排序方式: 共有13条查询结果,搜索用时 20 毫秒
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对100um和1mm碳化硅衬底的氮化镓器件进行直流特性,小信号特性和大信号特性的表征。100um和1mm器件小信号特性测试结果发现,随栅长增大,由于电容寄生效应的减小,电流截止频率fT增大。从数据看出,器件可用在C波段和X波段。大信号测试包括C波段和X波段负载牵引测试和功率扫描测试。器件偏置在AB类工作点,并且选定源端阻抗,做负载牵引测试。在负载牵引园图上,最大功率阻抗点和最佳效率阻抗点可以确定。根据5.5GHz的不同栅长的器件的功率扫描结果分析器件尺寸变换效应与和大尺寸器件的自热效应密切相关。8GHz 不同漏极偏置的器件的功率扫描结果说明碳化硅衬底的氮化镓器件有好的热导率,高击穿电压和10.16W/mm 功率密度。从分析可证明碳化硅衬底的氮化镓器件是放大器设计的理想材料。 相似文献
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The fabrication of enhancement-mode AlGaN/GaN HEMTs by fluorine plasma treatment on sapphire substrates is reported. A new method is used to fabricate devices with different fluorine plasma RF power treatments on one wafer to avoid differences between different wafers. The plasma-treated gate regions of devices treated with different fluorine plasma RF powers were separately opened by a step-and-repeat system. The properties of these devices are compared and analyzed. The devices with 150 W fluorine plasma treatment power and with 0.6 μm gate-length exhibited a threshold voltage of 0.57 V, a maximum drain current of 501 mA/mm, a maximum transconductance of 210 mS/mm, a current gain cutoff frequency of 19.4 GHz and a maximum oscillation frequency of 26 GHz. An excessive fluorine plasma treatment power of 250 W results in a small maximum drain current, which can be attributed to the implantation of fluorine plasma in the channel. 相似文献
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基于双忆阻结构阻值可线性调节的特点,提出了一种基于双忆阻的SOFM神经网络系统设计方案.该方案由预处理模块、双忆阻权值模块、欧式距离运算模块、神经元决策模块和忆阻权值更新模块组成.双忆阻权值模块由双忆阻单元和放大单元构成,双忆阻单元由两个结构相同、掺杂区相连的忆阻器构成.相对于单忆阻器结构,双忆阻由于总阻值可以保持不变... 相似文献
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采用归一化能量1 MeV的中子脉冲反应堆对AlGaN/GaN异质结材料进行了辐照研究.实验发现,经1015cm-2注量的中子辐照后,异质结材料的二维电子气(2DEG)载流子浓度(ns)下降,而2DEG迁移率由于受到ns的调制作用略有增加,同时辐照导致的载流子浓度ns下降造成了沟道串联电阻的增加和异质结构阈值电压(VTH)的正向漂移.分析认为,辐照感生类受主缺陷是造成ns下降和阈值电压漂移的原因.原子力显微镜(AFM)和X射线衍射仪(XRD)的测试结果表明,辐照后材料的表面形貌有所恶化,材料应变基本不变,而材料的螺位错和刃位错密度辐照后都略有增加.此外,实验结果还表明初始材料质量越好,辐照退化越小. 相似文献
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分别采用3MeV和10MeV的质子对GaN基HEMT(High Electron Mobility Transistor)器件进行辐照。实验发现:低注量辐照引起了体材料载流子浓度增加,高注量辐照引起了HEMT器件漏电流下降,跨导减小,阈值电压显著退化的结果。通过分析发现辐射感生受主缺陷引起的2DEG浓度降低是上述器件退化的主要原因。此外基于实验结果,采用辐射感生受主缺陷退化模型仿真并计算了HEMT器件主要参数随受主浓度的退化规律,仿真结果与实验结果有较好的一致性。本文实验结果也表明场板结构和SiN钝化层有效地阻止了电子陷落在表面态中,屏蔽了绝大部分的辐照损伤,是很有效的辐射加固手段。 相似文献
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Depletion-mode and enhancement-mode AlGaN/GaN HEMTs using fluorine plasma treatment were integrated on one wafer.Direct-coupled FET logic circuits,such as an E/D HEMT inverter,NAND gate and D flip-flop,were fabricated on an AlGaN/GaN heterostructure.The D flip-flop and NAND gate are demonstrated in a GaN system for the first time.The dual-gate AlGaN/GaN E-HEMT substitutes two single-gate E-HEMTs for simplifying the NAND gate and shrinking the area,integrating with a conventional AlGaN/GaN D-HEMT and demonstrating a NAND gate.E/D-mode D flip-flop was fabricated by integrating the inverters and the NAND gate on the AlGaN/GaN heterostructure.At a supply voltage of 2 V,the E/D inverter shows an output logic swing of 1.7 V,a logic-low noise margin of 0.49 V and a logic-high noise margin of 0.83 V.The NAND gate and D flip-flop showed correct logic function demonstrating promising potential for GaN-based digital ICs. 相似文献
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