碳酸盐岩中炮孔不耦合系数对地震激发效果影响的分析

为改善碳酸盐岩中地震勘探的激发效果,针对目前爆炸激发地震波能量弱、频率高的现状,试图在震源装药不耦合系数上提出合理的改进措施。在建立震源装药爆炸载荷计算模型基础上,由编程计算得到碳酸盐岩中震源爆炸载荷和耦合能量的时间函数。分析时间函数曲线表明:该岩石条件下不耦合系数Kd=1.5时,孔壁质点压力等载荷的衰减更慢,作用时间较长,岩石介质耦合能量较大,地震激发效果最好。石灰岩条件下的现场试验与理论计算结果基本一致。地震勘探数据采集中,可借鉴本文计算方法,根据现场碳酸盐岩和炸药的波阻抗参数计算得到激发效果最佳的不耦合系数值。     

激光能量及重复频率对土壤等离子体特性的影响

利用波长为1064 nm的Nd∶YAG脉冲激光器作光源,以高分辨率、宽光谱段的中阶梯光栅光谱仪和增强型电荷耦合器件(ICCD)作为谱线分离与探测器件,测量并分析了激光能量及重复频率对土壤中铅元素激光诱导击穿光谱特性的影响。实验结果表明,随着激光脉冲能量(在25~105 mJ范围内)增加,谱线强度呈线性增加,随后谱线强度随脉冲能量(105~165 mJ)的变化呈非线性关系。信背比随激光能量的增加而增大,但激光能量超过60 mJ后基本上不变。激光重复频率为1 Hz时,谱线强度最大,而谱线强度的相对标准偏差则在重复频率为7 Hz时最小。     

自写入光波导聚合物微透镜阵列的设计与制作

利用聚合物SU-8光刻胶在激光作用下折射率会发生变化的特点,将其作为最后的光学材料,采用光刻胶热熔法和图形转移法,设计并制作了填充因子接近0.75、自写入光波导、六角排列的微透镜阵列。对阵列的表面形态、三维结构和光学性能分别进行了观察、测试与分析,发现用SU-8胶制作的微透镜阵列外观良好,边缘清晰;自写入光波导微透镜阵列的三维结构良好;波导末梢的光点分布均匀,光强一致性高。这种自写入光波导的微透镜阵列降低了透镜阵列与探测阵列精确装配的难度,而且其制作工艺流程简单、成本低廉、适合批量复制,这种阵列元件还有质量轻、体积小的特点,有很广的应用前景。     

指数掺杂透射式GaAs光电阴极表面光电压谱研究

通过求解一维稳态少数载流子扩散方程,推导了指数掺杂和均匀掺杂的透射式GaAs光电阴极表面光电压谱理论方程。利用金属有机化学气相沉积(MOCVD)外延生长了发射层厚度相同、掺杂结构不同的两款透射式阴极材料。通过表面光电压谱实验测试和理论拟合发现指数掺杂结构在发射层厚度和后界面复合速率相同的情况下能够有效提高阴极电子扩散长度,这主要由于内建电场能够促使光生电子通过扩散和电场漂移两种方式向表面运动,从而最终提升阴极的发射效率和表面光电压谱。利用能带计算公式和电子散射理论对这两种不同结构材料的表面光电压谱进行了详细分析。     

光纤气体传感系统背景噪声的滤除

在光纤气体传感系统中,为提高检测的灵敏度,需要采取措施抑制系统的各类噪声。通过设计低噪声的前置放大器和光源驱动电路可有效地降低系统的噪声;但对于因光路变化和光在传输过程中偏振态发生变化引起的背景噪声的处理一直是光纤气体传感系统测量灵敏度提高的难点。提出一种基于最小二乘拟合的背景噪声滤除算法。利用参考光栅和法布里-珀罗标准具实现对输出信号的光谱重建。在此基础上,利用气体特征吸收峰两边的输出拟合整个输出曲线。将系统的输出与拟合曲线相除,实现系统输出的归一化,有效地滤除了系统的背景噪声,避免了当传感系统背景噪声发生变化时,需要重新采集背景气的繁琐工作,为测量带来方便。     

浅谈大型原油储罐的防雷安全措施

大型原油储罐储存的介质易燃易爆,给油库管理带来极高的安全风险。雷击是油罐火灾事故的重要因素之一,分析、制定有效的防雷安全措施,将油库的安全管理风险降到最低是十分必要的。从雷电的形成及危害、雷击着火的成因、防雷的基础环节等几个方面进行详细的阐述、分析,总结多年的油库安全管理经验,从事前预案、事中处理、防雷设施本体检查管理三个角度,有重点的提出油罐日常运行管理中四个方面的具体防雷安全措施。     

