SiC/nc-Si多层薄膜的光致可见发光谱的紧束缚理论

用Vogl提出的sp3s*紧束缚模型来研究碳化硅/纳米硅(SiC/nc-Si)多层薄膜的能带结构与其光致发光谱的关系,并设计出SiC/nc-Si多层薄膜最佳结构为{Si}1{SiC}8,即碳化硅层的厚度是纳米硅层厚度的8倍时的超晶格结构蓝光发射的效率最高.在等离子体增强化学气相沉积系统中,通过控制进入反应室的气体种类逐层沉积含氢非晶SiCx:H(a-SiCx:H)和非晶Si:H(a-Si:H)薄膜,然后经过高温热退火处理,成功制备出了晶化纳米SiC/nc-Si(多晶SiC和纳米Si)多层薄膜.利用截面透射电子显微镜技术分析了a-SiCx:H/nc-Si:H多层薄膜的结构特性,表明制得的超晶格结构稍微偏离设计,它的结构为{Si}1{SiC}5.最后对晶化样品的光致发光谱进行研究,详细分析了各个光致发光峰的物理本质.     

SiC/nc-Si多层薄膜的光致可见发光谱的紧束缚理论

用Vogl提出的sp3s*紧束缚模型来研究碳化硅/纳米硅(SiC/nc-Si)多层薄膜的能带结构与其光致发光谱的关系,并设计出SiC/nc-Si多层薄膜最佳结构为{Si}1{SiC}8,即碳化硅层的厚度是纳米硅层厚度的8倍时的超晶格结构蓝光发射的效率最高.在等离子体增强化学气相沉积系统中,通过控制进入反应室的气体种类逐层沉积含氢非晶SiCx:H(a-SiCx:H)和非晶Si:H(a-Si:H)薄膜,然后经过高温热退火处理,成功制备出了晶化纳米SiC/nc-Si(多晶SiC和纳米Si)多层薄膜.利用截面透射电子显微镜技术分析了a-SiCx:H/nc-Si:H多层薄膜的结构特性,表明制得的超晶格结构稍微偏离设计,它的结构为{Si}1{SiC}5.最后对晶化样品的光致发光谱进行研究,详细分析了各个光致发光峰的物理本质.     

a-Si∶H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积（PECVD）系统中淀积a-Si∶H薄膜结合原位等离子体氧化的技术，制备了一系列不同a-Si∶H子层厚度的a-Si∶H/SiO2多层膜. 通过对其进行三步热处理：脱氢、快速热退火及准静态退火,使a-Si∶H/SiO2多层膜中a-Si∶H层发生非晶态到晶态的相变，获得尺寸可控的纳米硅nc-Si/SiO2多层膜. 结合Raman谱，FTIR谱和TEM测试，对退火过程中多层膜的光致发光性质进行跟踪研究，分析了a-Si∶H/SiO2多层膜在各个热处理阶段发光机理的演变，讨论了a-Si∶H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中，发光机制与微结构之间的相互联系.     

a-SiO_x∶H/a-SiO_y∶H多层薄膜微结构的退火行为

采用 PECVD技术在 P型硅衬底上制备了 a- Si Ox∶ H/a- Si Oy∶ H多层薄膜 ,利用 AES和 TEM技术研究了这种薄膜微结构的退火行为 .结果表明 :a- Si Ox∶ H/a- Si Oy∶ H多层薄膜经退火处理形成 nc- Si/Si O2 多层量子点复合膜 ,膜层具有清晰完整的结构界面 .纳米硅嵌埋颗粒呈多晶结构 ,颗粒大小随退火温度升高而增大 .在一定的实验条件下 ,样品在 650℃下退火可形成尺寸大小合适的纳米硅颗粒 .初步分析了这种多层复合膜形成的机理     

a-Si:H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积(PECVD)系统中淀积a-Si:H薄膜结合原位等离子体氧化的技术,制备了一系列不同a-Si:H子层厚度的a-Si:H/SiO2多层膜.通过对其进行三步热处理:脱氢、快速热退火及准静态退火,使a-Si:H/SiO2多层膜中a-Si:H层发生非晶态到晶态的相变,获得尺寸可控的纳米硅nc-Si/SiO2多层膜.结合Raman谱,FTIR谱和TEM测试,对退火过程中多层膜的光致发光性质进行跟踪研究,分析了a-Si:H/SiO2多层膜在各个热处理阶段发光机理的演变,讨论了a-Si:H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中,发光机制与微结构之间的相互联系.     

