MEMS器件中多层金属薄膜溅射工艺研究

溅射工艺是制作微机电系统(MEMS)器件金属薄膜的主要方式,金属薄膜作为MEMS器件中的掩模层和功能层,要求薄膜应力小,粘附性、均匀性和可焊性好.通过对常用金属薄膜材料特性、多层金属薄膜溅射工艺和质量评价方法的研究得出了优化工艺的的方法,提高了多层金属薄膜的质量.     

微机械薄膜应力的在线测试结构

微机械薄膜应力对MEMS器件有较大的影响，因此应力测量对于工艺监控和MEMS器件设计是必须的。介绍了微机械薄膜应力的在线测试结构与方法，详细分析了各种方法的特点。对于MEMS薄膜应力测试结构设计有一定的参考价值。     

基于永磁薄膜的MEMS磁传感器设计与制作

提出了一种基于永磁薄膜的新型MEMS磁传感器,磁传感器由MEMS扭摆、CoNiMnP永磁薄膜和差分检测电容等部分组成。分析了磁传感器的磁敏感原理和电容检测原理,提出了器件的结构参数并对器件进行了模态仿真。利用MEMS加工技术成功制作了MEMS磁传感器样品,并进行了测试。测试结果表明:得到的MEMS磁传感器的电容灵敏度可达到27.7 fF/mT,且具有良好的线性度。根据现有的微小电容检测技术,传感器的磁场分辨率可达到36 nT。     

氮化硅薄膜力学性能的研究及其在射频MEMS开关中的应用

氮化硅薄膜具有致密的结构、高强度和良好的耐磨性能,可用于MEMS器件中作为结构部件.本文采用PECVD法制备氮化硅薄膜,对氮化硅薄膜的杨氏模量和硬度进行了测试,并分析了沉积温度、反应气体流量比对薄膜杨氏模量和硬度的影响.应用氮化硅薄膜作为悬梁,制作了射频MEMS开关.     

用于器件级真空封装的MEMS加速度传感器的设计与制作

设计了一种可用于器件级真空封装的三明治电容式MEMS加速度传感器.该传感器被设计为四层硅结构,其中上下两层为固定电极,中间两层为硅-硅直接键合的双面梁-质量块结构的可动电极.利用自停止腐蚀工艺在中间质量块键合层上腐蚀出2个深入腔内的V型抽气槽,使得MEMS器件在后续的封装中能够实现内部真空.为防止V型抽气槽在划片中被水或硅渣堵塞,采用双面划片工艺.划片后,器件的总尺寸为6.8mm ×5.6mm ×1.72 mm,其中,敏感质量块尺寸为3.2mm×3.2mm ×0.86mm,检测电容间隙2.1 μm.对器件级真空封装后的MEMS加速度传感器进行了初步测试,结果表明:制作的传感器的谐振频率为861 Hz,品质因数Q为76,灵敏度为1.53 V/gn,C-V特性正常,氦气细漏＜1×10-9 atm-cm3/s,粗漏无气泡.     

多晶硅双端固支梁高周循环下疲劳特性的分析

多晶硅固支梁是MEMS器件中较常见的可动部件,通过静电激励的方式对其进行疲劳振动加载;所用结构为面外运动结构,为了测试样品的加速疲劳特性,通过在固支梁面内引入缺陷的方式来增大应力水平值;器件在经历了1.72×1011次循环之后,微梁的谐振频率、振动幅度发生了较大偏移,其谐振频率的偏移量达到14.531 kHz,器件性能发生了严重的退化.研究结果表明,利用谐振频率的改变来表征材料性能的退化是一种准确、可行的方法,同时本文进一步分析指出,器件上引入凹槽缺陷的方法确实可起到加速疲劳的作用;可利用此方法制作不同应力水平幅度的结构进行振动载荷疲劳加载实验,从而得到固支梁结构疲劳加速因子.     

