In对Sn-8Zn-3Bi无铅钎料润湿性的影响

首先采用铺展法测试了Sn-8Zn-3Bi-(0～5)In钎料合金的铺展性.结果表明,少量In的加入提高了钎料的润湿性.当In含量达到0.5%时(质量分数,下同),钎料在铜基底上的铺展面积最大.采用气泡最大压力法对Sn-8Zn-3Bi-(0～1.5)In钎料熔体进行了表面张力测试.加入0.5%的In大大降低了Sn-8Zn-3Bi钎料熔体的表面张力,但进一步增加In的含量导致熔体表面张力增大.最后采用润湿平衡法对上述钎料进行了润湿力测试.结果表明0.5%In的加入使合金的润湿力达到最大,其原因是钎料/铜界面的界面张力减小.     

Simultaneously achieved high-energy storage density and efficiency in (K,Na)NbO3-based lead-free ferroelectric films

With the development of advanced electrical and electronic devices and the requirement of environmental protection, lead-free dielectric capacitors with excellent energy storage performance have aroused great attention. However, it is a great challenge to achieve both large energy storage density and high efficiency simultaneously in dielectric capacitors. This work investigates the energy storage performance of sol-gel-processed (K,Na)NbO₃-based lead-free ferroelectric films on silicon substrates with compositions of 0.95(K_0.49Na_0.49Li_0.02)(Nb_0.8Ta_0.2)O₃-0.05CaZrO₃-x mol% Mn (KNN-LT-CZ5-x mol% Mn). The appropriate amount of Mn-doping facilitates the coexistence of orthorhombic and tetragonal phases, suppresses the leakage current, and considerably enhances the breakdown strengths of KNN-LT-CZ5 films. Consequently, large recoverable energy storage density up to 64.6 J cm⁻³ with a high efficiency of 84.6% under an electric field of 3080 kV cm⁻¹ are achieved in KNN-LT-CZ5-5 mol% Mn film. This, to the best of our knowledge, is superior to the majority of both the lead-based and lead-free films on silicon substrates and thus demonstrates great potentials of (K,Na)NbO₃-based lead-free films as dielectric energy storage materials.     

准同型相界附近(Na1-xKx)0.5Bi0.5TiO3的制备及性能研究

利用固相法制备了（Na1-xKx）0.5Bi0.5TiO3系压电陶瓷，XRD分析表明所得陶瓷样品为纯的钙钛矿结构，其准同型相界在x=0．18～0．22之间；电子探针显微分析显示所做陶瓷样品晶粒发育良好，具有规则的外形和明显的晶界；实验所得陶瓷样品损耗tanδ最大不超过5％，最好的压电常数d33=153 pC／N，平面机电耦合系数kp=0．299，它们分别出现在x=0．22和0．20处。     

(Bi_(1/2)Na_(1/2))TiO_3BaTiO_3系无铅压电陶瓷工艺的研究

详细探讨了在制备(Bi1/2Na1/2)TiO3 BaTiO3(abbr.BNBT)系无铅压电陶瓷的过程中,合成条件Ty和烧结温度Ts对材料压电介电性能的影响,确定了较好的制备BNBT系压电陶瓷的工艺条件,并且系统地研究了(1-x)·(Bi1/2Na1/2)TiO3 xBaTiO3(x=0 02、0 04、0 06、0 08、0 10)的性能。XRD结构分析发现系统的相界在x=0 06,此时d33等压电介电性能参数达到最佳值。     

无铅焊锡微粉雾化量与性能的关系

对自行设计的超音速雾化实验制粉设备，进行了不同雾化合金质量的生产效率及不同雾化量的宏观形貌研究。结果表明，雾化设备的最大雾化合金质量为400g；大、小批量雾化的粉末在宏观方面几乎无差别。找出了无铅焊锡微粉工业生产设备要满足的基本条件。     

无铅钎料的研究现状及进展

从环保概念出发,介绍了使用无铅钎料的必要性;综述了近几年国内外无铅钎料的研究现状;分析了无铅钎料研究必须解决的几个关键问题,并提出了解决这些问题的思路和建议。     

Sn-Cu系无铅钎料的研究现状与发展

介绍了无铅钎料应用时应该满足的基本要求和Sn-Cu系无铅钎料的国内外研究和应用现状,概述了Sn-Cu系无铅钎料润湿性能、物理性能、力学性能等方面的一些特点,分析探讨了Sn-Cu系无铅钎料存在的不足,详细阐述了添加不同合金元素(如Bi、Ag、Ni、RE等元素)对Sn-Cu系无铅钎料性能的影响规律,并对Sn-Cu系无铅钎料的应用前景和发展方向进行了展望.     

Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测

利用周模型对Sn—Ag—Cu—Ce无铅钎料合金体系进行了热力学计算预测。热力学计算结果表明，Ag、Cu含量(质量分数)分别为0．5％-4．5％时，当Ce的含量(质量分数)超过0．05％时，体系达到化学平衡状态；当Ce的含量(质量分数)达到0．6％左右时，Sn、Ag、Cu分别都出现了“等活度系数”现象。这一研究结果可为无铅钎料合金的成分设计提供理论指导。     

亚共晶Sn-Zn系合金无铅焊料的性能

通过差热分析(DTA),研究Sn-xZn合金(x=2.5~9)的非平衡熔化性能,发现在加热速度为5℃/min时,Sn-6.5Zn与Sn-9Zn的熔化特性相同;通过浸润法和铺展法表征Sn-xZn合金在Cu基材表面上的润湿性。结果表明:Sn-6.5Zn在Cu基材表面上的润湿性优于Sn-9Zn。研究速率为10-3s-1和10-1s-1时Sn-xZn的拉伸性能,结果发现:Sn-6.5Zn的抗拉强度与Sn-9Zn的相当,而延伸率高于Sn-9Zn。以搭接焊及界面剪切实验研究Sn-xZn/Cu焊点界面强度,发现焊点界面剪切强度随x的增加而提高,在x≥6.5时趋于稳定;x=6.5时剪切力最大,表明Sn-6.5Zn在Sn-Zn系中具有最好的钎焊工艺性能。     

EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃/min, Sn-6.SZn exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu0Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer（s） between the alloy and Cu was found to increase linearly with the Zn concentration.