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11.
The present study investigates the influence of Cu and Al on microstructure and wear behavior of a eutectic Sn-9Zn solder alloy. The Sn-9Zn–X alloy was produced by adding various amounts of Cu and Al through investment casting method. The produced Sn-9Zn–X alloys were characterized by a scanning electron microscope, X-ray diffraction, and hardness measurements. In wear tests at 1 ms?1 sliding speed, 10 N load and 5 different sliding distances (400–2000 m) were used. The results show that as the amount of Cu and Al increased within Sn-9Zn alloy, the hardness of the alloy increased as well. Depending on the increase in hardness of the alloys produced by investment casting, it was observed that weight loss decreased during wear tests. Furthermore, the same proportion of added Al alloys’ hardness and weight loss were observed to be higher than the added Cu alloys. Furthermore, the Cu-added alloy exhibited higher hardness and lower weight loss than the Al-added alloy did.  相似文献   
12.
In this work, we studied effects of Ni2O3 and Co2O3 doping on crystal structures, microstructures, orthorhombic and tetragonal phase transition temperature (To-t), and electrical properties of [Li0.06(Na0.57K0.43)0.94][Ta0.05(Sb0.06Nb0.94)0.95]O3 (LNKTSN) lead-free ceramics. The experimental results showed that the Ni2O3 addition with appropriate amount could shift the To-t downwards to the room temperature, and thus obviously increasing the room-temperature piezoelectric coefficient (d33), dielectric coefficient (εr) and electromechanical coupling coefficient (kp) of the LNKTSN ceramics. These were consistent with previous experimental results obtained in Fe2O3 doped LNKTSN ceramics. On the contrary, Co3+ doping shifted continuously the To-t upward and deteriorated obviously piezoelectric properties of LNKTSN ceramics. Fe, Co and Ni had similar ion radii and were expected to result in the same (donor or acceptor) doping effects on electrical properties of LNKTSN ceramics. The different doping effects between Co3+ (deterioration) and Ni3+ or Fe3+ (improvement) on the electrical properties of LNKTSN ceramics suggested that the coexistence of orthorhombic and tetragonal phases at room temperature due to downward shift of To-t, rather than ion doping (donor or acceptor doping) effects was the main cause for enhanced room-temperature piezoelectric properties. This conclusion can be extended to all KNN-based materials in general, thus offering principle guide for future development of new lead-free materials with good piezoelectric properties.  相似文献   
13.
A series of morphotropic phase boundary (MPB) compositions of (1–x)Na1/2Bi1/2TiO3-xBaTiO3 (x = 0.05, 0.055, 0.06, 0.065, 0.07), with and without 0.5 mol% Zn-doping was synthesized using the solid-state route. The samples were characterized using X-ray diffraction, dielectric analysis, and electromechanical measurements (piezoelectric d33 coefficient, coupling factor kp, mechanical quality factor Qm, and internal bias field Ebias). The increase in the ferroelectric-relaxor transition temperature upon Zn-doping was accompanied by a shift of the MPB toward the Na1/2Bi1/2TiO3-rich side of the phase diagram. Higher tetragonal phase fraction and increased tetragonal distortion were noted for Zn-doped (1 – x)Na1/2Bi1/2TiO3-xBaTiO3. In addition, ferroelectric hardening and the presence of an internal bias field (Ebias) were observed for all doped compositions. The piezoelectric constant d33 and the coupling coefficient kp decreased by up to ∼30%, while a 4- to 6-fold increase in Qm was observed for the doped compositions. Apart from establishing a structure–property correlation, these results highlight the chemically induced shift of the phase diagram upon doping, which is a crucial factor in material selection for optimal performance and commercialization.  相似文献   
14.
