一种用于MB-OFDM 超宽带的低杂散快速跳频的频率综合器

本文设计了一种应用于超宽带第一频率组的频率综合器。该频率综合器采用锁相环和单边带混频器,将4224MHz分别与±264MHz和+792MHz混频来产生第一频率组的三个中心频率。并且设计了一个新颖的多模式正交单边带混频器,它集合了选频与混频的功能,将线性度提高并且降低了功耗。芯片通过Jazz 0.18-μm RF CMOS工艺流片,测试结果显示其输出频谱干净,参考时钟杂散只有-69dBc,最大的杂散是LO泄漏为-32dBc。它的相位噪声为-110dBc/Hz@1MHz,并且积分相位噪声只有1.86°。当频率发生跳变时,跳频时间约为1.8ns。整个芯片工作在1.8V电源电压,消耗30mA电流。     

一种应用于多频接收机的宽带频率综合器

采用0.18µm 1P6M CMOS工艺实现了一种应用于多频接收机的整数分频频率综合器。该频率综合器为接收机提供频率分别为2.57GHz, 2.52GHz, 2.4GHz 和 2.25GHz的本振信号。为了覆盖要求的频点,其宽带压控振荡器同时采用了可变电容阵列和可变电感阵列。经测试,压控振荡器的频率调谐范围为1.76GHz~2.59GHz。对于频率为2.57GHz, 2.52GHz, 2.4GHz 和 2.25GHz的载波,在1MHz频偏处,相位噪声分别为-122.13dBc/Hz、-122.19dBc/Hz、-121.8dBc/Hz和-121.05dBc/Hz。其带内相位噪声分别为-80.09dBc/Hz、-80.29dBc/Hz、-83.05dBc/Hz 和-86.38dBc/Hz。包括驱动电路在内的芯片功耗约为70mW。芯片面积为1.5mm×1mm。     

基于0.35μm SiGe BiCMOS的高纯度频率综合器

介绍了一个基于0.35μm SiGe BiCMOS的整数N频率综合器.通过采用不同工艺来实现不同模块,实现了一个具有良好的杂散和相噪性能的高纯度频率综合器.除环路滤波器外所有的部件均采用差分电路结构.为了进一步减小相位噪声,压控振荡器中采用绑定线来形成谐振.该频率综合器可在2.39～2.72 GHz的频率范围内输出功率OdBm.在100kHz频偏处测得的相位噪声为-95dBc/Hz,在1MHz频偏处测得的相位噪声为-116dBc/Hz.参考频率处杂散小于-72dBc.在3V 的工作电压下,包括输出驱动级在内的整个芯片消耗60mA电流.     

一个应用于GSM/PCS/DCS/WCDMA收发机的带频率自校准技术的3~5 GHz低相位噪声分数分频频率综合器

本文给出了一种应用于GSM/PCS/DCS/WCDMA收发机的低相位噪声Σ-Δ分数分频频率综合器的设计。提出了一种新的环路稳定性分析方法,从而保证了锁相环路不会因为工艺、温度以及频率的偏差而导致不稳定。所设计的压控振荡器采用经过改进的数字控制电容阵列,扩展了振荡器的调谐范围,降低了相位噪声。同时,本文还采用了一种高精度的自动频率校准技术以自动选择振荡器的频带,并且提高了其相位噪声性能。芯片在SMIC 0.13 μm CMOS工艺下制造。测试结果表明,在1.2 V电源电压下,所设计的频率综合器的锁定范围达到3.05 GHz到5.17GHz,能够覆盖所要求的5个频带,并且锁定时间小于30 μs。测试得到的带内噪声在3.8GHz、2GHz和948MHz载波频率下分别为-89、-95.5和101dBc/Hz,相应的在1 MHz频偏处的带外噪声为-121、-123和-132dBc/Hz,能够满足以上提到的协议标准对相位噪声的要求。     