a-Si:H/SiO2多层膜晶化过程中的发光机理

采用在等离子体增强化学气相沉积(PECVD)系统中淀积a-Si:H薄膜结合原位等离子体氧化的技术,制备了一系列不同a-Si:H子层厚度的a-Si:H/SiO2多层膜.通过对其进行三步热处理:脱氢、快速热退火及准静态退火,使a-Si:H/SiO2多层膜中a-Si:H层发生非晶态到晶态的相变,获得尺寸可控的纳米硅nc-Si/SiO2多层膜.结合Raman谱,FTIR谱和TEM测试,对退火过程中多层膜的光致发光性质进行跟踪研究,分析了a-Si:H/SiO2多层膜在各个热处理阶段发光机理的演变,讨论了a-Si:H/SiO2多层膜晶化为nc-Si/SiO2多层膜过程中,发光机制与微结构之间的相互联系.     

氢稀释对nc-Si∶H薄膜结构和光致发光的影响

基于X射线衍射仪、喇曼散射、光致发光(PL)和傅里叶红外吸收光谱等技术,详细研究了氢稀释比对纳米晶硅(nc-Si∶H)薄膜结构和光致发光性能的影响。随着氢稀释比的增加,所沉积薄膜的纳米晶硅尺寸单调减小,而晶化率提高。键合结构分析表明,随着氢稀释比增加,nc-Si∶H薄膜中氢含量和Si—H键密度均减小。综合在不同氢稀释比下纳米晶硅尺寸变化、PL峰位移动及PL峰强度变化等特征,nc-Si∶H室温PL光谱被归因于纳米晶硅的量子限制效应。当氢稀释比由96%增大至97%时,氢的钝化作用使PL峰强度升高;当进一步增加氢稀释比至98.5%时,由于H2的生成,使氢的钝化效果显著降低,导致PL峰强度降低。     

应变硅薄膜的厚度对材料迁移率的影响

用化学气相沉积方法在SiC/Si上外延生长了应变硅薄膜.扫描电子显微镜方法显示所得样品具有明显的Si/SiC/Si三层结构,喇曼散射光谱和X射线衍射测量结果表明外延的Si薄膜存在应变.Hall效应测量证明相比于相同浓度的体Si材料应变Si薄膜具有较高的霍尔迁移率;但随着应变硅层厚度的增加,霍尔迁移率下降,这应与薄膜中应变减小和失配位错有关.     

应变硅薄膜的厚度对材料迁移率的影响

用化学气相沉积方法在SiC/Si上外延生长了应变硅薄膜.扫描电子显微镜方法显示所得样品具有明显的Si/SiC/Si三层结构,喇曼散射光谱和X射线衍射测量结果表明外延的Si薄膜存在应变.Hall效应测量证明相比于相同浓度的体Si材料应变Si薄膜具有较高的霍尔迁移率;但随着应变硅层厚度的增加,霍尔迁移率下降,这应与薄膜中应变减小和失配位错有关.     

纳米6H-SiC薄膜的等离子体化学气相沉积及其紫外发光

采用螺旋波等离子体化学气相沉积技术在Si(100)衬底上制备了具有纳米结构的碳化硅(SiC)薄膜.通过X射线衍射、傅里叶红外吸收和扫描电子显微镜等技术对所制备薄膜的结构、形貌以及键合特性进行了分析,利用光致发光技术研究了样品的发光特性.分析表明,在500℃的衬底温度和高氢气稀释条件下,所制备的纳米SiC薄膜红外吸收谱主要表现为SiC TO声子吸收,X射线衍射显示所制备的纳米SiC薄膜为6H结构.采用氙灯作为激发光源,不同氢气流量下所制备的样品在室温下呈现出峰值波长可变的紫外发光.     

纳米硅镶嵌氮化硅薄膜的制备与光致发光特性

为研究氮化硅薄膜发光材料的制备工艺及其光致发光机制,实验采用射频磁控反应溅射技术与热退火处理制备了纳米硅镶嵌氮化硅薄膜材料.利用红外光谱(IR)、X射线衍射谱(XRD)、能谱(EDS)和光致发光谱(PL),对不同工艺条件下薄膜样品的成分、结构和发光特性进行研究,发现在制备的富硅氮化硅薄膜材料中形成了纳米硅颗粒,并计算出其平均尺寸.在510 nm光激发下,观察到纳米硅发光峰,对样品发光机制进行了讨论,认为其较强的发光起因于缺陷态和纳米硅发光.     