一种结合温差式和风速计式的新结构MEMS热式流量计

在器件结构上结合了温差式和风速计式两种检测原理,设计并制造了一种新型结构的MEMS热式流量计.在对温差式流量计的灵敏度、量程等特性进行了有限元仿真的基础上,优化设计了器件结构.同时,提出了一种利用Matlab/Simu-link时域仿真实现热源控制电路设计的方法.采用MEMS微加工技术研制了新型结构的热式流量计.测试结果表明该新设计比传统MEMS热式流量计灵敏度提高近4倍.     

非焊接式纳米线机械性能测试器件结构设计

纳米线机械性能测试中,常见MEMS器件大都采用焊接或沉积方式固定纳米线,限制了器件寿命和测试重复性.针对焊接方式测试的不足,设计了一种非焊接式纳米线机械性能测试MEMS器件.在静电叉指和支撑梁结构的基础上,设计了利用梁刚度差进行夹紧和拉伸操作的结构,其中设计了V型结构以避免焊接纳米线.利用有限元仿真软件进行了仿真验证,确定了最优结构尺寸,V型缝隙夹角小于22.5°时能满足纳米线机械性能测试要求,所设计器件提高了测试器件的重复利用率.     

“中国微米纳米”一种低温制备的高灵敏度MEMS电容传声器

MEMS传声器是将声音信号转换成电信号的传感器.目前,MEMS传声器的研究主要涉及 MEMS电容传声器和MEMS压电传声器压阻传感器2种.与其它类型的MEMS传声器相比,MEMS电容传声器具有高灵敏度、高信噪比、频率响应平坦、低温度系数等突出的优点,被广泛使用在便携式设备、多媒体系统、助听器、信息采集等方面.设计和制备了一种高灵敏度的MEMS电容传声器,而且制备器件的工艺温度最高为300 ℃,可以兼容IC工艺.在本文,利用牺牲层的方法实现圆形振动薄膜,避免了方形薄膜存在的应力集中问题,并克服了干法制备圆形薄膜成本高的问题.基于聚酰亚胺材料,优化成膜工艺参数,实现低应力的圆形振动薄膜.通过设计防粘连结构,避免器件释放干燥过程中出现的薄膜粘连问题.根据振动膜应力为5 MPa,半径为2.5 mm,厚度为1 μm,电极半径为380 μm,间隙为1 μm的设计参数进行理论计算,该器件的电容在1 Pa 声压下的变化量为千分之一.与市场流通的MEMS传声器相比,高出约一个数量级,可被用于远场拾音,从信噪比极低的环境中拾取关键的声音信息.     

高灵敏压力传感器过载保护结构设计

采用微机电系统(MEMS)牺牲层技术制作的压力传感器具有芯片尺寸小,灵敏度高的优势,但同时也带来了提高过载能力的难题.为此,利用有限元法,对牺牲层结构压阻式压力传感器弹性膜片的应力分布进行了静态线性分析和非线性接触分析.通过这两种分析方法的结合,准确的模拟出过载状态下传感器的应力分布.在此基础上给出了压力传感器的一种结...     

Thermally actuated microprobes for a new wafer probe card

A new type of MEMS microprobe was designed and fabricated which can be used for a nest generation wafer probe card. A prototype MEMS probe card consisting of an array of microprobes individually actuated by bimorph heating to make contact with the test chip was also fabricated. This probe card is called the CHIPP (Conformable, HIgh-Pin count, Programmable) card and can be designed to contact up to 800 I/O pads along the perimeter of a 1-cm² chip with a microprobe repeat distance of approximately 50 μm. Microprobes for a prototype CHIPP probe card have been fabricated with a variety of cantilever structures including Al-SiO₂, W-SiO₂ and Al-Si bimorphs, and with the resistive heater placed either inside or on the surface of the cantilever. Ohmic contacts between tips and bond pads were tested with contact resistance as low as 250 mΩ. The deflection efficiency varies from 5.23-9.6 μm/mW for cantilever lengths from 300-500 μm. The maximum reversible deflection is in the range of 280 μm. The measured resonant frequency is 8.16 kHz for a 50×500 μm device and 19.4 kHz for a 40×300 μm device. Heat loss for devices operating in air was found to be substantially higher than for vacuum operation with a heat loss ratio of about 2/1 for a heater inside the structure, and 4.25/1 for a structure with the heater as an outer layer of the cantilever     

