SnAgCuY钎料表面Sn晶须的旋转生长现象

研究了Sn3.8Ag0.7Cu1.0Y钎料表层上YSn3稀土相表面Sn晶须的生长行为。结果表明:室温时效条件下在YSn3的表面会出现Sn晶须的快速生长现象,生长速度最快可达10–10m/s,长度最长可达200μm。YSn3稀土相氧化的不均匀性是导致Sn晶须在生长时产生各种旋转现象的主要原因。     

微量Ni对Sn-3.0Ag-0.5Cu钎料及焊点界面的影响

研究了Ni的含量对无铅钎料Sn-3.0Ag-0.5Cu润湿性、熔点、重熔及老化条件下界面化合物(IMC)的影响。结果表明:微量Ni的加入使SnAgCu润湿力增加6%;使合金熔点略升高约3℃;重熔时在界面形成了(Cu,Ni)6Sn5IMC层,且IMC厚度远高于SnAgCu/Cu的Cu6Sn5IMC厚度。在150℃老化过程中,SnAgCuNi/Cu重熔焊点IMC随着时间的增加,其增幅小于SnAgCu/Cu的增幅,此时Ni对IMC的增长有一定抑制作用。     

SnAgCu体钎料及BGA焊球焊点纳米级力学性能

为了研究低银Sn-0.3Ag-0.7Cu无铅体钎料、BGA焊料小球和BGA焊点的力学行为,基于物理反分析的方法采用纳米压痕仪对其进行实验。从压痕载荷–深度曲线提取出弹性模量、硬度和蠕变速率敏感指数。结果表明:体钎料的杨氏模量和蠕变速率敏感指数大约是BGA焊料小球和BGA焊点的2.5倍,验证了尺寸效应理论。采用纳米压痕仪测出的体钎料维氏硬度(15.101HV)小于显微硬度计的测量结果(20.660HV)。     

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

The effect of trace amounts of rare earth additions on the microstructure and properties were studied for the Sn-58Bi and Sn-58Bi-Ag solder alloys. At the same time, the intermetallic compounds (IMCs) in the solder alloys and intermetallic layer (IML) thickness at the solder/Cu substrate interface were investigated, both as-reflowed and after high-temperature aging. The results indicate that adding trace amounts of rare earth (RE) elements has little influence on the melting temperature and microhardness of the solders investigated, but adding RE elements improves the wettability and shear strength of the Sn-58Bi and Sn-58Bi-Ag solder alloys. In addition, it was found that the addition of RE elements not only refines the microstructure and size of the IMC particles, but also decreases the IML thickness and shear strength of the Sn-58Bi solder joint after high-temperature aging. Adding trace amounts of RE elements is superior to adding trace amounts of Ag for improving the properties of the Sn-58Bi solder. The reason may be related to the modification of the microstructure of the solder alloys due to the addition of trace amounts of RE elements.     

Recent Observations on Tin Pest Formation in Solder Alloys

The most recent observations of the response of bulk samples of several lead-free solder alloys, exposed to temperatures below the allotropic transition for tin for extended periods, are reported. Tin pest has been observed in Sn-0.5Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, and Sn-3.0Ag-0.5Cu alloys at both −18°C and −40°C. The process is slow and inconsistent, usually requiring several years, but may eventually result in complete disintegration of the sample. No tin pest was detected in Sn-Zn-3Bi or in the traditional Sn-37Pb solder alloy after exposure for up to 4 and 10 years, respectively. It is suggested that nucleation is affected by local composition and that extremely small amounts of either intentional solute or impurity are influential. Growth of tin pest is accompanied by a large volume change, and it is likely that stress relaxation ahead of the expanding grey tin front is a controlling factor. A stronger matrix would be more resistant in this case, and at the temperatures of exposure Sn-37Pb is stronger than either Sn-3.5Ag or Sn-0.5Cu. The absence of tin pest, to date, on actual joints is attributed to their restricted free surface area and the greater strength associated with very small samples.     

A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

Reactive wetting of solders on Cu and Cu₆Sn₅/Cu₃Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder (63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu₆Sn₅/Cu₃Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage tests indicate a more pronounced spreading of 63Sn-Pb on Cu₆Sn₅/Cu₃Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or over Cu₆Sn₅/Cu₃Sn/Cu substrates.     

