基于倾斜A1N薄膜的体声波质量传感器的制备及性能分析

提出通过改变溅射气压获得倾斜于C轴的A1N薄膜的制备方法,探讨了倾斜A1N薄膜的生长机理.以3对交替沉积的Ti-MD金属层为布拉格声学反射层,采用MEMS工艺制备了基于倾斜A1N薄膜的、以剪切模式振动的体声波液体传感器,并对器件的S11参数进行测试分析,得到传感器的中心频率为0.78GHz,表明该器件在生物液相检测领域具有一定的应用前景.     

“中国微米纳米”一种低温制备的高灵敏度MEMS电容传声器

MEMS传声器是将声音信号转换成电信号的传感器.目前,MEMS传声器的研究主要涉及 MEMS电容传声器和MEMS压电传声器压阻传感器2种.与其它类型的MEMS传声器相比,MEMS电容传声器具有高灵敏度、高信噪比、频率响应平坦、低温度系数等突出的优点,被广泛使用在便携式设备、多媒体系统、助听器、信息采集等方面.设计和制备了一种高灵敏度的MEMS电容传声器,而且制备器件的工艺温度最高为300 ℃,可以兼容IC工艺.在本文,利用牺牲层的方法实现圆形振动薄膜,避免了方形薄膜存在的应力集中问题,并克服了干法制备圆形薄膜成本高的问题.基于聚酰亚胺材料,优化成膜工艺参数,实现低应力的圆形振动薄膜.通过设计防粘连结构,避免器件释放干燥过程中出现的薄膜粘连问题.根据振动膜应力为5 MPa,半径为2.5 mm,厚度为1 μm,电极半径为380 μm,间隙为1 μm的设计参数进行理论计算,该器件的电容在1 Pa 声压下的变化量为千分之一.与市场流通的MEMS传声器相比,高出约一个数量级,可被用于远场拾音,从信噪比极低的环境中拾取关键的声音信息.     

微机械薄膜应力的在线测试结构

微机械薄膜应力对MEMS器件有较大的影响，因此应力测量对于工艺监控和MEMS器件设计是必须的。介绍了微机械薄膜应力的在线测试结构与方法，详细分析了各种方法的特点。对于MEMS薄膜应力测试结构设计有一定的参考价值。     

基于倾斜AlN薄膜的体声波质量传感器的制备及性能分析

提出通过改变溅射气压获得倾斜于C轴的AlN薄膜的制备方法,探讨了倾斜AlN薄膜的生长机理。以3对交替沉积的Ti—Mo金属层为布拉格声学反射层,采用MEMS工艺制备了基于倾斜AlN薄膜的、以剪切模式振动的体声波液体传感器,并对器件的S11参数进行测试分析,得到传感器的中心频率为0.8GHz,表明该器件在生物液相检测领域具有一定的应用前景。     

MEMS结构中碳纳米管的电泳沉积及其场发射特性研究

利用电泳沉积的方法在MEMS结构特定位置上组装碳纳米管薄膜,以此作为发射体研制基于碳纳米管场发射的传感器,并对其场发射进行了测试和分析.电镜观测与场发射实验结果表明,利用电泳沉积方法可以只在MEMS结构的特定位置沉积碳纳米管薄膜,对于4μm的发射间隙、该薄膜的场发射开启电压约为3.6V～4V,发射电压20V时的发射电流可至28μA.这种“post-MEMS“的碳纳米管薄膜组装方法具有工艺简单的特点,同时避免了碳纳米管生长对MEMS工艺环境以及器件的污染、破坏,实现了纳米材料组装与MEMS工艺的兼容.     

CIGS太阳能电池中薄膜材料电阻率的研究

研究了减小CIGS太阳能电池中Mo,CIGS,n-ZnO三层薄膜电阻率的溅射工艺方法,以达到减小电池串联电阻的目的.改变工艺参数制备不同样品并对其进行测试分析,得到了溅射气压、村底温度、退火工艺对电阻率和薄膜微观形貌的影响.证明了采用双层溅射法制备的Mo、低气压、衬底加热、溅射后退火得到的CIGS以及3～5 Pa下制备...     

