A 19-mW 2.6-mm/sup 2/ L1/L2 dual-band CMOS GPS receiver

This paper presents the design and implementation of an L1/L2 dual-band global positioning system (GPS) receiver. Dual-conversion with a low-IF architecture was used for dual-band operation. The receiver is composed of an RF preamplifier, down-conversion mixers, a variable-gain channel filter, a 2-bit analog-to-digital converter, and the full phase-locked-loop synthesizer including an on-chip voltage controlled oscillator. Fabricated in a 0.18-/spl mu/m CMOS technology, the receiver exhibits maximum gain of 95 dB and noise figures of 8.5 and 7.5 dB for L1 and L2, respectively. An on-chip variable-gain channel filter provides IF image rejection of 20 dB and gain control range over 60 dB. The receiver consumes 19 mW from a 1.8-V supply while occupying a 2.6-mm/sup 2/ die area including the ESD I/O pads.     

一个双频带可重构的直接变频接收机射频前端

A dual-band reconfigurable wireless receiver RF front-end is presented, which is based on the directconversion principle and consists of a low noise amplifer （LNA） and a down-converter. By utilizing a compact switchable on-chip symmetrical inductor, the RF front-end could be switched between two operation frequency bands without extra die area cost. This RF front-end has been implemented in the 180 nm CMOS process and the measured results show that the front-end could provide a gain of 25 dB and IIP3 of 6 dBm at 2.2 GHz, and a gain of 18.8 dB and IIP3 of 7.3 dBm at 4.5 GHz. The whole front-end consumes 12 mA current at 1.2 V voltage supply for the LNA and 2.1 mA current at 1.8 V for the mixer, with a die area of 1.2 × 1 mm^2.     

A tri-mode Compass/GPS/Galileo RF receiver with all-digital automatic gain control loop

A tri-mode RF receiver with all digital automatic gain control (AGC) loop and non-uniform 2-bit analog-to-digital converter (ADC) is designed for the bands of GPS-L1, Galileo-E1 and Compass B1 in 0.18 μm CMOS process. The RF front-end, analog baseband and frequency synthesizer with voltage controlled oscillator (VCO) have been integrated, and there are only few off-chip components including bypass capacitances, matching network and TCXO. For anti-jamming consideration, an all digital AGC loop with relevant variable gain amplifier (VGA) and non-uniform ADC is implemented to suppress interference and avoid saturation of signal chain. While drawing 35 mA current, this receiver achieves a total noise figure of 4 dB and a maximum gain of 105 dB, with a die area of 2.4 × 2.4 mm².     

应用于GSM/EDGE零中频接收机的CMOS射频前端

介绍了一个零中频接收机CMOS射频前端,适用于双带(900MHz/1800 MHz)GSM/EDGE;E系统.射频前端由两个独立的低噪声放大器和正交混频器组成,并且为了降低闪烁噪声采用了电流模式无源混频器.该电路采用0.13 μm CMOS工艺流片,芯片面积为0.9 mm×1.0 mm.芯片测试结果表明:射频前端在90...     

A 3.1-4.8 GHz CMOS receiver for MB-OFDM UWB

An integrated fully differential ultra-wideband CMOS receiver for 3.1-4.8 GHz MB-OFDM systems is presented. A gain controllable low noise amplifier and a merged quadrature mixer are integrated as the RF front-end. Five order Gm-C type low pass filters and VGAs are also integrated for both I and Q IF paths in the receiver. The ESD protected chip is fabricated in a Jazz 0.18 μm RF CMOS process and achieves a maximum total voltage gain of 65 dB, an AGC range of 45 dB with about 6 dB/step, an averaged total noise figure of 6.4 to 8.8 dB over 3 bands and an in-band lIP3 of-5.1 dBm. The receiver occupies 2.3 mm2 and consumes 110 mA from a 1.8 V supply including test buffers and a digital module.     

Design of an L1 band low noise single-chip GPS receiver in 0.18 μm CMOS technology

This article presents an L1 band low noise integrated global positioning system(GPS)receiver chip using 0.18 μm CMOS technology.Dual-conversion with a low-IF architecture was used for this GPS receiver.The receiver is composed of low noise amplifier(LNA),down-conversion mixers,band pass filter,received signal strength indicator,variable gain amplifier,programmable gain amplifier,ADC,PLL frequency synthesizer and other key blocks.The receiver achieves a maximum gain of 105 dB and noise figure less than 6 dB.The variable gain amplifier(VGA)and programmable gain amplifier(PGA)provide gain control dynamic range over 50 dB.The receiver consumes less than 160 mW from a 1.8 V supply while occupying a 2.9 mm2chip area including the ESD I/O pads.     

