Fabrication and comparative study of top-gate and bottom-gate ZnO–TFTs with various insulator layers

Transparent ZnO thin film transistors (ZnO–TFTs) with different structures and dielectric layers were fabricated by rf magnetron sputtering. The PbTiO₃, AlO _x , SiN _x and SiO _x films were attempted to serve as the gate dielectric layers in the devices, respectively, and XRD was employed to investigate the crystal structure of ZnO films deposited on these dielectric layers. The optical properties of transparent TFTs were measured and revealed the average transmittance ranged from 60 to 80% in the visible part of the spectrum. Electrical measurement shows the properties of the ZnO–TFTs have great relations with the device structure. The bottom-gate TFTs have better behaviors than top-gate ones with the mobility, threshold voltage and the current on/off ratio of 18.4 cm² V⁻¹ s⁻¹, −0.7 V and 10⁴, respectively. The electrical difference of the devices may be due to different character of the interface between the channel and dielectric layers.     

Thermally stable, highly conductive, and transparent Ga-doped ZnO thin films

Highly conductive and transparent films of Ga-doped ZnO (GZO) have been prepared by pulsed laser deposition using a ZnO target with Ga₂O₃ dopant of 3 wt.% in content added. Films with resistivity as low as 3.3 × 10^− 4 Ω cm and transmittance above 80% at the wavelength between 400 and 800 nm can be produced on glass substrate at room temperature. It is shown that a stable resistivity for use in oxidation ambient at high temperature can be attained for the films. The electrical and optical properties, as well as the thermal stability of resistivity, of GZO films were comparable to those of undoped ZnO films.     

Novel Ga-doped ZnO nanocrystal ink: Synthesis and characterization

Ga-doped ZnO (GZO) nanocrystals were synthesized via the hot-injection method for the first time. The characterizations of its structure, composition, morphology, and absorption properties were conducted by using powder X-ray diffraction (XRD), energy-dispersive X-ray spectroscopy (EDS), transmission electron microscopy (TEM) and UV-vis absorption spectroscopy. The results indicated that GZO nanocrystals were single phase polycrystalline within a range of 5―10 nm. Optical measurements illustrated that GZO nanocrystals have a tunable band gap from 3.35 to 3.81 eV, depending on the Ga doping level. GZO nanocrystals were dispersed in nonpolar solvents to form a nanocrystal ink which could remain stable after a month of storage. The GZO thin film was fabricated by spin coating the GZO nanocrystal ink and annealing in air. The electrical resistivity of the film was measured to be 7.5 × 10⁻² Ω cm. This method, which eliminated the requirement of high vacuum and high temperature, was a promising alternative for transparent conducting oxide (TCO) fabrication.     

Atomic layer deposition grown composite dielectric oxides and ZnO for transparent electronic applications

In this paper, we report on transparent transistor obtained using laminar structure of two high-k dielectric oxides (hafnium dioxide, HfO₂ and aluminum oxide, Al₂O₃) and zinc oxide (ZnO) layer grown at low temperature (60 °C-100 °C) using Atomic Layer Deposition (ALD) technology. Our research was focused on the optimization of technological parameters for composite layers Al₂O₃/HfO₂/Al₂O₃ for thin film transistor structures with ZnO as a channel and a gate layer. We elaborate on the ALD growth of these oxides, finding that the 100 nm thick layers of HfO₂ and Al₂O₃ exhibit fine surface flatness and required amorphous microstructure. Growth parameters are optimized for the monolayer growth mode and maximum smoothness required for gating.     

