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1.
本文给出了一种用于双载波正交频分复用的超宽带单片射频收发机芯片。该芯片采用直接变频结构,片内共集成了两路接收机,两路发射机,一个双载波频率综合器并提供控制收发机工作状态的三线串行接口。此芯片使用台积电 0.13 微米射频CMOS工艺制造,尺寸为 4.5mmx3.6mm。测试结果表明:该收发机的接收机链路噪声系数为 5~6.2dB,最大增益为 78~84dB,可变增益为 64dB,带内和带外三阶交调点分别为-6dBm和 4dBm,在所有频带上都获得良好的输入匹配(S11<-10);该收发机的发射机最大可输出-5dBm 功率,带内主要杂散均小于 -33dBc(镜像抑制<-33dBc,载波泄露<-34dBc),典型的输出三阶交调点为 6dBm;该收发机的双载波频率综合器可以同时输出两路频率可独立配置的载波信号,其跳频时间小于1.2ns。在1.2V单电源供电下,整个射频芯片消耗最大电流为420mA。  相似文献   

2.
本文介绍一种应用于3.1-4.8GHz 多频带正交频分复用超宽带系统的CMOS射频收发机芯片的设计和实现。射频收发机采用零中频结构,主要模块包括:增益可控的宽带低噪声放大器、正交跨导复用下变频混频器、5阶Gm-C切比雪夫低通滤波器及可变增益放大器;采用多项滤波器进行边带杂散抑制的快速跳变频率综合器;宽带线性上变频正交调制器、片内有源双转单电路及输出可变增益放大器。芯片测试结果表明,接收机最大能够获得68dB的电压增益,其中42dB为可变增益,增益步长为6dB;在三个子带内的噪声系数为5.5~8.8dB;带内IIP3和带外IIP3不低于-4dBm和9dBm;发射机能够提供-10.7~-3dBm的输出功率,7.7dB的增益可控;输出1dB压缩点不低于-7.7dBm;发射信号边带抑制为32.4dBc,载波泄漏抑制可达31.1dBc;频率综合器的快速跳边时间低于2.05nS。芯片采用Jazz 0.18μm射频CMOS工艺流片,包括ESD防护PAD在内芯片总面积为6.1mm2;在1.8V的电源电压下,整个芯片的工作电流为221mA (RX+TX+SYN+Buffers)。  相似文献   

3.
郑仁亮  任俊彦  李巍  李宁 《半导体学报》2009,30(12):125003-8
本文介绍一种应用于3.1-4.8GHz 多频带正交频分复用超宽带系统的低功耗射频CMOS发射机芯片的设计和实现。发射机系统主要由电压电流跨导级、正交上变频调制器、有源双转单转换器、输出增益可控功率放大器以及产生正交差分LO信号的除2除法器等模块组成。使用上调制器,双转单及输出放大器分段谐振技术解决3.1-4.8GHz宽带增益平坦度问题;使用源级电阻负反馈镜像跨导解决系统低电压高线性度问题;使用无源电感谐振双转单电路及增益可控放大器进行低功耗设计。测试结果表明,芯片能够提供-10.7到-3.1dBm的功率输出,并且在子带增益平坦度低于3dB;输出三阶交调量最高可达12dBm;不低于30dBc的载波抑制和35dBc以上的边带抑制。芯片采用Jazz 0.18μm射频CMOS工艺流片,包括ESD防护PAD在内芯片总面积为1.74mm2。 在1.8V的电源电压下,芯片总电流为32mA。  相似文献   

4.
针对WiFi 6的设备需求,设计了一款工作在5.15 GHz~5.85 GHz的高线性度砷化镓异质结双极型晶体管射频功率放大器。为了保证大信号和高温下功率管静态工作点的稳定性,采用了一种新型有源自适应偏置电路。对射频功率检测电路进行了设计和改进,有效降低了射频系统的功耗。针对各次谐波分量产生的影响,对输出匹配网络进行了优化。仿真结果表明:该射频功率放大器芯片小信号增益达到了32.6 dB;在中心频率5.5 GHz时1 dB压缩点功率为30.4 dBm,功率附加效率超过27.9%;输出功率为26 dBm时,三阶交调失真低于-40 dBc。实测数据表明:小信号增益大于31.4 dB;5.5 GHz时1 dB压缩点功率为29.06 dBm;输出功率为26 dBm时,三阶交调失真低于-30 dBc。当输出功率为20 dBm时,二次三次谐波抑制到-30 dBc和-45 dBc。  相似文献   