一种高性能CMOS单片中频接收机

研制了一种CM O S低压低功耗中频接收机芯片,它包含混频器、限幅放大器、解调器以及场强指示、消音控制等模块,可用于短距离的FM/FSK信号的接收和解调。该接收机采用1st s ilicon 0.25μm CM O S工艺,芯片的测试结果表明整机接收灵敏度为-103 dBm,最高输入射频频率可以达到100 MH z,解调器的线性解调范围为±10 kH z,典型鉴频灵敏度为40 mV/kH z,输入FM信号(调频指数3,信号频率1 kH z)时解调信号的SFDR为41.3 dB。芯片的工作电源电压范围为2~4 V,工作电流3 mA,有效面积0.25 mm2。     

A 0.1–1 GHz low power RF receiver front-end with noise cancellation technique for WSN applications

A low power 0.1–1 GHz RF receiver front-end composed of noise-cancelling trans-conductor stage and I/Q switch stage was presented in this paper. The RF receiver front-end chip was fabricated in 0.18 µm RF CMOS. Measurement results show the receiver front-end has a conversion gain of 28.1 dB at high gain mode, and the single-sideband (SSB) noise figure is 6.2 dB. In the low gain mode, the conversion gain of the receiver front-end is 15.5 dB and the IP1dB is −12 dBm. In this design, low power consumption and low cost is achieved by current-reuse and inductor-less topology. The receiver front-end consumes only 5.2 mW from a 1.8 V DC supply and the chip size of the core circuit is 0.12 mm².     

A 0.18μm CMOS dual-band low power low noise amplifier for a global navigation satellite system

This paper presents a dual-band low noise amplifier for the receiver of a global navigation satellite system. The differences between single band and multi-band design methods are discussed.The relevant parameter analysis and the details of circuit design are presented.The test chip was implemented in a TSMC 0.18μm 1P4M RF CMOS process.The LNA achieves a gain of 16.8 dB/18.9 dB on 1.27 GHz/1.575 GHz.The measured noise figure is around 1.5-1.7 dB on both bands.The LNA consumes less than 4.3 mA of current ...     

A 65 mW, 0.4–2.3 GHz Bandpass Filter for Satellite Receivers

A monolithic tunable bandpass filter for satellite receiver front-ends is presented. The center frequency of the bandpass filter can be tuned from 0.4 GHz to 2.3 GHz. The filter is constructed using four transconductor-C poly-phase filter sections and has a 50 dB variable gain range. At 20 dB attenuation and at 30 dB gain the measured 1 dB compression point is –21 dBm and –56 dBm, respectively. Measured input IP3 is –12 dBm. The noise figure is 15 dB at maximum gain. An on-chip I/Q oscillator tracks the center frequency and enables automatic tuning. The bandpass filter dissipates 65 mW with 5 Volt supply voltage and occupies 0.16 mm² chip area. The filter is realized in a standard 11 GHz f _t bipolar technology.     

A 2.4-GHz RF sampling receiver front-end in 0.18-/spl mu/m CMOS

This paper presents an integrable RF sampling receiver front-end architecture, based on a switched-capacitor (SC) RF sampling downconversion (RFSD) filter, for WLAN applications in a 2.4-GHz band. The RFSD filter test chip is fabricated in a 0.18-/spl mu/m CMOS technology and the measurement results show a successful realization of RF sampling, quadrature downconversion, tunable anti-alias filtering, downconversion to baseband, and decimation of the sampling rate. By changing the input sampling rate, the RFSD filter can be tuned to different RF channels. A maximum input sampling rate of 1072 MS/s has been achieved. A single-phase clock is used for the quadrature downconversion and the bandpass operation is realized by a 23-tap FIR filter. The RFSD filter has an IIP/sub 3/ of +5.5 dBm, a gain of -1 dB, and more than 17 dB rejection of alias bands. The measured image rejection is 59 dB and the sampling clock jitter is 0.64 ps. The test chip consumes 47 mW in the analog part and 40 mW in the digital part. It occupies an area of 1 mm/sup 2/.     

