Ka波段具有宽锁定范围高注入灵敏度的分频器*

This paper proposes a direct injection-locked frequency divider（ILFD） with a wide locking range in the Ka-band. A complementary cross-coupled architecture is used to enhance the overdriving voltage of the switch transistor so that the divider locking range is extended efficiently. New insights into the locking range and output power are proposed. A new method to analyze and optimize the injection sensitivity is presented and a layout technique to reduce the parasitics of the cross-coupled transistors is applied to decrease the frequency shift and the locking range degradation. The circuit is designed in a standard 90-nm CMOS process. The total locking range of the ILFD is 43.8% at 34.5 GHz with an incident power of –3.5 dBm. The divider IC consumes 3.6 mW of power at the supply voltage of 1.2 V. The chip area including the pads is 0.50.5 mm2.     

适用于OFDM UWB 系统的低功耗，大锁定范围注入锁定分频器

This paper describes a divide-by-two injection-locked frequency divider （ILFD） for frequency synthesizers as used in multiband orthogonal frequency division multiplexing （OFDM） ultra-wideband （UWB） systems. By means of dual-injection technique and other conventional tuning techniques, such as DCCA and varactor tuning, the divider demonstrates a wide locking range while consuming much less power. The chip was fabricated in the Jazz 0.18μm RF CMOS process. The measurement results show that the divider achieves a locking range of 4.85 GHz （6.23 to 11.08 GHz） at an input power of 8 dBm. The core circuit without the test buffer consumes only 3.7 mA from a 1.8 V power supply and has a die area of 0.38×0.28 mm^2. The wide locking range combined with low power consumption makes the ILFD suitable for its application in UWB systems.     

A fractional-N frequency divider for multi-standard wireless transceiver fabricated in 0.18 μm CMOS process

With the rapid evolution of wireless communication technology,integrating various communication modes in a mobile terminal has become the popular trend.Because of this,multi-standard wireless technology is one of the hot spots in current research.This paper presents a wideband fractional-N frequency divider of the multi-standard wireless transceiver for many applications.High-speed divider-by-2 with traditional sourcecoupled-logic is designed for very wide band usage.Phase switching technique and a chain of divider-by-2/3 are applied to the programmable frequency divider with 0.5 step.The phase noise of the whole frequency synthesizer will be decreased by the narrower step of programmable frequency divider.△-Σ modulator is achieved by an improved MASH 1-1-1 structure.This structure has excellent performance in many ways,such as noise,spur and input dynamic range.Fabricated in TSMC 0.18 μm CMOS process,the fractional-N frequency divider occupies a chip area of 1130 × 510μm2 and it can correctly divide within the frequency range of 0.8-9 GHz.With 1.8 V supply voltage,its division ratio ranges from 62.5 to 254 and the total current consumption is 29 mA.     

A △∑ fractional-N frequency synthesizer for FM tuner using low noise filter and quantization noise suppression technique

A △∑ fractional-N frequency synthesizer fabricated in a 130 nm CMOS technology is presented for the application of an FM tuner. A low noise filter, occupying a small die area and decreasing the output noise, is integrated on a chip. A quantization noise suppression technique, using a reduced step size of the frequency divider, is also adopted. The proposed synthesizer needs no off-chip components and occupies an area of 0.7 mm2. The in-band phase noise （from 10 to 100 kHz） below -108 dBc/Hz and out-of-band phase noise of -122.9 dBc/Hz （at 1 MHz offset） are measured with a loop bandwidth of 200 kHz. The quantization noise suppression technique reduces the in-band and out-of band phase noise by 15 dB and 7 dB respectively. The integrated RMS phase error is no more than 0.48°. The proposed synthesizer consumes a total power of 7.4 mW and the frequency resolution is less than 1 Hz.     

A 1-GHz Charge Pump PLL Frequency Synthesizer for IEEE 1394b PHY

The design procedure of an 1-GHz phase-locked loop (PLL)-based frequency synthesizer used in IEEE 1394b physical (PHY) system is presented in this paper. The PLL’s loop dynamics are analyzed in depth and theoretical relationships between all loop parameters are clearly described. All the parameters are derived and verified by Verilog-A model, which ensures the accuracy and efficiency of the circuit design and simulation. A 4-stage ring oscillator is employed to generate 1-GHz oscillation frequency and is divided into low frequency clocks by a feedback divider. The architecture is a third-order, type-2 charge pump PLL. The simulated settling time is less than 4μs. The RMS value of period jitter of the PLL’s output is 2.1 ps. The PLL core occupies an area of 0.12 mm2, one fourth of which is occupied by the MiM loop capacitors. The total current consumption of the chip is 16.5 mA. The chip has been sent for fabrication in 0.13 m complementary metal oxide semiconductor (CMOS) technology.     