5.
针对一种特定的射频识别技术的通讯协议(ISO1800-6B),提出了一种应用于射频识别读写器中的发射机前端结构,以实现发射信号的OOK调制.采用0.18μm CMOS工艺实现的这种高效率、高度集成的无线发射机前端由射频信号调制器、E类功率放大器以及相应的逻辑控制单元组成,其中的功率放大器的小信号增益约为23dB,其1dB压缩点输出功率为17.6dBm,最大输出功率为19.0dBm,而最大功率增加效率为35.4%.整个发射机的输出信号满足相应协议的特定要求,可以实现不同调制深度(18%和100%)的射频信号输出.  相似文献   

6.
针对一种特定的射频识别技术的通讯协议(ISO1800-6B),提出了一种应用于射频识别读写器中的发射机前端结构,以实现发射信号的OOK调制.采用0.18μm CMOS工艺实现的这种高效率、高度集成的无线发射机前端由射频信号调制器、E类功率放大器以及相应的逻辑控制单元组成,其中的功率放大器的小信号增益约为23dB,其1dB压缩点输出功率为17.6dBm,最大输出功率为19.0dBm,而最大功率增加效率为35.4%.整个发射机的输出信号满足相应协议的特定要求,可以实现不同调制深度(18%和100%)的射频信号输出.  相似文献   

7.
《今日电子》2011,(8):63-64
CMPA5585025F MMIC采用多引脚陶瓷/金属封装,是一款50Ω、25W峰值功率的双级GaN HEMT高功率放大器(HPA)。MMIC的工作瞬时带宽为5.8~8.4GHz,提供15W线性功率(〈-30dBc的相邻频道功率)与20dB功率增益。在该线性运行功率下,功率附加效率为25%。  相似文献   

8.
陈云锋  高亭  李巍  李宁  任俊彦 《半导体学报》2011,32(5):055004-7
本文设计了一个全集成双模式 6-9 GHz 多带正交频分复用超宽带发射机,兼容 WiMedia 和中国标准。所设计的发射机主要包括:双模式的低通滤波器,上混频器,两级功率放大器以及一个用于产生本振信号的高频宽带频率除法器。 测试结果表明,此发射机在 6-8.7 GHz范围内的增益平坦度小于 1.5,而在 6-9 GHz范围内增加到 2.8 dB; 输出三阶交调量约为 13.2 dBm;输出 1dB 压缩点约为 2.8 dBm; 载波泄漏和边带抑制比分别为 -35dBc 和 -38 dBc。 本芯片采用 TSMC 0.13 μm 射频 CMOS 工艺制造,面积为 1.6 mm1.3 mm。在 1.2 V 电源电压下核心电路消耗电流为 46 mA。  相似文献   

9.
针对无线通信应用系统,采用了一种具有温度补偿特性的偏置电路和一种带有谐波抑制功能的输出匹配网络,设计了一款高线性高谐波抑制的功率放大器。该功率放大器采用InGaP/GaAs HBT工艺,工作频率为1.84 GHz,供电电压为4.5 V,偏置电压为2.85 V。测试结果表明,常温下,功率放大器的增益为32 dB,饱和输出功率可达33 dBm,二次、三次谐波分量都小于-55 dBc,在输出功率为24.5 dBm时,邻道抑制比为-47 dBc,在-40~85℃温度变化范围内,功率放大器增益与邻道抑制比基本不变。  相似文献   

10.
提出了一种增益高且增益可调谐的1~3 GHz宽带低噪声放大器(HTG-LNA)。在输入级,采用带有RC串联负反馈的共基-共射电流镜结构,实现了良好的输入匹配,并提高了电路的稳定性;在中间级,采用以有源电感作为负载的共基-共射达林顿电路结构,在保证宽带的同时实现了较高的增益与增益的可调谐;在输出级,采用带有电流镜的射极跟随器结构,获得了较大的输出功率和良好的输出匹配。基于稳懋0.2 μm GaAs HBT工艺进行验证,结果表明,该HTG-LNA的电压增益大于37 dB,最高可达50.7 dB;功率增益大于37.4 dB,最高可达51 dB;最大增益可调谐幅度为2.2 dB;输入回波损耗小于-7.11 dB;输出回波损耗小于-11.97 dB;噪声系数小于3.23 dB;稳定因子大于5.61;在5 V工作电压下,静态功耗小于65 mW。  相似文献   