Optical,electrical, and photoelectric properties of nitrogen-doped perovskite ferroelectric BaTiO3 ceramics

Nitrogen-doped BaTiO₃ (BT) ceramics were produced by the solid-state reaction method in conjunction with ammonia gas treatment. The optical absorption spectra results show that the bandgap of BT ceramic is narrowed after N-doping, suggesting that the N-doping is an effective route to increase light absorption. Polar properties measurements indicate that the ferroelectricity of BT ceramic is well maintained after the N-doping. In addition, the electric-field–induced strain is prominently improved to ~0.8% after N-doping, a value superior to that of PZT. Furthermore, the influence of N-doping on photoelectric properties of BT ceramics was also investigated. Large increase in photoconductivity and fast response to light illumination conditions were observed in N-doped BT ceramics. This work provides a novel route to enhance the (photo)electric properties of ferroelectric materials.     

Direct ink writing of macroporous lead-free piezoelectric Ba0.85Ca0.15Zr0.1Ti0.9O3

Direct ink writing (DIW) has become a widespread additive manufacturing technique for material engineering, but its application in lead-free Ba_0.85Ca_0.15Zr_0.1Ti_0.9O₃ piezoelectric ceramics from aqueous systems has not been reported so far to our knowledge. The main obstacle is the high extent of hydrolysis reactions undergone by the starting powders when dispersed in water, hindering the attainment of stable water-based colloidal suspensions. This paper reports on the preparation of stable aqueous inks from a deagglomerated and surface-treated powder synthesized by solid-state reaction and on DIW of macroporous lead-free piezoelectrics. Based on zeta potential and rheological measurements, the optimal amounts of processing additives (dispersant, binder, and coagulating agent) were selected to transform the initial fluid suspension to a viscoelastic paste with sufficient stiffness and stability for the printing process. Dielectric and piezoelectric properties of samples sintered under different temperatures were also investigated.     

Large strain under low driving field in lead-free relaxor/ferroelectric composite ceramics

0.75(Na_0.5Bi_0.5)TiO₃–0.25SrTiO₃ lead-free incipient piezoceramic is a promising candidate for actuator applications due to their large reversible electromechanical strains at the relatively low driving field of 40 kV/cm. In order to further reduce the driving field of 0.75(Na_0.5Bi_0.5)TiO–0.25SrTiO₃ relaxor ceramic to meet the requirements for real actuators application, the relaxor/ferroelectric (RE/FE) 0-3 composite ceramics method was employed. The polarization and strain behaviors were examined as a function of the weight ratio of the relaxor/ferroelectric phases. It was found that 90 wt% 0.75(Na_0.5Bi_0.5)TiO₃–0.25SrTiO₃/10 wt% 0.96(Na_0.84K_0.16)_1/2Bi_1/2TiO₃–0.04SrTiO₃ RE/FE 0-3 type composite samples provided a high unipolar strain of 0.25% and the corresponding large-signal piezoelectric coefficient, d^*₃₃ of 833 pm/V at 30 kV/cm, which are 32% higher than the values of the pure 0.75(Na_0.5Bi_0.5)TiO₃–0.25SrTiO₃. The enhanced electric-field-induced strain at relatively lower field was attributed primarily to the reduction in the RE-FE phase transition electric field. It was also found that the RE/FE composite ceramics exhibited significantly reduced frequency dependence in the unipolar strain behavior at room temperature.     

偶氮胂Ⅲ光度法测定无铅锡基焊料中稀土总量

在pH 3的HAc-NaAc缓冲体系中, 稀土元素与偶氮胂Ⅲ形成稳定的蓝色络合物, 其最大吸收峰在660 nm处, 表观摩尔吸光系数为2.2×10⁴ L·mol^-1·cm^-1, 稀土总量(RE)的质量浓度在0～1.6 μg/ mL符合比尔定律, 据此建立了用偶氮胂Ⅲ分光光度法测定无铅锡基焊料中RE的方法。锡对测定的干扰可以在H₂SO₄介质中采用HCl和HBr挥发排除, 铋、铟、铜、银等其他元素的干扰可采用二乙基二硫代氨基甲酸钠(DDTC)溶液沉淀分离和磺基水杨酸与抗坏血酸联合掩蔽的方法消除。方法用于无铅锡基焊料中RE质量分数在0.005%～0.20%的样品测定, 相对标准偏差为3.3%～5.6%, 加标回收率为92.0%～103.3%。