A crystal-tolerant fully integrated CMOS low-IF dual-band GPS receiver

This paper presents the design of a dual-band L1/L2 GPS receiver, that can be easily integrated in portable devices (mainly GSM mobile phones). For the ease of integration with GSM wireless systems the receiver can tolerate most of the common GSM crystals, besides the GPS crystals, this will eliminate the need to use another crystal on board. A new frequency plan is presented to satisfy this requirement. A low-IF receiver architecture is used for dual-band operation with analog on-chip image rejection. The receiver is composed of a narrow-band LNA for each band, dual down-conversion mixers, a variable-gain channel filter, a 2-bit analog-to-digital converter, and a fully integrated frequency synthesizer including an on-chip VCO and loop filter. The complex filter can accept IF frequency variation of 10% around 4.092 MHz which allows the use of the commonly used 10/13/26 MHz GSM crystals and all the GPS crystals. The synthesizer generates the LO signals for both L1/L2 bands with an average phase noise of −95 dBc/Hz. The receiver exhibits maximum gain of 112 and 115 dB, noise figures of 4 and 3.6 dB, and input compression points of −76 and −79 dBm for L1 and L2, respectively. An on-chip variable-gain channel filter provides IF image rejection greater than 25 dB and gain control range over 80 dB. The receiver is designed in 0.13 μm CMOS technology and consumes 18 mW from a 1.2-V supply.     

A high-IP3 RF receiver chip set for mobile radio base stations upto 2 GHz

We present a monolithically integrated high third-order intercept point (IP3) radio frequency (RF) receiver chip set for mobile radio base stations up to 2 GHz, in a 25-GHz f_T Si bipolar production technology. The chip set consists of a RF preamplifier, active mixer circuits, and an intermediate frequency (IF) limiter. The preamplifier gain is 12 dB, the noise figure is 5.5 dB at 900 MHz, and the output (OIP3) is up to +24 dBm depending on supply voltage. The two different mixers provide a conversion gain of 1.5 dB up to 3 dB, an OIP3 in the range of +21 dBm up to +29 dBm, and a minimal single sideband (SSB) noise figure of 13 dB. The IF limiter shows an excellent limiting characteristic at 10 dBm output power and has a high bandwidth of more than 1 GHz     

An X- and Ku-Band 8-Element Phased-Array Receiver in 0.18-$mu{hbox{m}}$ SiGe BiCMOS Technology

This paper demonstrates an 8-element phased array receiver in a standard 0.18-mum SiGe BiCMOS (1P6M, SiGe HBT f_t ap 150 GHz) technology for X- and Ku-band applications. The array receiver adopts the All-RF architecture, where the phase shifting and power combining are done at the RF level. With the integrations of all the digital control circuitry and ESD protection for all I/O pads, the receiver consumes a current of 100 ~ 200 m A from a 3.3 V supply voltage. The receiver shows 1.5 ~ 24.5 dB of power gain per channel from a 50 Omega load at 12 GHz with bias current control, and an associated NF of 4.2 dB (@ max. gain) to 13.2 dB (@ min. gain). The RMS gain error is < 0.9 dB and the RMS phase error is < 6deg at 6-18 GHz for all 4-bit phase states. The measured group delay is 162.5 plusmn 12.5 ps for all phase states at 6-18 GHz. The RMS phase mismatch and RMS gain mismatch among the eight channels are < 2.7deg and 0.4 dB, respectively, for all 16 phase states, over 6-18 GHz. The 8-element array can operate instantaneously at any center frequency and with a wide bandwidth (3 to 6 GHz, depending on the center frequency) given primarily by the 3 dB gain variation in the 6-18 GHz range. To our knowledge, this is the first demonstration of an All-RF phased array on a silicon chip with very low RMS phase and gain errors at 6-18 GHz. The chip size is 2.2 times 2.45 mm² including all pads.     

A monolithic 3.1-4.8 GHz MB-OFDM UWB transceiver in 0.18-μm CMOS

A monolithic RF transceiver for an MB-OFDM UWB system in 3.1-4.8 GHz is presented.The transceiver adopts direct-conversion architecture and integrates all building blocks including a gain controllable wideband LNA,a I/Q merged quadrature mixer,a fifth-order Gm-C bi-quad Chebyshev LPF/VGA,a fast-settling frequency synthesizer with a poly-phase filter,a linear broadband up-conversion quadrature modulator,an active D2S converter and a variablegain power amplifier.The ESD protected transceiver is fabricated in Jazz Semiconductor's 0.18-μm RF CMOS with an area of 6.1 mm2 and draws a total current of 221 mA from 1.8-V supply.The receiver achieves a maximum voltage gain of 68 dB with a control range of 42 dB in 6 dB/Step,noise figures of 5.5-8.8 dB for three sub-bands,and an inband/out-band IIP3 better than-4 dBm/+9 dBm.The transmitter achieves an output power ranging from-10.7 to-3dBm with gain control,an output P1dB better than-7.7 dBm,a sideband rejection about 32.4 dBc,and LO suppression of 31.1 dBc.The hopping time among sub-bands is less than 2.05 ns.     

