漂移区阶梯掺杂的双栅SOI LDMOS研究

A new double gate SOI LDMOS with a step doping profile in the drift region is proposed. The structure is characterized by one surface gate and another embedded gate under the P-body region. The broadened current flow path and the majority carrier accumulation layer on the side wall of the embedded gate reduce the specific on-resistance （Ron, sp）. The electric field distribution is improved due to the embedded gate and step doping profile, resulting in a high breakdown voltage （BV） and low Ron, sp. The influences of device parameters on BV and Ron, sp are investigated by simulation. The results indicate that BV is increased by 35.2% and Ron, sp is decreased by 35.1% compared to a conventional SOI LDMOS.     

基于CMOS工艺的高效，高耐用性RF LDMOS器件

Two types of RF LDMOS devices, specified for application in the driver stage and output stage of a power amplifier, are designed based on a modified CMOS process. By optimizing the layout and process, the output capacitance per unit of gate width is as low as 225 fF/mm. The driver stage and output stage devices achieve an output power of 44 W with a PAE of 82% and 230 W with a PAE of 72.3%, respectively(P3dB compression) at 1 GHz. Both devices are capable of withstanding extremely severe ruggedness tests without any performance degradation. These tests are 3-5 dB overdrive, 10:1 voltage standing wave ratio mismatch load through all phase angles, and 40% drain overvoltage elevation at a working point of P3dB.     

增强型自对准源漏区AlN/GaN/AlN 氮极化金属绝缘半导体场效应晶体管的静态特性与短沟道效应的研究

This paper aims to simulate the I–V static characteristic of the enhancement-mode(E-mode) Npolar Ga N metal–insulator–semiconductor field effect transistor(MISFET) with self-aligned source/drain regions.Firstly, with SILVACO TCAD device simulation, the drain–source current as a function of the gate–source voltage is calculated and the dependence of the drain–source current on the drain–source voltage in the case of different gate–source voltages for the device with a 0.62 m gate length is investigated. Secondly, a comparison is made with the experimental report. Lastly, the transfer characteristic with different gate lengths and different buffer layers has been performed. The results show that the simulation is in accord with the experiment at the gate length of 0.62 m and the short channel effect becomes pronounced as gate length decreases. The E-mode will not be held below a100 nm gate length unless both transversal scaling and vertical scaling are being carried out simultaneously.     

Kirk effect and suppressing for 20 V planar active-gap LDMOS Nie Weidong(聂卫东)1, 2, Yi Fayou(易法友)2, and Yu Zongguang(于宗光)1

For 20 V planar active-gap lateral double-diffused MOSFET（LDMOS）,the sectional channel is utilized to decrease the electric field in the n-drift region below the poly gate edge in the off-state,compared with the conventional single channel.Then the n-drift concentration can be increased to decrease the Kirk effect,while keeping off-state breakdown voltage V_bd unchanged.Meanwhile the influence of the n-drift concentration and the n-drift length L_drift（the drain n⁺ diffusion to gate spacing） which are related to the Kirk effect is discussed.The trade-offs between R_dson-Area,breakdown voltage V_bd and the electrical safe operating area（e-SOA） performance of LDMOS are considered also.Finally the proposed planar active-gap LDMOS devices with varied values of L_drift are experimentally demonstrated.The experimental results show that the Kirk effect can be greatly suppressed with slight increase in the R_dson·Area parameter.     

A new high voltage SOI LDMOS with triple RESURF structure

A novel triple RESURF（T-resurf） SOI LDMOS structure is proposed.This structure has a P-type buried layer.Firstly,the depletion layer can extend on both sides of the P-buried layer,serving as a triple RESURF and leading to a high drift doping and a low on-resistance.Secondly,at a high doping concentration of the drift region, the P-layer can reduce high bulk electric field in the drift region and enhance the vertical electric field at the drain side,which results in uniform bulk electric field distributions and an enhanced BV.The proposed structure is used in SOI devices for the first time.The T-resurf SOI LDMOS with BV = 315 V is obtained by simulation on a 6μm-thick SOI layer over a 2μm-thick buried oxide layer,and its R_sp is reduced from 16.5 to 13.8 mΩ·cm² in comparison with the double RESURF（D-resurf） SOI LDMOS.When the thickness of the SOI layer increases, T-resurf SOI LDMOS displays a more obvious effect on the enhancement of BV²/R_on.It reduces R_sp by 25%in 400 V SOI LDMOS and by 38%in 550 V SOI LDMOS compared with the D-resurf structure.     