密码卡虚拟化技术研究与实现

密码卡是一种密码设备,位于网络安全平台的物理层,通过各种密码算法为上层应用系统提供加解密、数字签名等密码运算服务。从云计算安全方面考虑,密码卡需要具备高速运算的特点,并且 需要通过虚拟化技术实现高并发性。密码卡作为输入/输出(Input/Output,I/O)设备面临的挑战是,如何在虚拟化的情况下获得良好的 I/O 性能并有效地共享 I/O 设备。目前 I/O 虚拟化技术的发展相对滞后,影响了虚拟机的整体性能。基于此,该文提出了 3 种密码卡虚拟化设计方案,实现了基于现场可编程门阵列(FPGA)的软件虚拟化密码卡和基于单根 I/O 虚拟化技术的硬件虚拟化密码卡。在实际应用中,虚拟化密码卡通过高速外设部件互连标准(PCI-E)总线内置于服务器中,具备高性能并且通过软件调度 可以被多用户共享。结果表明,该技术可应用于金融、电信等信息安全领域,具备广阔的应用前景。     

A MEMS guide plate for a high temperature testing of a wafer level packaged die wafer

This paper describes the design and fabrication of a MEMS guide plate, which was used for a vertical probe card to test a wafer level packaged die wafer. The size of the fabricated MEMS guide plate was 10.6 × 10.6 cm. The MEMS guide plate consisted of 8,192 holes to insert pogo pins, and four holes for bolting between the guide plate and the housing. To insert pogo pins easily, an inclined plane was defined at the back of each hole. Pitch and diameter of the hole were 650 and 260 μm, respectively. In order to define inserting holes and inclined planes at an exact position, silicon MEMS technology was used such as anisotropic etching, deep reactive etching and more. Silicon was used as the material of the guide plate to reduce alignment mismatch between the pogo pins and solder bumps during a high temperature testing. A combined probe card with the fabricated MEMS guide plate showed good x–y alignment and planarity errors within ±9 and ±10 μm at room temperature, respectively. In addition, x–y alignment and planarity are ±20 and ±16 μm at 125°C, respectively. The proposed MEMS guide plate can be applied to a vertical probe card for burn-in testing of a wafer level packaged die wafer because the thermal expansion coefficient of the MEMS guide plate and die wafer is same.     

Effect of seed layer stress on the fabrication of monolithic MEMS microstructure

This paper reported the effect of seed layer stress on the fabrication of monolithic polymer-metal MEMS microstructure and what is a better material for the seed layer. The monolithic microstructure is gaining more and more attentions in MEMS application, especially in three-dimensional microstructure and inkjet printhead. The polymer–metal MEMS microstructure can be fabricated by combining the lithography and electroforming technologies. It is an integrated technology by batch process at low cost. The metal seed layer with large stress will lead to cracks and failure during the process integration. Several metal materials and thicknesses were studied to find a better candidate as the seed layer for the monolithic MEMS microstructure. The relationship between the monolithic MEMS structure and seed layer selection is also discussed. The lower residual stress of seed layer will result in a better surface condition for the followed integration process. The pure Ti metal and two-layer Ti/Au composite are the better seed layer materials in this study for the followed electroforming process of the monolithic polymer-metal MEMS microstructure.     