A 0.7-7 GHz wideband reconfigurable receiver RF front-end in CMOS

In this paper,a 0.7-7 GHz wideband RF receiver front-end SoC is designed using the CMOS process.The front-end is composed of two main blocks:a single-ended wideband low noise amplifier (LNA) and an inphase/quadrature (I/Q) voltage-driven passive mixer with IF amplifiers.Based on a self-biased resistive negative feedback topology,the LNA adopts shunt-peaking inductors and a gate inductor to boost the bandwidth.The passive down-conversion mixer includes two parts:passive switches and IF amplifiers.The measurement results show that the front-end works well at different LO frequencies,and this chip is reconfigurable among 0.7 to 7 GHz by tuning the LO frequency.The measured results under 2.5-GHz LO frequency show that the front-end SoC achieves a maximum conversion gain of 26 dB,a minimum noise figure (NF) of 3.2 dB,with an IF bandwidth of greater than 500 MHz.The chip area is 1.67 × 1.08 mm2.     

Low-power fully integrated and tunable CMOS RF wireless receiver for ISM band consumer applications

A 0.25-/spl mu/m single-chip CMOS single-conversion tunable low intermediate frequency (IF) receiver operated in the 902-928-MHz industrial, scientific, and medical band is proposed. A new 10.7-MHz IF section that contains a limiting amplifier and a frequency modulated/frequency-shift-key demodulator is designed. The frequency to voltage conversion gain of the demodulator is 15 mV/kHz and the dynamic range of the limiting amplifier is around 80 dB. The sensitivity of the IF section including the demodulator and limiting amplifier is -72 dBm. With on-chip tunable components in the low-power low-noise amplifier (LNA) and LC-tank voltage-controlled oscillator circuit, the receiver measures an RF gain of 15 dB at 915 MHz, a sensitivity of -80 dBm at 0.1% bit-error rate, an input referred third-order intercept point of -9 dBm, and a noise figure of 5 dB with a current consumption of 33 mA and a 2450 /spl mu/m/spl times/ 2450 /spl mu/m chip area.     

A low power 3-5 GHz CMOS UWB receiver front-end

A novel low power RF receiver front-end for 3-5 GHz UWB is presented. Designed in the 0.13μm CMOS process, the direct conversion receiver features a wideband balun-coupled noise cancelling transconductance input stage, followed by quadrature passive mixers and transimpedance loading amplifiers. Measurement results show that the receiver achieves an input return loss below-8.5 dB across the 3.1-4.7 GHz frequency range, max-imum voltage conversion gain of 27 dB, minimum noise figure of 4 dB, IIP3 of-11.5 dBm, and IIP2 of 33 dBm. Working under 1.2 V supply voltage, the receiver consumes total current of 18 mA including 10 mA by on-chip quadrature LO signal generation and buffer circuits. The chip area with pads is 1.1 × 1.5 mm2.     

A 1.9-GHz silicon receiver with monolithic image filtering

A 1.9-GHz fully monolithic silicon superheterodyne receiver front-end is presented; it consists of a low noise amplifier (LNA), a tunable image reject filter, and a Gilbert cell mixer integrated in one die. The receiver was designed to operate with a 1.9-GHz RF and a 2.2-GHz local oscillator (LO) for a 300-MHz IF. Two chip versions were fabricated on two different fabrication runs using a 0.5-μm bipolar technology with 25 GHz transit frequency (f_T). Measured performance for the receiver front-end version 1, packaged and without input matching, was: conversion gain 33.5 dB, noise figure 4.9 dB, input IP3 -28 dBm, image rejection 53 dB (tuned to reject a 2.5-GHz image frequency), and 15.9 mA current consumption at +3 V. The image rejection was tunable from 2.4-2.63 GHz by means of an on-chip varactor. Version 2 had increased mixer degeneration for improved linearity. Its measured performance for the packaged receiver with its input matched to 50 Ω was: conversion gain 24 dB, noise figure 4.8 dB, input IP3 -19 dBm, and 65 dB image rejection for a 2.5-GHz image with an image tuning range from 2.34-2.55 GHz     

A low-current Ku-band GaAs monolithic image rejectiondown-converter

A single-chip image rejection downconverter has been designed, fabricated. and tested for broadcast satellite receivers operating in the 11.7- to 12.2-GHz range. The downconverter consists of an RF low-noise amplifier (LNA), a filter-type image rejection mixer (IRM), and an intermediate frequency amplifier (IFA). It receives 11.7- to 12.2-GHz RF signals and down converts to 1.0- to 1.5-GHz IF signals with an external local oscillator. Since the filter integrated on the downconverter produces an image rejection of more than 30 dB, the downconverter requires no off-chip circuits for the image rejection. A conversion gain of 37±1 dB and a noise figure of less than 3.5 dB have been achieved over the RF frequency range. The current dissipation is only 40 mA, and the chip size is 2.8 mm×2.8 mm×0.45 mm