Thermal stability of carrier centers in various types of transparent conductive ZnO and Ga-doped ZnO films

We investigated the thermal stability of the transparent conductive properties of undoped ZnO and Ga-doped ZnO (GZO) films when they were annealed in a high vacuum with stepwise increasing temperature. The ZnO samples included V_O-rich and Zn-rich ZnO films; the primary donors were respectively oxygen vacancies (V_O) or Zn atoms highly unsaturated with oxygen atoms. V_O-rich ZnO was the most unstable against annealing; resistivity initially within the 10⁻³ Ω cm range diverged higher than 10 Ω cm when a critical temperature was exceeded. The critical temperature between 350 and 450 °C depended on the film thickness, which indicated that V_O's were diminished through recombination with migrating interstitial oxygen atoms. In contrast, Zn-rich ZnO films remained highly conductive up to 550 °C. They became more and more transparent and their crystallinity improved at higher annealing temperatures, which was the consequence of metallic-like Zn atoms being removed through desorption from the surface or being accommodated into the crystalline lattice. Comparatively, GZO films were more robust against annealing with their resistivities remaining unchanged up to 350 °C.     

A comparison of Ga:ZnO and Ga:ZnO/Ag/Ga:ZnO source/drain electrodes for In–Ga–Zn–O thin film transistors

We compared the characteristics of single Ga:ZnO (GZO) and GZO/Ag/GZO multilayer electrodes for source/drain (S/D) contacts in amorphous In–Ga–Zn–O (a-IGZO)-based thin film transistors (TFTs). Due to the existence of a Ag metallic layer between the GZO layers, the GZO/Ag/GZO multilayer electrode exhibited low sheet resistance (3.95 ohm/sq.) and resistivity (3.32 × 10^?5 ohm-cm). The saturation mobility (10.2 cm² V^?1 s^?1) of the a-IGZO TFT with GZO/Ag/GZO S/D electrodes is much higher than that attained for the a-IGZO TFT with single GZO S/D electrodes (0.7 cm² V^?1 s^?1) due to the lower resistivity of the GZO/Ag/GZO multilayer S/D electrode. Furthermore, it is expected that the high transparency of the GZO/Ag/GZO multilayer will allow for the possible realization of fully transparent a-IGZO TFTs.     

Effect of Ga doping concentrations,substrate temperatures and working pressures on the electrical and optical properties of ZnO thin films

We fabricated Ga-doped ZnO (GZO) thin films on glass substrate by RF magnetron sputtering method with different conditions of Ga₂O₃ concentration, substrate temperature and working pressure. Next we investigated the electrical, optical and structural properties of the GZO thin films. At a substrate temperature of 300 °C, a working pressure of 1 mTorr, and a Ga₂O₃ concentration of 3 wt%, the GZO thin films showed the lowest resistivity of 3.16 × 10^?4 Ω cm, a carrier concentration of 7.64 × 10²⁰ cm^?3 and a Hall mobility of 25.8 cm²/Vs. Moreover, the GZO thin films exhibited the highest (002) orientation under the same conditions and the full width at half maximum of X-ray peak was 0.34°. All GZO thin films showed the optical transmittance of more than 80 % in the visible range regardless of working conditions. The Burstein–Moss effect was observed by the change of doping concentration of Ga₂O₃. The GZO thin films were fabricated to have the good electrical and optical properties through optimizing doping concentration of Ga₂O₃, substrate temperature, working pressure. Therefore, we confirmed the possibility of application of GZO thin film as transparent conductive oxide used in flat panel display and solar cell.     

Effect of NH3 plasma treatment on the device performance of ZnO based thin film transistors

We fabricated an enhancement-mode thin film transistor (TFT) using ZnO as an active channel layer deposited by radio frequency (rf) magnetron sputtering. The NH₃ plasma passivation was performed in order to improve the electrical properties of the ZnO TFTs. We observed that the NH₃ plasma treated ZnO TFTs revealed improved device performances, which include the field effect mobility of 34 cm²/Vs, threshold voltage of 14 V, subthreshold swing of 0.44 V/dec, off-current of 10⁻¹¹ A and on to off ratio higher than 10⁵. These results demonstrate that NH₃ plasma treatment could effectively enhance the performance of the ZnO based TFT device.     