Si基Cu/NiFe薄膜的生长及其粘附特性研究

微机械(MEMS)工艺和集成电路(IC)工艺中,在硅(Si)片上电铸高深宽比坡莫(NiFe)合金材料常出现脱落现象.提出了一种电铸NiFe合金材料的新方法,这种方法制作的合金薄膜厚度达200 μm时不脱落.此方法即对等离子刻蚀后的硅片溅射种子层铜(Cu),然后对种子层进行电镀,当其厚度达到约15 μm时,再进行NiFe合金的电铸.本文用扫描电镜、x射线衍射仪和剥离实验研究了薄膜粘附特性.研究结果表明当对种子层电镀后,随着Cu种子层厚度的增加,Cu/NiFe薄膜与基体的粘附强度增加,而薄膜的残余应力降低;同时Cu膜表面粗糙度增加,也增加了NiFe膜与Cu膜的粘附强度.     

基于PI衬底的柔性MEMS电容式触觉力传感器设计与制作

论述了一种可应用于机器人或医学修补技术的触觉传感器及其在旋涂的柔性聚酰亚胺衬底的新制作方法.该传感器是由多层无机和有机薄膜组成的柔性薄膜结构.结合传感器结构特点及各结构层材料的加工性能,进行工艺优化整合.尤其首次在载体硅片与PI衬底之间引进PDMS分离层,使得柔性器件的分离工艺大大简化.最后得到一种简单、低廉且与常规MEMS技术兼容的工艺.所制的传感器结构轻薄,可挠性好,且能贴附在任意形状的物体表面同时实现法向力和切向力的测量.     

微机械薄膜热膨胀系数的测试结构

在微电子机械系统(MEMS)领域,薄膜的热膨胀系数对于微电子器件、MEMS器件,尤其是微热执行器的设计是一个十分重要的参数.本文详细介绍和分析了薄膜热膨胀系数的几种测试结构,对于微机械薄膜热膨胀系数在线测试结构的设计有一定的参考价值.     

高温薄膜传感器制备与性能研究

利用微机电系统（MEMS）工艺在 Al2 O3基片上制备了 Pt—PtRh 薄膜热电偶,其工作温度最高可达到1300℃,最大输出电势达14.8 mV。薄膜热电偶的电势—温度曲线与标准热电偶的曲线基本重合,同时研究了不同粘结层对薄膜微结构、器件寿命的影响。实验结果表明：以 Ta 为粘结层时薄膜传感器的寿命最长,在1300℃下可达到14 h。     

一种MEMS薄膜材料的力学性能测试方法

介绍了一种用于MEMS薄膜材料力学特性测试的单轴拉伸试验方法。其特点是微小试件两端固定,且与加载机构集成在基片上,从而可减少操作工作量,提高对准精度。整个机构以微细加工方法制成,硅类试件以干法蚀刻成型,金属类试件以电镀方法成型,其余加载机构以湿法刻蚀制成。试验表明:使用此机构可以简单且高精度地对薄膜试件进行拉伸试验,获得多项力学性能参数,从而为MEMS器件设计和分析提供可靠的理论基础。     

A study on controllable aluminium doped zinc oxide patterning by chemical etching for MEMS application

This present work reports on the study of controllable aluminium doped zinc oxide (AZO) patterning by chemical etching for MEMS application. The AZO thin film was prepared by RF magnetron sputtering as it is capable of producing uniform thin film at high deposition rates. X-Ray diffraction (XRD) and atomic force microscopy (AFM) characterization were done to characterize AZO thin film. The sputtered AZO thin film shows c-axis (002) orientation, low surface roughness and high crystalline quality. To pattern AZO thin film for MEMS application, wet etching was chosen due to its ease of processing with few controlling parameters. Four etching solutions were used namely: 10 % Nitric acid, 10 % Phosphoric acid, 10 % Acetic acid and Molybdenum etch solutions. For the first time, chemical etching using Molybdenum etch that consist of a mixture of CH₃COOH, HNO₃ and H₃PO₄ was characterized and reported. The effect of these acidic solutions on the undercut etching, vertical and lateral etch rate were studied. The etched AZO were characterized by scanning electron microscopy (SEM) and stylus profilometer. The investigations showed that the Molybdenum etch has the lowest undercut etching of 7.11 µm, and is highly effective in terms of lateral and vertical etching with an etch ratio of 1.30. Successful fine patterning of AZO thin films was demonstrated at device level on a surface acoustic wave resonator fabricated in 0.35 μm CMOS technology. The AZO thin film acts as the piezoelectric thin film for acoustic wave generation. Patterning of the AZO thin film is necessary for access to measurement probe pads. The working acoustic resonator showed resonance peak at 1.044 GHz at 45.28 dB insertion loss indicating that the proposed Molybdenum etch method does not adversely affect the device’s operating characteristics.