采用传统陶瓷制备方法制备了致密的NaNbO3无铅铁电陶瓷。利用XRD、SEM、介电温谱等分析技术,研究了CuO和MnO2掺杂对NaNbO3无铅铁电陶瓷的合成温度、烧成工艺、结构相变以及铁电性能的影响。结果表明通过CuO和MnO2掺杂能在较低温度下制备出致密的NaNbO3陶瓷和陶瓷的致密度,电学性能随着烧成温度的变化存在一个最优值,最佳烧结温度为1050℃,体积密度达到4.38g/cm3为理论密度的98.6%。该陶瓷在15~120℃均表现出铁电性能,具有压电活性,常温下介电常数为287,居里温度为390℃。  相似文献   
15.
在Sn-4.1X-1.5Cu-Ni焊料合金中添加0.05%(质量分数,下同)(La+Ce),对焊料/Cu焊点等温时效后其界面组织的变化规律以及界面金属间化合物的形成和生长行为进行分析研究,结果表明:随着等温时效时间的延长,Sn-4.1X-1.5Cu-Ni/Cu和Sn-4.1X-1.5Cu-Ni-0.05(La+Ce)/...  相似文献   
16.
研究微量稀土元素对Sn57Bi1Ag无铅焊料合金显微组织以及性能的影响。结果表明,当稀土含量为0.05%~0.5%(质量分数)时,对该无铅焊料合金的导电性和腐蚀性影响不大,但使熔化区间温度降低;可以提高焊料合金的力学性能,提高焊料的铺展面积,细化组织。比较Ce、Er、Y三种稀土元素对焊料合金的影响,发现Er元素可以更好地提高焊料合金的综合性能,Ce次之。  相似文献   
17.
针对现代发动机向高速重载、质轻节能、安全环保方向发展的需求,通过调整合金成分和浇铸工艺,研发出一种新型高承载能力、无铅且质轻的铝合金轴瓦材料.通过正交试验,分析了添加元素的含量对合金力学性能的影响规律,确定了备金的成分控制范围,使其性能指标可达抗拉强度σb≥180N/mm^2,屈服强度σs≥70N/mm^2,伸长率A≥22%.  相似文献   
18.
李朝林 《半导体技术》2011,36(12):972-975
在无铅BGA封装工艺过程中,通过不同组分的BGA焊球合金与焊膏合金组合焊接、焊膏助焊剂活性剂不同配比及其不同再流焊接条件等实验,对焊料合金和助焊剂配比、再流焊接峰值温度、再流保温时间等参数变化,以降低BGA焊点空洞缺陷进行了研究。结果表明选用相同或相似的BGA焊球和焊膏合金组合焊接、选用活性强的焊膏、选择焊接保温时间较长均有助于降低BGA焊点空洞缺陷产生的几率和空洞面积,BGA焊点最佳再流焊接峰值温度为240℃,当峰值温度设置为250℃时,BGA焊点产生空洞缺陷几率会比240℃高出25%~30%。  相似文献   
19.
以SnAgCu无铅焊膏铺展性能和焊点形貌作为评价的主要指标,通过回流焊接实验,对常用于焊膏的10种溶剂进行了单一溶剂优选,并对两种性能较好的溶剂进行复配优化研究.结果表明:A醇、二缩三乙二醇和B醚作为单一溶剂时焊膏的润湿性较好、焊点外形较饱满,铺展率都大于83%;A醇和B醚按质量比3:2复配时得到的焊膏铺展率达到93%...  相似文献   
20.
采用普通陶瓷工艺制备了由稀土元素Pr替位改性的高温Ca1-xPrxBi2Nb2O9(x=0~0.100)无铅压电陶瓷,研究了Pr含量对CaBi2Nb2O9(CBNO)压电陶瓷介电及压电性能的影响。结果表明:Pr对Ca的替换明显提高了CBNO压电陶瓷的压电性能。其中,Pr含量x为0.050的Ca0.95Pr0.05Bi2Nb2O9压电陶瓷表现出最好的压电性能,其压电常数d33高达14pC/N,且在800℃以下表现出良好的温度稳定性。  相似文献   
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