F注入AlGaN/GaN增强型HEMT

The fabrication of enhancement-mode AlGaN/GaN HEMTs by fluorine plasma treatment on sapphire substrates is reported. A new method is used to fabricate devices with different fluorine plasma RF power treatments on one wafer to avoid differences between different wafers. The plasma-treated gate regions of devices treated with different fluorine plasma RF powers were separately opened by a step-and-repeat system. The properties of these devices are compared and analyzed. The devices with 150 W fluorine plasma treatment power and with 0.6 μm gate-length exhibited a threshold voltage of 0.57 V, a maximum drain current of 501 mA/mm, a maximum transconductance of 210 mS/mm, a current gain cutoff frequency of 19.4 GHz and a maximum oscillation frequency of 26 GHz. An excessive fluorine plasma treatment power of 250 W results in a small maximum drain current, which can be attributed to the implantation of fluorine plasma in the channel.     

一种具有超强电荷积累效应的高优值超结SOI LDMOS

A novel silicon-on-insulator(SOI) super-junction(SJ) LDMOS with an ultra-strong charge accumulation effect is proposed. It has two key features: an assisted-accumulation trench-type extending gate(TEG) with a high-k(HK) dielectric and a step-dopedN pillar(TEG-SD SJ LDMOS). In the on-state, electrons accumulate at the sidewall of the HK dielectric from the source to the drain by the TEG. Furthermore, the high permittivity of the HK dielectric leads to an ultra-strong charge accumulation effect. As a result, an ultra-low resistance current path is formed. The specific on-resistance(Ron;sp/ is thus greatly reduced and is independent of the drift doping concentration. In the off-state, the step-dopedN pillar effectively suppresses the substrate-assisted depletion effect by charge compensation. Moreover, the reshape effect of the HK dielectric and the new electric field(E-field) peak introduced by the step-dopedN pillar enhance the drift region E-field. Hence, the BV is improved. Simulation indicates that the TEG-SD SJ LDMOS achieves an extremely low Ron;sp of 1.06 m cm2 and a BV of 217 V. Compared with the conventional SJ LDMOS, the TEG-SD SJ LDMOS decreases the Ron;sp by 77.5% and increases the BV by 33%,exhibiting a high figure of merits(FOM=BV2/Ron;sp/ of 44 MW/cm2.     

高K栅堆叠结构MOSFET器件阈值电压不稳定度的半经验解析模型

A semi-empirical analytic model for the threshold voltage instability of MOSFET is derived from the Shockley-Read-Hall (SRH) statistics in this paper to account for the transient charging effects in a MOSFET high-k gate stack. Starting from the single energy level and single trap assumption, an analytical expression of the filled trap density in terms of the dynamic time is derived from the SRH statistics. The semi-empirical analytic model of the threshold voltage instability is developed based on the MOSFET device physics between the threshold voltage and the induced trap density. The obtained model is also verified by the extensive experimental data of the trapping and de-trapping stress from the different high k gate configuration.     

ESD robustness studies on the double snapback characteristics of an LDMOS with an embedded SCR

Criterion for the second snapback of an LDMOS with an embedded SCR is given based on parasitic parameter analysis.According to this criterion,three typical structures are compared by numerical simulation and structural parameters which influence the second snapback are also analyzed to optimize the ESD characteristics. Experimental data showed that,as the second snapback voltage decreased from 25.4 to 8.1 V,the discharge ability of the optimized structure increased from 0.57 to 3.1 A.     

多层浮栅FET pH传感单元阈值电压敏感模型分析和讨论

Research into new pH sensors fabricated by the standard CMOS process is currently a hot topic. The new pH sensing multi-floating gate field effect transistor is found to have a very large threshold voltage, which is different from the normal ion-sensitive field effect transistor. After analyzing all the interface layers of the structure, a new sensitive model based on the Gauss theorem and the charge neutrality principle is created in this paper. According to the model, the charge trapped on the multi-floating gate during the process and the thickness of the sensitive layer are the main causes of the large threshold voltage. From this model, it is also found that removing the charge on the multi-floating gate is an effective way to decrease the threshold voltage. The test results for three different standard pH buffer solutions show the correctness of the model and point the way to solve the large threshold problem.     