应用于60-GHz无线通信的全差分锁相环频率综合器

A 40-GHz phase-locked loop(PLL) frequency synthesizer for 60-GHz wireless communication applications is presented. The electrical characteristics of the passive components in the VCO and LO buffers are accurately extracted with an electromagnetic simulator HFSS. A differential tuning technique is utilized in the voltage controlled oscillator(VCO) to achieve higher common-mode noise rejection and better phase noise performance. The VCO and the divider chain are powered by a 1.0 V supply while the phase-frequency detector(PFD)and the charge pump(CP) are powered by a 2.5 V supply to improve the linearity. The measurement results show that the total frequency locking range of the frequency synthesizer is from 37 to 41 GHz, and the phase noise from a 40 GHz carrier is –97.2 d Bc/Hz at 1 MHz offset. Implemented in 65 nm CMOS, the synthesizer consumes a DC power of 62 m W, including all the buffers.     

A 3.1-4.8 GHz transmitter with a high frequency divider in 0.18μm CMOS for OFDM-UWB

A fully integrated low power RF transmitter for a WiMedia 3.1-4.8 GHz multiband orthogonal frequency division multiplexing ultra-wideband system is presented. With a separate transconductance stage, the quadrature up-conversion modulator achieves high linearity with low supply voltage. The co-design of different resonant frequencies of the modulator and the differential to single （D2S） converter ensures in-band gain flatness. By means of a series inductor peaking technique, the D2S converter obtains 9 dB more gain without extra power consumption. A divided-by-2 divider is used for carrier signal generation. The measurement results show an output power between -10.7 and -3.1 dBm with 7.6 dB control range, an OIP3 up to 12 dBm, a sideband rejection of 35 dBc and a carrier rejection of 30 dBc. The ESD protected chip is fabricated in the Jazz 0.18μm RF CMOS process with an area of 1.74 mm^2 and only consumes 32 mA current （at 1.8 V） including the test associated parts.     

A monolithic K-band phase-locked loop for microwave radar application

A monolithic K-band phase-locked loop(PLL) for microwave radar application is proposed and implemented in this paper. By eliminating the tail transistor and using optimized high-Q LC-tank, the proposed voltage-controlled oscillator(VCO) achieves a tuning range of 18.4 to 23.3 GHz and reduced phase noise. Two cascaded current-mode logic(CML) divide-by-two frequency prescalers are implemented to bridge the frequency gap, in which inductor peaking technique is used in the first stage to further boost allowable input frequency. Six-stage TSPC divider chain is used to provide programmable division ratio from 64 to 127, and a second-order passive loop filter with 825 kHz bandwidth is also integrated on-chip to minimize required external components. The proposed PLL needs only approximately 18.2 μs settling time, and achieves a wide tuning range from 18.4 to 23.3 GHz, with a typical output power of -0.84 dBm and phase noise of 91:92 dBc/Hz@1 MHz. The chip is implemented in TSMC 65 nm CMOS process, and occupies an area of 0.56 mm² without pads under a 1.2 V single voltage supply.     

无源超高频射频识别标签中浅调制信号的检测

In a typical RFID system the reader transmits modulated RF power to provide both data and energy for the passive transponder. Low modulation index RF energy is preferable for an adequate tag power supply and increase in communication range but gives rise to difficulties for near-field conventional demodulation. Therefore, a novel ASK demodulator for minimum 20% modulation index RF signal detection over a range of 23 dB is presented. Thanks to the proposed innovative divisional linear conversion from the power into voltage signal, the detection sensitivity is ensured over a wide power range with low power consumption of 8.6 μW. The chip is implemented in UMC 0.18μm mix-mode CMOS technology, and the chip area is 0.06 mm^2.     

A 75 GHz regenerative dynamic frequency divider with active transformer using InGaAs/InP HBT technology

This letter presents a high speed 2:1 regenerative dynamic frequency divider with an active transformer fabricated in 0.7 μm InP DHBT technology with f_T of 165 GHz and f_max of 230 GHz. The circuit includes a two-stage active transformer, input buffer, divider core and output buffer. The core part of the frequency divider is composed of a double-balanced active mixer (widely known as the Gilbert cell) and a regenerative feedback loop. The active transformer with two stages can contribute to positive gain and greatly improve phase difference. Instead of the passive transformer, the active one occupies a much smaller chip area. The area of the chip is only 469×414 μm² and it entirely consumes a total DC power of only 94.6 mW from a single -4.8 V DC supply. The measured results present that the divider achieves an operating frequency bandwidth from 75 to 80 GHz, and performs a -23 dBm maximum output power at 37.5 GHz with a 0 dBm input signal of 75 GHz.     