纳米MnFe2O4的制备及其对高氯酸铵热分解的催化性能（英文）

Nano-MnFe2O4 particles were synthesized by co-precipitation phase inversion method and low-temperature combustion method respectively, using MnCl2, FeCl3, Mn(NO3)2, Fe(NO3)3, NaOH and C6H8O7. X-ray diffraction (XRD), transmission electron microscope (TEM), Fourier transform infrared spectroscopy (FT-IR), thermogravim-etry-differential thermal analysis (TG-DTA) and differential scanning calorimetry (DSC) were used to characterize the structure, morphology, thermal stability of MnFe2O4 and its catalytic performance to ammonium perchlorate. Results showed that single-phased and uniform spinel MnFe2O4 was obtained. The average particle size was about 30 and 20 nm. The infrared absorption peaks appeared at about 420 and 574 cm-1, and the particles were stable below 524 ℃. Using the two prepared catalysts, the higher thermal decomposition temperature of ammonium perchlorate was decreased by 77.3 and 84.9 ℃ respectively, while the apparent decomposition heat was increased by 482.5 and 574.3 J?g?1. The catalytic mechanism could be explained by the favorable electron transfer space provided by outer d orbit of transition metal ions and the high specific surface absorption effect of MnFe2O4 particles.     

Reliability Evaluation of QFN Devices Soldered Joints with Creep Model

The solder joint reliability of quad flat non-lead (QFN) package,which has become very popular over the past few years,has received intense interest.The finite element method (FEM) is essential to evaluate the reliability of QFN device.In this paper,Garofalo-Arrheninus model was implemented to simulate the deformation of QFN soldered joints.Equivalent creep strain of the soldered joints was calculated by means of finite element analyses,and was used to evaluate the reliability of QFN packages.It is found that the critical soldered joint of QFN is located the package corner while the maximum creep strain is obtained at the top interface of peripheral soldered joint.The creep strain is provided with periodicity and additivity as the thermal cycling.Nonlinear analysis of QFN package with different lead counts was presented as well,in which the phenomenon that the value of induced creep strain arise as the package size decreasing is noted.Moreover,SnPb and two lead-free solders,namely,Sn3.5Ag/Sn3.8Ag0.7Cu,were both taken into consideration.Simulated results indicate that the creep strain value of lead-free soldered joints is lower than that of SnPb soldered joints,which can be attributed to the difference of stiffness and coefficient of thermal expansion among three solders.Garofalo-Arrheninus model is used to calculate the creep strain of the QFN device for the first time in this study.The results provide an important basis for evaluating the reliability of QFN package.     

Fabrication of Fuze Micro-electro-mechanical System Safety Device

Fuze micro-electro-mechanical system(MEMS) has become a popular subject in recent years.Studies have been done for the application of MEMS-based fuze safety and arm devices.The existing researches mainly focused on reducing the cost and volume of the fuze safety device.The reduction in volume allows more payload and,thus,makes small-caliber rounds more effective and the weapon system more affordable.At present,MEMS-based fuze safety devices are fabricated mainly by using deep reactive ion ething or LIGA technology,and the fabrication process research on the fuze MEMS safety device is in the exploring stage.In this paper,a new micro fabrication method of metal-based fuze MEMS safety device is presented based on ultra violet(UV)-LIGA technology.The method consists of SU-8 thick photoresist lithography process,micro electroforming process,no back plate growing process,and SU-8 photoresist sacrificial layer process.Three kinds of double-layer moveable metal devices have been fabricated on metal substrates directly with the method.Because UV-LIGA technology and no back plate growing technology are introduced,the production cycle is shortened and the cost is reduced.The smallest dimension of the devices is 40 μm,which meets the requirement of size.To evaluate the adhesion property between electroforming deposit layer and substrate qualitatively,the impact experiments have been done on the device samples.The experimental result shows that the samples are still in good condition and workable after undergoing impact pulses with 20 kg peak and 150 μs duration and completely met the requirement of strength.The presented fabrication method provides a new option for the development of MEMS fuze and is helpful for the fabrication of similar kinds of micro devices.     

基于多视图的快速扩散制造任务关联网络构建方法研究

研究了面向复杂武器装备快速扩散制造中的子任务间关联关系构建方法,提出了扩散制造任务关联网络模型的构建方法,定义了基于结构域、功能域、工艺域和管理域的扩散制造任务多视图模型,给出了基于多视图的扩散制造任务关联关系分析原理,实现了对不同粒度的扩散制造子任务间关联关系的定性、定量的分析,最后,通过实例验证了该方法的有效性。