基于0.35μm SiGe BiCMOS的高纯度频率综合器

介绍了一个基于0.35μm SiGe BiCMOS的整数N频率综合器.通过采用不同工艺来实现不同模块,实现了一个具有良好的杂散和相噪性能的高纯度频率综合器.除环路滤波器外所有的部件均采用差分电路结构.为了进一步减小相位噪声,压控振荡器中采用绑定线来形成谐振.该频率综合器可在2.39～2.72 GHz的频率范围内输出功率OdBm.在100kHz频偏处测得的相位噪声为-95dBc/Hz,在1MHz频偏处测得的相位噪声为-116dBc/Hz.参考频率处杂散小于-72dBc.在3V 的工作电压下,包括输出驱动级在内的整个芯片消耗60mA电流.     

一种用于IR-UWB收发器的4GHz正交输出小数频率综合器

本文针对工作于3.1GHz到5GHz频段的IR-UWB收发器,设计了一种4GHz小数频率综合器。该频率综合器采用0.18μm混合&射频CMOS工艺实现,其输出频率范围为3.74GHz到4.44GHz。通过使用多比特量化的∑-△调制器,该频率综合器在参考频率为20MHz时的输出频率分辨率达到15Hz。测试结果表明,该频率综合器的正交信号输出幅度失配和相位误差分别低于0.1dB和0.8º。该频率综合器的输出相位噪声达到-116dBc/Hz@3MHz,频谱杂散低于-60dBc。在1.8V电源电压下,该频率综合器的核心电路功耗仅为38.2mW。     

基于012μm GaAs PHEMT 工艺的压控振荡器IC 设计

摘要:给出了一个采用012μm GaAs PHEMT工艺设计的全集成差分负阻式LC 压控振荡器电路,芯片面积为0152 × 017 mm2 。采用313 V 正电源供电,测得输出功率约- 11122 dBm ,频率调节范围61058 GHz～91347 GHz ;在自由振荡 频率712 GHz 处,测得的单边带相位噪声约为- 82 dBc/ Hz @100 kHz.     

一种宽频压控振荡器及高速双模预分频器的设计与实现

针对射频无线收发机的需求,利用开关电容阵列和多个VOD核的结构设计了一个分段线性超宽频压控振荡器(VCO).采用全电流模逻辑(CML)结构的双模预分频器能满足振荡器最高频率输出的要求.基于IBM 0.35SiGe BiCMOS工艺的流片测试结果表明,电源电压为2.8V时,该压控振荡器的频率能够覆盖2.75～5.73GHz的频段,调频灵敏度约为100MHz/V,在偏离中心频率1MHz处,单边带相位噪声最佳值达到了-120.32 dBc/Hz,预分频器后仿最高工作频率达9.6GHz,两部分核心总工作电流为10mA.     

具有量化噪声抑制的小数分频器

介绍了一款用于分数分频频率综合器的具有量化噪声抑制功能的小数分频器。使用4/4.5双模预分频器,将分频步长降为0.5,使带外相位噪声性能提高6 dB。ΣΔ调制器和分频器的配合使用一种非常简单的编程方式。采用同步电路消除异步分频器的抖动。采用该分频器的频率综合器在SMIC 0.18μm RF工艺下实现,芯片面积为1.47 mm×1 mm。测试结果表明,该频率综合器可以输出1.2～2.1 GHz范围的信号。测试的带内相位噪声小于-97 dBc/Hz,在1 MHz频偏处的带外相位噪声小于-124 dBc/Hz。在1.8 V的电源电压下,消耗的电流为16 mA。     

基于0.2μm GaAs PHEMT工艺的压控振荡器IC设计

给出了一个采用0 2μmGaAsPHEMT工艺设计的全集成差分负阻式LC压控振荡器电路,芯片面积为0 52×0 7mm2。采用3 3V正电源供电,测得输出功率约-11 22dBm,频率调节范围6 058GHz～9 347GHz;在自由振荡频率7 2GHz处,测得的单边带相位噪声约为-82dBc/Hz@100kHz.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.