Low power design of a field sequential color LCoS chip

The low power design of a field sequential color （FSC） liquid crystal on silicon （LCoS） chip for near-to-eye application is presented in this paper. Dual power supplies are used in the design, that is, the supply for part of driving circuits is 3.3 V, and the one for the active matrix is 5.0 V. Serial-to-parallel conversion circuits are adopted to lower the pixel clock frequency of the chip. Also, an idle state is inserted into the pixel clock signal to decrease the switching activity factor to further reduce the power consumption. The LCoS chip is fabricated with 0.35 μm CMOS process and its power consumption is only about 300 mW.     

A wideband low power low phase noise dual-modulus prescaler

This paper describes a novel divide-by-32/33 dual-modulus prescaler(DMP).Here,a new combination of DFF has been introduced in the DMP.By means of the cooperation and coordination among three types,DFF, SCL,TPSC,and CMOS static flip-flop,the DMP demonstrates high speed,wideband,and low power consumption with low phase noise.The chip has been fabricated in a 0.18-μm CMOS process of SMIC.The measured results show that the DMP’s operating frequency is from 0.9 to 3.4 GHz with a maximum power consumption of 2.51 mW under a 1.8 V power supply and the phase noise is -134.78 dBc/Hz at 1 MHz offset from the 3.4 GHz carrier.The core area of the die without PAD is 57×30μm~2.Due to its excellent performance,the DMP could be applied to a PLL-based frequency synthesizer for many RF systems,especially for multi-standard radio applications.     

Design of a fully differential CMOS LNA for 3.1-10.6 GHz UWB communication systems

A fully differential complementary metal oxide semiconductor （CMOS） low noise amplifier （LNA） for 3.1-10.6 GHz ultra-wideband （UWB） communication systems is presented. The LNA adopts capacitive cross-coupling common-gate （CG） topology to achieve wideband input matching and low noise figure （NF）. Inductive series-peaking is used for the LNA to obtain broadband flat gain in the whole 3.1-10.6 GHz band. Designed in 0.18 um CMOS technology, the LNA achieves an NF of 3.1-4.7 dB, an Sll of less than -10 dB, an S21 of 10.3 dB with ±0.4 dB fluctuation, and an input 3rd interception point （IIP3） of -5.1 dBm, while the current consumption is only 4.8 mA from a 1.8 V power supply. The chip area of the LNA is 1×0.94 mm^2.     

Dual-band RF receiver for GPS-L1 and compass-B1 in a 55-nm CMOS

A fully integrated dual-band RF receiver with a low-IF architecture is designed and implemented for GPS-L 1 and Compass-Bl in a 55-nm CMOS process. The receiver incorporates two independent IF channels with 2 or 4 MHz bandwidth to receive dual-band signals around 1.57 GHz respectively. By implementing a flexible frequency plan, the RF front-end and frequency synthesizer are shared for the dual-band operation to save power consumption and chip area, as well as avoiding LO crosstalk. A digital automatic gain control （AGC） loop is utilized to improve the receiver＇s robustness by optimizing the conversion gain of the analog-to-digital converter （ADC）. While drawing about 20 mA per channel from a 1.2 V supply, this RF receiver achieves a minimum noise figure （NF） of about 1.8 dB, an image rejection （IMR） of more than 35 dB, a maximum voltage gain of about 122 dB, a gain dynamic range of 82 dB, and an maximum input-referred 1 dB compression point of about -36.5 dBm with an active die area of 1.5 × 1.4 mm2 for the whole chip.     

一种用于短距离无线通信并集成频率合成器的多模式多频带发射机

A reconfigurable multi-mode direct-conversion transmitter(TX) with integrated frequency synthesizer(FS) is presented. The TX as well as the FS is designed with a flexible architecture and frequency plan, which helps to support all the 433/868/915 MHz ISM band signals, with the reconfigurable bandwidth from 250 kHz to 2 MHz. In order to save power and chip area, only one 1.8 GHz VCO is adopted to cover the whole frequency range. All the operation modes can be regulated in real time by configuring the integrated register-bank through an SPI interface. Implemented in 180 nm CMOS, the FS achieves a frequency coverage of 320-460 MHz and 620- 920 MHz. The lowest phase noise can be -107 dBc/Hz at a 100 kHz offset and -126 dBc/Hz at a 1 MHz offset. The transmitter features a C10:2 dBm peak output power with a C9:5 dBm 1-dB-compression point and 250 kHz/500 kHz/1 MHz/2 MHz reconfigurable signal bandwidth.     