DCFl-Checker： Checking Kernel Dynamic Control Flow Integrity with Performance Monitoring Counter

It is a challenge to verify integrity of dynamic control flows due to their dynamic and volatile nature. To meet the challenge, existing solutions usually implant an ＂attachment＂ in each control transfer. However, the attachment introduces additional cost except performance penalty. For example, the attachment must be unique or restrictedly modified. In this paper, we propose a novel approach to detect integrity of dynamic control flows by counting executed branch instructions without involving any attachment. Our solution is based on the following observation. If a control flow is compromised, the number of executed branch instructions will be abnormally increased. The cause is that intruders usually hijack control flows for malicious execution which absolutely introduces additional branch instructions. Inspired by the above observation, in this paper, we devise a novel system named DCFI- Checker, which detect integrity corruption of dynamic control flows with the support of Performance Monitoring Counter （PMC）. We have developed a proof-of-concept prototype system of DCFI-Checker on Linux fedora 5. Our experiments with existing kemel rootkits and buffer overflow attack show that DCFI- Checker is effective to detect compromised dynamic control transfer, and performance evaluations indicate that performance penaltyinduced by DCFI-Checker is acceptable.     

Software Radio——Software Radio： A Review of Design Considerations and Digital Hardware Choices

This paper reviews the requirements for Software Defined Radio （SDR） systems for high-speed wireless applications and compares how well the different technology choices available- from ASICs, FPGAs to digital signal processors （DSPs） and general purpose processors （GPPs） - meet them.     

EEFA： Energy Efficiency Frame Aggregation Scheduling Algorithm for IEEE 802.11n Wireless Network

Packet size is restricted due to the error-prone wireless channel which drops the network energy utilization. Furthermore, the frequent packet retransmissions also lead to energy waste. In order to improve the energy efficiency of wireless networks and save the energy of wireless devices, EEFA （Energy Efficiency Frame Aggregation）, a frame aggregation based energy-efficient scheduling algorithm for IEEE 802.11n wireless network, is proposed. EEFA changes the size of aggregated frame dynamically according to the frame error rate, so as to ensure the data transmission and retransmissions completed during the TXOP and reduce energy consumption of channel contention. NS2 simulation results show that EEFA algorithm achieves better performance than the original frame-aggregation algorithm.     

SDN-Based Data Offioading for 5G Mobile Networks

The rapid growth of 3G/4G enabled devices such as smartphones and tablets in large numbers has created increased demand formobile data services.Wi-Fi offloading helps satisfy the requirements of data-rich applications and terminals with improved multi-media.Wi-Fi is an essential approach to alleviating mobile data traffic load on a cellular network because it provides extra capaci-ty and improves overall performance.In this paper,we propose an integrated LTE/Wi-Fi architecture with software-defined net-working(SDN)abstraction in mobile backhaul and enhanced components that facilitate the move towards next-generation 5G mo-bile networks.Our proposed architecture enables programmable offloading policies that take into account real-time network condi-tions as well as the status of devices and applications.This mechanism improves overall network performance by deriving real-time policies and steering traffic between cellular and Wi-Fi networks more efficiently.     

Large-signal characterizations of DDR IMPATT devices based on group Ⅲ-Ⅴ semiconductors at millimeter-wave and terahertz frequencies

Large-signal （L-S） characterizations of double-drift region （DDR） impact avalanche transit time （IM- PATT） devices based on group III-V semiconductors such as wurtzite （Wz） GaN, GaAs and InP have been carried out at both millimeter-wave （mm-wave） and terahertz （THz） frequency bands. A L-S simulation technique based on a non-sinusoidal voltage excitation （NSVE） model developed by the authors has been used to obtain the high frequency properties of the above mentioned devices. The effect of band-to-band tunneling on the L-S properties of the device at different mm-wave and THz frequencies are also investigated. Similar studies are also carried out for DDR IMPATTs based on the most popular semiconductor material, i.e. Si, for the sake of comparison. A compara- tive study of the devices based on conventional semiconductor materials （i.e. GaAs, InP and Si） with those based on Wz-GaN shows significantly better performance capabilities of the latter at both mm-wave and THz frequencies.     

