD spectra of the CdS crystal grown in this configuration indicates that the crystal quality has clearly been improved, where the FWHM is 58.5 arcsec. Secondly, theoretical and experimental growth rates under different total pressures are compared; the results show that the experiential growth rate equation is valid for our semi-tube growth, and it could be used to estimate the growth rate and maximum growth time under different total pressures.     

Survivable Virtual Network Mapping Using Optimal Backup Topology in Virtualized SDN

Software-Defined Network architecture offers network virtualization through a hypervisor plane to share the same physical substrate among multiple virtual networks. However, for this hypervisor plane, how to map a virtual network to the physical substrate while guaranteeing the survivability in the event of failures, is extremely important. In this paper, we present an efficient virtual network mapping approach using optimal backup topology to survive a single link failure with less resource consumption. Firstly, according to whether the path splitting is supported by virtual networks, we propose the OBT-I and OBT-II algorithms respectively to generate an optimal backup topology which minimizes the total amount of bandwidth constraints. Secondly, we propose a Virtual Network Mapping algorithm with coordinated Primary and Backup Topology （VNM-PBT） to make the best of the substrate network resource. The simulation experiments show that our proposed approach can reduce the average resource consumption and execution time cost, while improving the request acceptance ratio of VNs.     

Software Radio——Software Radio： A Review of Design Considerations and Digital Hardware Choices

This paper reviews the requirements for Software Defined Radio （SDR） systems for high-speed wireless applications and compares how well the different technology choices available- from ASICs, FPGAs to digital signal processors （DSPs） and general purpose processors （GPPs） - meet them.     

用于ZigBee的2.4GHz低功耗双增益低噪声放大器

This paper presents a fully differential dual gain low noise amplifier（DGLNA） for low power 2.45-GHz ZigBee/IEEE 802.15.4 applications.The effect of input parasitics on the inductively degenerated cascode LNA is analyzed.Circuit design details within the guidelines of the analysis are presented.The chip was implemented in SMIC 0.18-μm 1P6M RF/mixed signal CMOS process.The DGLNA achieves a maximum gain of 8 dB and a minimum gain of 1 dB with good input return loss.In high gain mode, the measured noise figure（NF） is 2.3-3 dB in the whole 2.45-GHz ISM band.The measured 1-dB compression point, IIP3 and IIP2 is-9, 1 and 33 dBm, respectively.The DGLNA consumes 2 mA of current from a 1.8 V power supply.     

应用于低中频和零中频DVB调谐器中8阶信道滤波器设计

An eighth order active-RC filter for low-IF and zero-IF DVB tuner applications is presented, which is implemented in Butterworth biquad structure. An automatic frequency tuning circuit is introduced to compensate the cut-off frequency variation using a 6-bit switched-capacitor array. Switched-resistor arrays are adopted to cover different cut-off frequencies in low-IF and zero-IF modes. Measurement results show that precise cut-off frequencies at 2.5, 3, 3.5 and 4 MHz in zero-IF mode, 5, 6, 7 and 8 MHz in low-IF mode can be achieved, 60 dB frequency attenuation can be obtained at 20 MHz, and the in-band group delay agrees well with the simulation. Two-tone testing shows the in-band IM3 achieves -52 dB and the out-band IM3 achieves -55 dB with -11 dBm input power. This proposed filter circuit, fabricated in a SMIC 0.18μm CMOS process, consumes 4 mA current with 1.8 V power supply.     

Large-signal characterizations of DDR IMPATT devices based on group Ⅲ-Ⅴ semiconductors at millimeter-wave and terahertz frequencies

Large-signal （L-S） characterizations of double-drift region （DDR） impact avalanche transit time （IM- PATT） devices based on group III-V semiconductors such as wurtzite （Wz） GaN, GaAs and InP have been carried out at both millimeter-wave （mm-wave） and terahertz （THz） frequency bands. A L-S simulation technique based on a non-sinusoidal voltage excitation （NSVE） model developed by the authors has been used to obtain the high frequency properties of the above mentioned devices. The effect of band-to-band tunneling on the L-S properties of the device at different mm-wave and THz frequencies are also investigated. Similar studies are also carried out for DDR IMPATTs based on the most popular semiconductor material, i.e. Si, for the sake of comparison. A compara- tive study of the devices based on conventional semiconductor materials （i.e. GaAs, InP and Si） with those based on Wz-GaN shows significantly better performance capabilities of the latter at both mm-wave and THz frequencies.     

EEFA： Energy Efficiency Frame Aggregation Scheduling Algorithm for IEEE 802.11n Wireless Network

Packet size is restricted due to the error-prone wireless channel which drops the network energy utilization. Furthermore, the frequent packet retransmissions also lead to energy waste. In order to improve the energy efficiency of wireless networks and save the energy of wireless devices, EEFA （Energy Efficiency Frame Aggregation）, a frame aggregation based energy-efficient scheduling algorithm for IEEE 802.11n wireless network, is proposed. EEFA changes the size of aggregated frame dynamically according to the frame error rate, so as to ensure the data transmission and retransmissions completed during the TXOP and reduce energy consumption of channel contention. NS2 simulation results show that EEFA algorithm achieves better performance than the original frame-aggregation algorithm.     

Distributed Power Control for Energy Conservation in Hybrid Cellular Network with Device-to-Device Communication

Device-to-Device （D2D） com- munication has been proposed as a promising implementation of green communication to benefit the existed cellular network. In order to limit cross-tier interference while explore the gain of short-range communication, we devise a series of distributed power control （DPC） schemes for energy conservation （EC） and enhancement of radio resource utilization in the hybrid system. Firstly, a constrained opportunistic power control model is built up to take advantage of the interference avoidance methodology in the presence of service requirement and power constraint. Then, biasing scheme and admission control are added to evade ineffective power consumption and maintain the feasibility of the system. Upon feasibility, a non-cooperative game is further formulated to exploit the profit in EC with minor influence on spectral efficiency （SE）. The convergence of the DPC schemes is validated and their performance is confirmed via simulation results.     

具有频率调谐的GNSS接收机双模复数滤波器

A fifth/seventh order dual-mode OTA-C complex filter for global navigation satellite system receivers is implemented in a 0.18μm CMOS process.This filter can be configured as the narrow mode of a 4.4 MHz bandwidth center at 4.1 MHz or the wide mode of a 22 MHz bandwidth center at 15.42 MHz.A fully differential OTA with source degeneration is used to provide sufficient linearity.Furthermore,a ring CCO based frequency tuning scheme is proposed to reduce frequency variation.The measured results show that in narrow-band mode the image rejection ratio（IMRR）is 35 dB,the filter dissipates 0.8 mA from the 1.8 V power supply,and the out-of-band rejection is 50 dB at 6 MHz offset.In wide-band mode,IMRR is 28 dB and the filter dissipates 3.2 mA.The frequency tuning error is less than±2%.