Effect of Ga doping on micro/structural, electrical and optical properties of pulsed laser deposited ZnO thin films

Undoped and Ga doped ZnO thin films (1% GZO, 3% GZO and 5% GZO) were grown on c-Al₂O₃ substrates using the 1, 3 and 5 at. wt.% Ga doped ZnO targets by pulsed laser deposition. X-ray diffraction studies revealed that highly c-axis oriented, single phase, undoped and Ga doped ZnO thin films with wurtzite structure were deposited. Micro-Raman scattering analysis showed that Ga doping introduces defects in the host lattice. The E₂^High mode of ZnO in Ga doped ZnO thin film was observed to shift to higher wavenumber indicating the presence of residual compressive stress. Appearance of the normally Raman inactive B₁ modes (B₁^Low, 2B₁^Low and B₁^High) due to breaking of local translational symmetry, also indicated that defects were introduced into the host lattice due to Ga incorporation. Band gap of the Ga doped ZnO thin films was observed to shift to higher energy with the increase in doping concentration and is explicated by the Burstein-Moss effect. Electrical resistivity measurements of the undoped and GZO thin films in the temperature range 50 to 300 K revealed the metal to semiconductor transition for 3 and 5% GZO thin films.     

Structural, electrical and moisture resistance properties of Ga-doped ZnO films

The structural, electrical and moisture resistance properties of Ga-doped ZnO (GZO) films with 200 nm thickness in terms of their dependence on oxygen gas flow rate (fO₂) during deposition were studied. GZO films are deposited on glass substrates by ion plating with DC arc discharge. After a reliability test at a temperature of 60 °C and a relative humidity of 95% for 500 h, the percentage of resistivity change of GZO films decreased from 16–20% to 3–11% with increasing fO₂ from 6–12 to 14–25 sccm. The minimum percentage of the resistivity change was observed in the GZO films deposited at fO₂ of 21 sccm and the resistivity after the reliability test was 3.5 × 10^{− 4} Ω cm. The effects of the intrinsic defects on the percentage of resistivity change are discussed on the basis of electrical and optical characteristics of GZO films.     

The influence of fabrication process on top-gate thin-film transistors

Amorphous indium zinc oxide (a-IZO) thin-film transistors (TFTs) with bottom- and top-gate structures were fabricated at room temperature by direct current (DC) magnetron sputter in this research. High dielectric constant (κ) hafnium oxide (HfO₂) films and a-IZO were deposited for the gate insulator and the semiconducting channel under a mixture of ambient argon and oxygen gas, respectively. The bottom-gate TFTs showed good TFT characteristics, but the top-gate TFTs did not display the same characteristics as the bottom-gate TFTs despite undergoing the same process of sputtering with identical conditions. The electrical characteristics of the top-gate a-IZO TFTs exhibited strong relationships with sputtering power as gate dielectric layer deposition in this study. The ion bombardment and incorporation of sputtering ions damaged the interface between the active layer and the gate insulator in top-gate TFTs. Hence, the sputtering power was reduced to decrease damage while depositing HfO₂ films. When using 50 W DC magnetron sputtering, the top-gate a-IZO TFTs showed the following results: a saturation mobility of 5.62 cm²/V-s; an on/off current ratio of 1 × 10⁵; a sub-threshold swing (SS) of 0.64 V/decade; and a threshold voltage (V_th) of 2.86 V.     

Conductive Ga doped ZnO/Cu/Ga doped ZnO thin films prepared by magnetron sputtering at room temperature for flexible electronics

Ga doped ZnO(GZO)/Cu/GZO multilayers were deposited by magnetron sputtering on polycarbonate substrates at room temperature. We investigated the structural, electrical, and optical properties of multilayers at various thicknesses of Cu and GZO layers. The lowest resistivity value of 3.3 × 10^− 5 Ω cm with a carrier concentration of 2.9 × 10²² cm^− 3 was obtained at the optimum Cu (10 nm) and GZO (10 nm) layer thickness. The highest value of figure of merit φ_TC is 2.68 × 10^− 3 Ω^− 1 for the GZO (10 nm)/Cu(10 nm)/GZO(10 nm) multilayer. The highest average near infrared reflectivity in the wavelength range 1000-2500 nm is as high as 70% for the GZO(10 nm)/Cu(10 nm)/GZO(10 nm) multilayer.     