热丝化学气相沉积法低温制备纳米晶态碳化硅薄膜

采用热丝化学气相沉积(HFCVD)技术以甲烷(CH4)和硅烷(SiH4)作为源反应气体在Si(111)衬底上合成了纳米晶态SiC薄膜。通过X射线衍射(XRD)、扫描电镜(SEM)、高分辨透射电镜(HRTEM)以及光致发光(PL)检测技术对薄膜的晶体结构、表面形貌和PL特性进行了分析和表征。结果表明，在较低的衬底温度下所沉积的薄膜是由镶嵌于非晶SiC网络中的晶态纳米SiC构成。纳米晶粒平均尺寸约为6nm。室温下用HeCr激光激发样品，观到薄膜发出波长位于400～550nm范围内可见光辐射。     

SiC/SiO_2镶嵌结构薄膜光致发光特性研究

采用 SiC/SiO_2复合靶,用射频磁控共溅射技术和高温退火的方法制备了 SiC/SiO_2纳米镶嵌结构复合薄膜,并应用傅里叶红外吸收(FTIR),X 射线衍射(XRD),扫描电镜(SEM)和光致发光(PL)实验分析了薄膜的结构、表面形貌以及光致发光性能。结果表明,样品经高温退火后在 SiO_2基质中有 SiC 纳米颗粒形成。以 280 nm 波长光激发样品薄膜表面,显示出较强的 365 nm 的紫外光发射以及 458 nm 和 490 nm 处的蓝光发射,其发光强度随退火温度从 800℃升高至 1 050℃而增强。其发光归结为薄膜中与 Si-O 相关的缺陷形成的发光中心。     

Cr掺杂SiC薄膜的制备与光致发光特性

利用高纯SiC烧结靶上粘贴金属Cr片的复合靶用双离子束溅射沉积方法,在Si和KBr单晶衬底上制备了掺杂SiC薄膜。用傅里叶变换红外光谱分析法(FTIR)和喇曼光谱仪对制得的薄膜样品进行了表征,用荧光分光光度计对样品的光致发光(PL)特性进行了研究。通过FTIR分析得到对应于Si―C键的峰位没有发生明显改变而峰强随着Cr掺杂量的增加而降低,喇曼光谱分析发现Cr掺杂导致Si和C团簇的形成,说明Cr的掺杂阻碍了Si―C键的结合。将不同Cr掺杂浓度的SiC薄膜经1000℃退火处理,发现位于413、451和469nm的三个发光峰的位置基本不变,但强度有明显改变。     

Energy-Band-Engineered Unified-RAM (URAM) Cell on Buried $hbox{Si}_{1 - y}hbox{C}_{y}$ Substrate for Multifunctioning Flash Memory and 1T-DRAM

A band-offset-based unified-RAM (URAM) cell fabricated on a Si/$ hbox{Si}_{1 - y}hbox{C}_{y}$ substrate is presented for the fusion of a nonvolatile memory (NVM) and a capacitorless 1T-DRAM. An oxide/nitride/oxide (O/N/O) gate dielectric and a floating-body are combined in a FinFET structure to perform URAM operation in a single transistor. The O/N/O layer is utilized as a charge trap layer for NVM, and the floating-body is used as an excess hole storage node for capacitorless 1T-DRAM. The introduction of a pseudomorphic SiC-based heteroepitaxial layer into the Si substrate provides band offset in a valence band. The FinFET fabricated on the energy-band-engineered $hbox{Si}_{1 - y}hbox{C}_{y}$ substrate allows hole accumulation in the channel for 1T-DRAM. The band-engineered URAM yields a cost-effective process that is compatible with a conventional body-tied FinFET SONOS. The fabricated URAM shows highly reliable NVM and high-speed 1T-DRAM operations in a single memory cell.      

nc-SiC/SiO_2镶嵌薄膜材料的制备、结构和发光特性

采用二氧化硅/碳化硅复合靶,用射频磁控共溅射技术和后高温退火的方法在Si(111)衬底上制备了碳化硅纳米颗粒/二氧化硅基质(nc-SiC/SiO2)镶嵌结构薄膜材料。用X射线衍射(XRD),傅里叶红外吸收(FTIR),扫描电子显微镜(SEM)和光致发光(PL)实验分析了薄膜的微结构以及光致发光特性。实验结果表明,样品薄膜经高温退火后,部分无定形SiC发生晶化,形成β-SiC纳米颗粒而较均匀地镶嵌在SiO2基质中。以280nm波长光激发薄膜表面,有较强的365nm的紫外光发射以及458nm和490nm处的蓝光发射,其发光强度随退火温度的升高显著增强,发光归结为薄膜中与Si—O相关的缺陷形成的发光中心。     

