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1.
顶部平坦化32通道AWG的设计与研制   总被引:2,自引:2,他引:0  
根据优化输入端多模干涉器(MMI)结构设计,研制出32通道50 GHz通道间隔、顶部平坦化的阵列波导光栅(AWG)器件。该器件的采用6μm×6μm折射率差为0.75%的Si基SiO2埋型波导结构,阵列波导数为130,罗兰圆半径为9 419.72μm,相邻阵列波导长度差为128.42μm。测试结果表明:AWG器件插入损耗(IS)为-5~-8.5 dB,串扰>-25 dB,3 dB带宽>0.25 nm。  相似文献   

2.
基于绝缘体上硅材料平台,设计并制作了一种结构紧凑的高均匀性硅波导阵列波导光栅,其拥有8个输出通道并且通道间隔为200 GHz。分析了绝缘体上硅材料平台中硅波导的弯曲半径对弯曲损耗和有效折射率的影响。测试结果表明,该器件的插入损耗为19.6 dB,串扰为-15 dB,非均匀性为0.87 dB,3 dB带宽为1.06 nm,结构尺寸仅为294μm×190μm。芯片的制作工艺与互补金属氧化物半导体工艺兼容,这使得阵列波导光栅的大批量、低成本生产成为可能,对集成波分复用网络的发展具有重要的意义。  相似文献   

3.
根据多模干涉器(MMI,multimode interferome ter)的自映像效应,设计了基于2×4MMI 的聚合物相干光混频器,优化光混频器结构参数;采用模式转换设计解 决多模波导的 自映像与单模波导模式失配的问题,从而进一步提高其性能。仿真结果表明,优化后的光混 频器其传输损耗 小于6.3dB,传输不均衡性小于1dB,相位误差小于1°,并且MMI长 度与宽度的设计容差分别达到40μm 和0.5μm。根据设计制备了聚合物光混频器,通过实验表征了此光 混频器的传输性能。在C波段下的测量 结果表明,其传输损耗小于10dB,不均衡性在0.5~1. 5dB之间,相位误差小于10°, 而达到这些性能的MMI长度与宽度的器件容差分别为25μm和0.5μm,均大于制备过程中0.1μm的工艺容差。测 量结果与理论模拟结果基本吻合。本文的聚合物光混频器成本低、容差高,对实现高集成度 相干接收机具有实际意义。  相似文献   

4.
相位误差对阵列波导光栅传输特性的影响   总被引:1,自引:1,他引:0  
研究了阵列波导光栅 (AWG)制作过程中产生的误差所引起的相位误差对AWG传输特性的影响。非随机误差引起的相位误差使信道的中心波长产生漂移 ,研究表明波导宽度 0 0 2 μm的变化将引起中心波长漂移 0 1nm。随机误差所产生的随机相位误差将恶化AWG的串扰特性 ,计算表明 ,最大随机误差为 0 0 0 0 0 4rad μm时 ,串扰将增加 4 2dB。  相似文献   

5.
对设计的折射率差为0.75%的16×0.8nm硅基二氧化硅阵列波导光栅(AWG),围绕插损和串扰问题,采用广角有限差分束传播方法(FD BPM)进行了数值模拟和优化。通过优化在输入波导、阵列波导的喇叭口,得到了插损为1.5dB、串扰为-48dB的AWG,优化后的指标已达到商用要求。  相似文献   

6.
通过改进热光开关单元和全内反射镜,设计并制作了基于SOI材料的8×8阻塞型热光开关矩阵.开关设计中,在单模波导和多模干涉耦合器之间引入楔形连接波导并进行优化,增大单模波导与多模波导之间的耦合效率,减小开关单元的损耗.此外,采用自对准方法提高了全内反射镜的光刻容差.开关矩阵各端口的平均插入损耗约为21dB,单个反射镜引起的附加损耗约为1.4dB,串扰少于-21dB.实验结果说明新设计改善了开关器件的整体特性,与理论分析一致.  相似文献   

7.
通过改进热光开关单元和全内反射镜,设计并制作了基于SOI材料的8×8阻塞型热光开关矩阵.开关设计中,在单模波导和多模干涉耦合器之间引入楔形连接波导并进行优化,增大单模波导与多模波导之间的耦合效率,减小开关单元的损耗.此外,采用自对准方法提高了全内反射镜的光刻容差.开关矩阵各端口的平均插入损耗约为21dB,单个反射镜引起的附加损耗约为1.4dB,串扰少于-21dB.实验结果说明新设计改善了开关器件的整体特性,与理论分析一致.  相似文献   

8.
16×0.8nm硅基二氧化硅AWG性能优化   总被引:1,自引:1,他引:0  
对设计的折射率差为0.75%的16×0.8 nm硅基二氧化硅阵列波导光栅(AWG),围绕插损和串扰问题,采用广角有限差分束传播方法(FD-BPM)进行了数值模拟和优化.通过优化在输入波导、阵列波导的喇叭口,得到了插损为1.5 dB、串扰为-48 dB的AWG,优化后的指标已达到商用要求.  相似文献   

9.
1×32硅基二氧化硅阵列波导光栅的研制   总被引:2,自引:0,他引:2  
采用高精度光刻版、PECVD材料生长、反应离子刻蚀和端面8. 角抛光等技术,设计并研制了1×32硅基二氧化硅阵列波导光栅. 研制的AWG芯片,其相邻通道引起的通道串扰小于-28dB,非相邻通道引入的串扰小于-35dB. 通道的插入损耗在进行光纤耦合封装后进一步提高,平均损耗约为4.9dB,不均匀性约为1.72dB.  相似文献   

10.
文章提出一种关于非对称电极低串扰数字光开关的新型设计方案,在Y分叉后端引入S弯曲波导,通过在Y分叉处的非对称电极和弯曲波导的弯曲电极处施加一定的同步电压,实现了比没有S弯曲的开关更低的串扰。此种设计采用有限差分光束传播方法(FDBPM)来分析,模拟结果显示,在光波长为1.55μm时,开关电压8V.串扰〈-25dB。  相似文献   

11.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

12.
High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET > PDMAT > TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.  相似文献   

13.
In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal (200) (2d = 0.4027 nm) is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line(w), the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line(x), the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines(y), the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line(z) in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line(q) in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution(λ/△ 2) is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.  相似文献   

14.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

15.
The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.  相似文献   

16.
The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.  相似文献   

17.
Today, micro-system technology and the development of new MEMS (Micro-Electro-Mechanical Systems) are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.  相似文献   

18.
This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel's.  相似文献   

19.
This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.  相似文献   

20.
An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.  相似文献   

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