基于自适应滤波算法的有线网卡指纹提取方法

有线设备接入认证是保障有线以太网安全的重要组成部分,其中MAC地址认证和设备数字证书认证是目前的主流身份认证方式,然而前者存在MAC地址易被篡改和伪造,后者存在系统复杂、使用不便等问题。基于设备指纹的物理层安全技术是解决这一问题的有效途径,并已在无线网络中得到广泛应用,但有线网络目前研究颇少。设备指纹的提取是物理层安全技术的一个重要环节,有线网络已有研究主要从10M有线网卡信号中提取指纹。本文提出了一种基于最小均方误差自适应滤波算法(LMS算法)从100M有线网卡信号中提取指纹的方法,该方法提取的网卡指纹产生自网卡及所在设备本身的物理特性,不可克隆,无法被篡改,而且指纹可直接通过分析网卡输出信号而得,简单方便。本文设计了一套基于LMS算法的网卡指纹提取系统,通过大量实验估算了合适的诸如收敛因子、滤波器阶数、数据长度等算法参数,并对提取的指纹进行了有效性验证。经过实验验证,使用本文方法提取的网卡指纹可有效识别出不同品牌和相同品牌不同类型的以太网网卡,在使用线性判别和集成子空间判别分类算法时,针对50块网卡的识别率可分别达到97.3%、98.5以上。     

Development of a simple microsystems membrane probe card

Presented here are details of the development of a novel membrane integrated circuit (IC) probe card structure based on microsystems technology. The device design allows probing of both solder bumps and pads. A self-limiting sensor was integrated to prolong device lifetime. Comparison with and discussion of the use of modelling is made. Possible enhancements to the probing structure are discussed to improve alignment and measurements. Also shown is data using our microsystems probe card to access a simple IC device. Our device has a contact resistance of less than 0.5 Ω for a force of 0.004 N. A method to implement our probing structure for commercial application and the potential developments which can be made to improve its ease of use are then discussed.     

Development of a simple microsystems membrane probe card

Presented here are details of the development of a novel membrane integrated circuit (IC) probe card structure based on microsystems technology. The device design allows probing of both solder bumps and pads. A self-limiting sensor was integrated to prolong device lifetime. Comparison with and discussion of the use of modelling is made. Possible enhancements to the probing structure are discussed to improve alignment and measurements. Also shown is data using our microsystems probe card to access a simple IC device. Our device has a contact resistance of less than 0.5 Ω for a force of 0.004 N. A method to implement our probing structure for commercial application and the potential developments which can be made to improve its ease of use are then discussed.

     

悬臂梁接触式RF MEMS开关的关键工艺研究

采用厚度为2μm的Au制作成共平面波导（CPW）、聚酰亚胺作为牺牲层、PECVD法淀积Si3N4薄膜作为悬臂梁,制作成悬臂梁接触式RF MEMS开关。着重对开关的关键工艺-CPV的Au剥离工艺和悬臂梁制作工艺进行研究,讨论了工艺中存在的问题及其解决方法。通过实验获得较佳的工艺参数,并制作出驱动电压为12-20V的悬臂梁接触式RF MEMS开关。     

竞技二打一游戏中同等牌力的研究

全国竞技二打一扑克锦标赛是国家体育总局棋牌运动管理中心推出的新兴项目，比赛采用复式赛赛制，然而这种赛制存在无法杜绝线上比赛作弊的问题，为此提出用同等牌力赛制来代替复式赛制进行比赛的设想。本文主要针对如何判定和选取具有同等牌力的初始手牌进行研究，提出用等级难度评估指标来计算初始手牌的难度，初始手牌难度相近的牌认定为同等牌力，并给出了同等牌力的选取方法；为保证一副牌所得等级难度评估指标的可靠性，提出用多个不同水平的“二打一AI程序”来代替真人打牌产生牌谱的方法。实验证明了同等牌力生成方法的有效性，本文提出的同等牌力方法应用于比赛是可行的。     

A contact-enhanced MEMS inertial switch with electrostatic force assistance and multi-step pulling action for prolonging contact time

Microsystem Technologies - A MEMS inertial switch with electrostatic force assistance and multi-step pulling action has been designed, fabricated and tested. The new design can help the electrodes...