Photoluminescence origin of nanocrystalline SiC films

The nanocrystalline SiC films were prepared on Si then annealed at 800℃ and 1 000℃ for 30 minutes （111） substrates by rf magnetron sputtering and in a vacuum annealing system. The crystal structure and crystallization of as-annealed SiC films were determined by the Fourier transform infrared （FIR） absorption spectra and the X-ray diffraction （XRD） analysis. Measurement of photoluminescence （PL） of the nanocrystalline SiC （nc-SiC） films shows that the blue light with 473 nm and 477 nm wavelengths emitted at room temperature and that the PL peak shifts to shorter wavelength side and the PL intensity becomes stronger as the annealing temperature decreases. The time-resolved spectrum of the PL at 477 nm exhibits a bi-exponential decay process with lifetimes of 600 ps and 5 ns and a characteristic of the direct band gap. The strong blue light emission with short PL lifetimes suggests that the quantum confinement effect of the SiC nanocrystals resulted in the radiative recombination of the direct optical transitions.     

Low-Temperature Materials and Thin Film Transistors for Flexible Electronics

This paper addresses the low-temperature deposition processes and electronic properties of silicon based thin film semiconductors and dielectrics to enable the fabrication of mechanically flexible electronic devices on plastic substrates. Device quality amorphous hydrogenated silicon (a-Si:H), nanocrystalline silicon (nc-Si), and amorphous silicon nitride (a-SiN/sub x/) films and thin film transistors (TFTs) were made using existing industrial plasma deposition equipment at the process temperatures as low as 75/spl deg/C and 120/spl deg/C. The a-Si:H TFTs fabricated at 120/spl deg/C demonstrate performance similar to their high-temperature counterparts, including the field effect mobility (/spl mu//sub FE/) of 0.8 cm/sup 2/V/sup -1/s/sup -1/, the threshold voltage (V/sub T/) of 4.5 V, and the subthreshold slope of 0.5 V/dec, and can be used in active matrix (AM) displays including organic light emitting diode (OLED) displays. The a-Si:H TFTs fabricated at 75/spl deg/C exhibit /spl mu//sub FE/ of 0.6 cm/sup 2/V/sup -1/s/sup -1/, and V/sub T/ of 4 V. It is shown that further improvement in TFT performance can be achieved by using n/sup +/ nc-Si contact layers and plasma treatments of the interface between the gate dielectric and the channel layer. The results demonstrate that with appropriate process optimization, the large area thin film Si technology suits well the fabrication of electronic devices on low-cost plastic substrates.     

Enhancing the output power of GaN-based LEDs grown on wet-etched patterned sapphire substrates

GaN-based light-emitting diodes (LEDs) with emitting wavelength of 450 nm were grown on patterned sapphire substrates (PSSs) fabricated by chemical wet etching. The crystallography-etched facet was {1-102} R-plane with a 57/spl deg/ against {0001} C-axis and had superior capability for enhancing light extraction efficiency. The light output power of the PSS LED was 1.15 times higher than that of the conventional LED at an injection current of 20 mA. The output power and external quantum efficiency were estimated to be 9 mW and 16.4%, respectively. The improvement was attributed not only to geometrical shapes of {1-102} crystallography-etched facets that efficiently scatter the guided light to find escape cones, but also to dislocation density reduction by adopting the PSS growth scheme.     

Investigation of luminescence from SiC nano-granule films on porous glass substrate

SiC granule films were fabricated onto porous glass substrate by RF-magnetron sputtering. Photoluminescence （PL） measurements show that there are light emissions at three different wavelengths. Ultraviolet emission peaked at 360 nm originated from the band-band transmission of SiC nanoparticles with relatively small size. The 370 nm light emission was due to the luminescence of the nano-skeletons of porous glass that was formed during the etching of the glass substrate. The blue emission at about 460 nm was associated with the recombination of the excited electron and O-deficient defects appeared at the interface between SiC nanoparticles and the porous glass. Furthermore, the optimal PL performance was obtained when SiC deposited time was I h and the glass substrate was etched for 20 min in the annealing sample （450 ℃）.