Improved properties of Pt-HfO2 gate insulator-ZnO semiconductor thin film structure by annealing of ZnO layer

Metal-insulator-semiconductor capacitors were fabricated with sputtered ZnO and atomic layer deposited HfO₂ as the semiconductor and gate dielectric layers, respectively. From the capacitance-voltage measurements, it was confirmed that pre-deposition annealing of the sputtered ZnO layer at 300 °C in air greatly decreased the interfacial trap density (∼ 2 × 10¹² cm^− 2 eV^− 1). X-ray photoelectron spectroscopy showed a decrease in the OH bonds adsorbed on the ZnO surface after pre-deposition annealing, which improved the interface property. A very small capacitance equivalent thickness of 1.3 nm was achieved, which decreased the operation voltage (< 5 V) of the device significantly.     

ZnO/Cu/ZnO multilayer films: Structure optimization and investigation on photoelectric properties

A series of ZnO/Cu/ZnO multilayer films has been fabricated from zinc and copper metallic targets by simultaneous RF and DC magnetron sputtering. Numerical simulation of the optical properties of the multilayer films has been carried out in order to guide the experimental work. The influences of the ZnO and Cu layer thicknesses, and of O₂/Ar ratio on the photoelectric and structural properties of the films were investigated. The optical and electrical properties of the multilayers were studied by optical spectrometry and four point probe measurements, respectively. The structural properties were investigated using X-ray diffraction. The performance of the multilayers as transparent conducting coatings was compared using a figure of merit. In experiments, the thickness of the ZnO layers was varied between 4 and 70 nm and those of Cu were between 8 and 37 nm. The O₂/Ar ratios range from 1:5 to 2:1. Low sheet resistance and high transmittance were obtained when the film was prepared using an O₂/Ar ratio of 1:4 and a thickness of ZnO (60 nm)/Cu (15 nm)/ZnO (60 nm).     

Characteristics of laser-annealed ZnO thin film transistors

We investigated the effects of laser annealing on ZnO thin film transistors (TFTs). ZnO layers were deposited on a bottom-gate patterned Si substrate by radio-frequency sputtering at room temperature. Laser annealing of the ZnO films reduced the full width at half maximum of the ZnO (002) diffraction peak from 0.49° to 0.1°. It reveals that the crystalline quality is improved by annealing effect. A SiO₂ formed in low temperature was used as the gate dielectric. Unannealed ZnO-TFTs were operated in enhancement mode with a threshold voltage of 21.6 V. They had a field-effect mobility of 0.004 cm²/Vs and an on/off current ratio of 134. Laser annealing of the ZnO-TFTs by 200 laser pulses reduced their threshold voltage to 0.6 V and increased their field-effect mobility to 5.08 cm²/Vs. The increase of mobility is originated from the crystallization enhancement of ZnO films after laser annealing.     