     

Integration of two degree-of-freedom magnetostrictive actuation and piezoresistive detection: application to a two-dimensional optical scanner

A novel two-dimensional (2-D) optical-scanner device is presented. This device incorporates a highly magnetostrictive thin film with anisotropic properties, so that it can produce 2-D-actuation corresponding to bending and torsion vibrations. The magnetostrictive material is a TbFe-CoFe multilayer film, which has optimized properties for micro-actuators operating at low excitation magnetic fields. The new scanner also integrates an original 2-D piezoresistive detector realized in an easy fabrication process using integrated circuit (IC)-compatible technology. The detectors are able to selectively measure bending and torsional vibrations. This new device enables the synchronization of actuation and sensing for 2-D position control.     

一种用于测试坡莫合金薄膜机械性能的拉伸模型

坡莫合金(Ni80Fe20)薄膜是微机电系统常用的磁性材料之一.介绍了一种用于测试其机械性能的单轴拉伸试验模型.此模型的特点是微小试件两端固定、且与加载机构集成在基片上,从而可减少操作工作量、提高对准精度.整个机构以微细加工方法制成:坡莫合金拉伸试件以光刻和电镀技术成型,其余的加载机构以湿法蚀刻制成.实验表明:使用此机构可以简单且高精度地对薄膜试件进行拉伸试验,获得多项力学性能参数,从而为MEMS器件设计和分析提供可靠的理论基础.     

Direct comparison of stylus and resonant methods for determining Young's modulus of single and multilayer MEMS cantilevers

As microelectromechanical systems (MEMS) become more complex and is produced in even greater numbers it becomes increasingly important to have a full understanding of the mechanical properties of the commonly used MEMS materials. One of the most important properties for MEMS is the Young's modulus. This work describes the direct comparison of two methods often used for measuring the Young's modulus of thin film materials using micro-cantilever test structures: a load-deflection method and a resonant frequency method. The comparison was carried out for a range of materials, different cantilever geometries as well as for single and multilayer materials. It was found that both methods produce results that agree with each other and also agree with the values most often given in the literature.     

基于MEMS的航天器表面新型测温传感器设计与实现

鉴于微机械电子系统（Micro-Electro-Mechanical-Systems,MEMS）技术及其在航空航天用传感器设计中的优势,本文根据航天器表面测温的需要,设计了一款新型表面瞬态测温热电偶传感器,重点研究了其线条和热结点图形制作工艺及其优化过程。通过物理试验验证,该型薄膜热电偶比普通热电偶响应时间较短,相对误差较小,满足返回式航天器表面高温的瞬态测温需求。     

基于永磁薄膜的MEMS磁传感器设计与制作

提出了一种基于永磁薄膜的新型MEMS磁传感器,磁传感器由MEMS扭摆、CoNiMnP永磁薄膜和差分检测电容等部分组成。分析了磁传感器的磁敏感原理和电容检测原理,提出了器件的结构参数并对器件进行了模态仿真。利用MEMS加工技术成功制作了MEMS磁传感器样品,并进行了测试。测试结果表明:得到的MEMS磁传感器的电容灵敏度可达到27.7 fF/mT,且具有良好的线性度。根据现有的微小电容检测技术,传感器的磁场分辨率可达到36 nT。     

The SOI DAWN process for three-dimensional silicon micromachining and its applications

A DRIE assisted wet anisotropic bulk micromachining (DAWN) process is demonstrated to fabricate various three-dimensional MEMS devices on a silicon-on-insulator (SOI) wafer. This SOI DAWN process can realize thin film structures, reinforced (thin film) structures, and thick structures with totally different mechanical characteristics. Various passive and active mechanical components, including flexible springs, rigid structures, and actuators, have been fabricated using the SOI DAWN process and have been further integrated to create MEMS devices which are flexible as well as movable in both in-plane and out-of-plane directions. This SOI DAWN process has been successfully applied to produce various multi-DOF devices made of single crystal silicon (SCS).