应力和电阻率可控的适用于高品质因子MEMS器件的原位掺硼LPCVD多晶硅薄膜

The simultaneous control of residual stress and resistivity of polysilicon thin films by adjusting the deposition parameters and annealing conditions is studied. In situ boron doped polysilicon thin films deposited at 520 ℃ by low pressure chemical vapor deposition （LPCVD） are amorphous with relatively large compressive residual stress and high resistivity. Annealing the amorphous films in a temperature range of 600-800 ℃ gives polysilicon films nearly zero-stress and relatively low resistivity. The low residual stress and low resistivity make the polysilicon films attractive for potential applications in micro-electro-mechanical-systems （MEMS） devices, especially in high resonance frequency （high-f） and high quality factor （high-Q） MEMS resonators. In addition, polysilicon thin films deposited at 570 ℃ and those without the post annealing process have low resistivities of 2-5 mΩ·cm. These reported approaches avoid the high temperature annealing process （〉 1000 ℃）, and the promising properties of these films make them suitable for high-Q and high-f MEMS devices.     

Survivable Virtual Network Mapping Using Optimal Backup Topology in Virtualized SDN

Software-Defined Network architecture offers network virtualization through a hypervisor plane to share the same physical substrate among multiple virtual networks. However, for this hypervisor plane, how to map a virtual network to the physical substrate while guaranteeing the survivability in the event of failures, is extremely important. In this paper, we present an efficient virtual network mapping approach using optimal backup topology to survive a single link failure with less resource consumption. Firstly, according to whether the path splitting is supported by virtual networks, we propose the OBT-I and OBT-II algorithms respectively to generate an optimal backup topology which minimizes the total amount of bandwidth constraints. Secondly, we propose a Virtual Network Mapping algorithm with coordinated Primary and Backup Topology （VNM-PBT） to make the best of the substrate network resource. The simulation experiments show that our proposed approach can reduce the average resource consumption and execution time cost, while improving the request acceptance ratio of VNs.     

用于ZigBee的2.4GHz低功耗双增益低噪声放大器

This paper presents a fully differential dual gain low noise amplifier（DGLNA） for low power 2.45-GHz ZigBee/IEEE 802.15.4 applications.The effect of input parasitics on the inductively degenerated cascode LNA is analyzed.Circuit design details within the guidelines of the analysis are presented.The chip was implemented in SMIC 0.18-μm 1P6M RF/mixed signal CMOS process.The DGLNA achieves a maximum gain of 8 dB and a minimum gain of 1 dB with good input return loss.In high gain mode, the measured noise figure（NF） is 2.3-3 dB in the whole 2.45-GHz ISM band.The measured 1-dB compression point, IIP3 and IIP2 is-9, 1 and 33 dBm, respectively.The DGLNA consumes 2 mA of current from a 1.8 V power supply.     

应用于低中频和零中频DVB调谐器中8阶信道滤波器设计

An eighth order active-RC filter for low-IF and zero-IF DVB tuner applications is presented, which is implemented in Butterworth biquad structure. An automatic frequency tuning circuit is introduced to compensate the cut-off frequency variation using a 6-bit switched-capacitor array. Switched-resistor arrays are adopted to cover different cut-off frequencies in low-IF and zero-IF modes. Measurement results show that precise cut-off frequencies at 2.5, 3, 3.5 and 4 MHz in zero-IF mode, 5, 6, 7 and 8 MHz in low-IF mode can be achieved, 60 dB frequency attenuation can be obtained at 20 MHz, and the in-band group delay agrees well with the simulation. Two-tone testing shows the in-band IM3 achieves -52 dB and the out-band IM3 achieves -55 dB with -11 dBm input power. This proposed filter circuit, fabricated in a SMIC 0.18μm CMOS process, consumes 4 mA current with 1.8 V power supply.     

A 3.1-4.8 GHz CMOS receiver for MB-OFDM UWB

An integrated fully differential ultra-wideband CMOS receiver for 3.1-4.8 GHz MB-OFDM systems is presented. A gain controllable low noise amplifier and a merged quadrature mixer are integrated as the RF front-end. Five order Gm-C type low pass filters and VGAs are also integrated for both I and Q IF paths in the receiver. The ESD protected chip is fabricated in a Jazz 0.18μm RF CMOS process and achieves a maximum total voltage gain of 65 dB, an AGC range of 45 dB with about 6 dB/step, an averaged total noise figure of 6.4 to 8.8 dB over 3 bands and an in-band IIP3 of-5.1 dBm. The receiver occupies 2.3 mm2 and consumes 110 mA from a 1.8 V supply including test buffers and a digital module.