Effect of organic-buffer-layer on electrical property and environmental reliability of Ga-doped ZnO films prepared by RF plasma assisted DC magnetron sputtering on plastic substrate

Ga-doped ZnO (GZO) transparent conductive films have been prepared by RF plasma assisted DC magnetron sputtering under a reductive atmosphere on organic-buffer-layer (OBL) coated polyethylene telephthalate (PET) substrates without intentionally heating substrates. Electrical and optical properties, crystallinity, and environmental reliability of the GZO films have been investigated. The distributional characteristic of resistivity is observed in the GZO film deposited on the OBL-coated PET substrates. The high resistivity at facing the erosion area in the source target is reduced by providing the RF plasma and H₂ gas near the substrate, resulting in a uniform distribution of the sheet resistance. It has been also found that the increase of resistivity by an accelerated aging test performed under a storage condition at 60 °C and at a relative humidity of 95% is suppressed by employing the OBL. The OBL suppresses the formation of cracks, which are induced by the aging test. These facts are thought to contribute to a high environmental reliability of GZO films on PET substrates. Values of resistivity, Hall mobility and carrier concentration are obtained: 5.0-20 × 10⁻³ Ω cm, 4.0 cm²/Vs, and 3.8 × 10²⁰ cm⁻³, respectively. An average transmittance of the GZO film including OBL and PET substrate is 78% in a visible region. The OBL enables to realize the practical use of GZO films on PET sheets.     

Development of Ga-doped ZnO transparent electrodes for liquid crystal display panels

Liquid crystal displays (LCDs) with Ga-doped ZnO (GZO) transparent electrodes on RGB color filters were fabricated to demonstrate the feasibility of using this new material as an alternative to indium tin oxide (ITO) electrodes. The process flow for fabricating LCDs with GZO electrodes was entirely compatible with that for commercially available LCDs using ITO electrodes. Concurrently, photolithography processing and wet-chemical etching techniques for the formation of GZO transparent electrodes on thin film transistor (TFT) arrays in LCD panels was developed. Fine-patterns of GZO with 2-μm line widths were successfully formed using lithography and wet -etching technology with a weakly acidic etchant of pH 5.5-6.8.     

Growth of ZnO layers for transparent and flexible electronics

We have deposited and characterised ZnO on flexible and transparent plastic polymer. We employed a specially designed vapour phase growth system with elemental sources for zinc and oxygen and deposited thin ZnO films at temperatures below 400 °C. Basic photoluminescence characterisation confirms ZnO. Ohmic contacts were fabricated on these layers and the layers exhibit significantly high electron concentration with carrier mobility μ of up to 10.78 cm² V⁻¹ s⁻¹. Furthermore, we show how these layers can be processed with conventional device processing techniques.     

Investigation of dual ion beam sputtered transparent conductive Ga-doped ZnO films

Ga-doped ZnO (GZO) transparent conducting films were deposited on sapphire (0001) substrates using dual ion beam sputtering deposition system. The impact of growth temperature on the structural, morphological, elemental, optical, and electrical properties was thoroughly investigated and reported. X-ray diffraction measurements explicitly confirmed that all GZO films had (002) preferred crystal orientation. The film deposited at 400 °C exhibited the narrowest full-width at half-maximum value of 0.24° for (002) crystalline plane and the lowest room temperature electrical resistivity of 4.11 × 10^?3 Ω cm. The Raman spectra demonstrated the vibrational modes at 576 and 650–670 cm^?1, associated with native oxygen vacancies and elemental Ga doping in ZnO lattice, respectively. All doped films showed an overall transmittance of above 95 % in the visible spectra. A correlation between structural, optical, elemental, and electrical properties with GZO growth temperature was established.     

Effect of thermal annealing on electrical properties of transparent conductive Ga-doped ZnO films prepared by ion-plating using direct-current arc discharge

The effect of thermal annealing on the electrical properties of highly transparent conductive Ga-doped ZnO (GZO) films deposited on glass substrates at 200 °C by an ion-plating deposition was investigated. GZO films were annealed in the temperature range from 200 to 600 °C for 30 min under the atmospheric pressure of high-purity N₂ gas. Up to 300 °C, GZO films were electrically very stable, and there was little change in resistivity. When the annealing temperature exceeded 400 °C, resistivity increased rapidly, originating from an abrupt decrease in carrier concentration. It was suggested to be due to both desorption of Zn from GZO films and grain boundary segregation of Ga dopants.