A 0.7-7 GHz wideband reconfigurable receiver RF front-end in CMOS

In this paper,a 0.7-7 GHz wideband RF receiver front-end SoC is designed using the CMOS process.The front-end is composed of two main blocks:a single-ended wideband low noise amplifier (LNA) and an inphase/quadrature (I/Q) voltage-driven passive mixer with IF amplifiers.Based on a self-biased resistive negative feedback topology,the LNA adopts shunt-peaking inductors and a gate inductor to boost the bandwidth.The passive down-conversion mixer includes two parts:passive switches and IF amplifiers.The measurement results show that the front-end works well at different LO frequencies,and this chip is reconfigurable among 0.7 to 7 GHz by tuning the LO frequency.The measured results under 2.5-GHz LO frequency show that the front-end SoC achieves a maximum conversion gain of 26 dB,a minimum noise figure (NF) of 3.2 dB,with an IF bandwidth of greater than 500 MHz.The chip area is 1.67 × 1.08 mm2.     

一款便携式移动应用的低成本超高频无源射频识别读写器收发机芯片设计

A low cost integrated transceiver for mobile UHF passive RFID reader applications is implemented in a 0.18μm CMOS process. The transceiver contains an OOK modulator and a power amplifier in the transmitter chain, an IQ direct-down converter, variable-gain amplifiers, channel-select filters and a 10-bit ADC in the receiver chain. The measured output PldB power of the transmitter is 17.6 dBm and the measured receiver sensitivity is -70 dBm. The on-chip integer N synthesizer achieves a frequency resolution of 200 kHz with a phase noise of -104 dBc/Hz at 100 kHz frequency offset and -120.83 dBc/Hz at 1 MHz frequency offset. The transmitter, the receiver and the frequency synthesizer consume 201.34, 25.3 and 54 mW, respectively. The chip has a die area of 4 × 2.5 mm^2 including pads.     

A 0.13μm CMOS Δ ∑ fractional-N frequency synthesizer for WLAN transceivers

A fractional-N frequency synthesizer fabricated in a 0.13μm CMOS technology is presented for the application of IEEE 802.11 b/g wireless local area network(WLAN) transceivers.A monolithic LC voltage controlled oscillator(VCO) is implemented with an on-chip symmetric inductor.The fractional-TV frequency divider consists of a pulse swallow frequency divider and a 3rd-order multistage noise shaping(MASH)△Σmodulator with noise-shaped dithering techniques.Measurement results show that in all channels,phase noise of the synthesizer achieves -93 dBc/Hz and -118 dBc/Hz in band and out of band respectively with a phase-frequency detector (PFD) frequency of 20 MHz and a loop bandwidth of 100 kHz.The integrated RMS phase error is no more than 0.8°.The proposed synthesizer consumes 8.4 mW from a 1.2 V supply and occupies an area of 0.86 mm~2.     

A reconfigurable passive mixer for multimode multistandard receivers in 0.18 μm CMOS

This paper presents a reconfigurable quadrature passive mixer for multimode multistandard receivers. By using controllable transconductor and transimpedance-amplifier stages, the voltage conversion gain of the mixer is reconfigured according to the requirement of the selected communication standard Other characteristics such as noises figure, linearity and power consumption are also reconfigured consequently. The design concept is verified by implementing a quadrature passive mixer in 0.18 μm CMOS technology. On wafer measurement results show that, with the input radio frequency ranges from 700 MHz to 2.3 GHz, the mixer achieves a controllable voltage conversion gain from 4 to 22 dB with a step size of 6 dB. The measured maximum ⅡP3 is 8.5 dBm and the minimum noise figure is 8.0 dB. The consumed current for a single branch (I or Q) ranges from 3.1 to 5.6 mA from a 1.8 V supply voltage. The chip occupies an area of 0.71 mm² including pads.     

一种宽带的InGaP/GaAs HBT 再生频率分频器

A dynamic divide-by-two regenerative GaP/GaAs heterojunction bipolar transistors （HBTs） frequency divider （RFD） is presented in a 60-GHz-fT Intechnology. To achieve high operation bandwidth, active loads instead of resistor loads are incorporated into the RFD. On-wafer measurement shows that the divider is operating from 10 GHz up to at least 40 GHz, limited by the available input frequency. The maximum operation frequency of the divider is found to be much higher than fT/2 of the transistor, and also the divider has excellent input sensitivity. The divider consumes 300.85 mW from 5 V supply and occupies an area of 0.47 × 0.22 mm^2.