11.
A highly linear,high output power,0.13μm CMOS direct conversion transmitter for wideband code division multiple access(WCDMA) is described.The transmitter delivers 6.8 dBm output power with 38 mA current consumption.With careful design on the resistor bank in the IQ-modulator,the gain step accuracy is within 0.1 dB,hence the image rejection ratio can be kept below—47 dBc for the entire output range.The adjacent channel leakage ratio and the LO leakage at 6.8 dBm output power are -44 dBc @ 5 MHz and -37 dBc,respectively,and the corresponding EVM is 3.6%.The overall gain can be programmed in 6 dB steps in a 66-dB range.  相似文献   

12.
A highly integrated 2-GHz, 0.13-/spl mu/m CMOS direct-conversion transmitter for wide-band code division multiple access (WCDMA) is described. Different circuit and calibration techniques are presented that successfully suppress the carrier leakage and enable the direct-upconversion architecture to meet all WCDMA specifications. The transmitter delivers +2.5 dBm output power while consuming only 45 mA from its nominal 1.5-V supply. The overall gain can be programmed in 1-dB steps over a 100-dB range with 0.4 dB accuracy. The transmitter achieves an OIP3 of +19.3 dBm, an error vector magnitude of 4.3%, and an adjacent channel leakage ratio of -38 dBc. The measured output noise of -146 dBm/Hz in the DCS Rx band and -149 dBm/Hz in the UMTS Rx band is sufficiently low to provide an option to increase the integration level even further by eliminating the external Tx interstage filter between the power amplifier and its driver.  相似文献   

13.
A direct conversion front-end transmitter with the properties of high linearity and high single sideband rejection ratio is described in this paper. The transmitter employs two resonant matching techniques to improve its operating bandwidth. The first resonant circuit design is applied at the inter-stage of the LO input buffer in order to achieve a wideband frequency response which ranges from dc to 6 GHz. The second resonant circuit is applied at the power amplifier (PA) driver output stage to increase the matching bandwidth and meet both the Worldwide Interoperability for Microwave Access (WiMAX) and Wireless Broadband (WiBro) applications simultaneously. In addition, the sideband signal and carrier leakage of this transmitter are further minimized by a proposed calibration circuit design to achieve the error vector magnitude (EVM) specifications. The measured single sideband performance with calibration mechanism demonstrates approximately 15 dB improvement on sideband and carrier suppression. The rejected sideband and carrier signals can be up to 55.19 and 56.31 dBc, respectively. The measured dynamic gain range of the transmitter is 53 dB in 1-dB step with a maximum relative gain error lower than 0.4 dB. The transmitter delivers +0.766 dBm output power with EVM of −34.687 dB for the orthogonal frequency division multiple access (OFDMA) 64QAM-3/4 modulated signals. The measured constellation is minimized to be <1.5% with output power from −2.3 to −36.2 dBm.  相似文献   

14.
A monolithic RF transceiver for an MB-OFDM UWB system in 3.1-4.8 GHz is presented.The transceiver adopts direct-conversion architecture and integrates all building blocks including a gain controllable wideband LNA,a I/Q merged quadrature mixer,a fifth-order Gm-C bi-quad Chebyshev LPF/VGA,a fast-settling frequency synthesizer with a poly-phase filter,a linear broadband up-conversion quadrature modulator,an active D2S converter and a variablegain power amplifier.The ESD protected transceiver is fabricated in Jazz Semiconductor's 0.18-μm RF CMOS with an area of 6.1 mm2 and draws a total current of 221 mA from 1.8-V supply.The receiver achieves a maximum voltage gain of 68 dB with a control range of 42 dB in 6 dB/Step,noise figures of 5.5-8.8 dB for three sub-bands,and an inband/out-band IIP3 better than-4 dBm/+9 dBm.The transmitter achieves an output power ranging from-10.7 to-3dBm with gain control,an output P1dB better than-7.7 dBm,a sideband rejection about 32.4 dBc,and LO suppression of 31.1 dBc.The hopping time among sub-bands is less than 2.05 ns.  相似文献   

15.
In this paper, a low-power low-IF receiver and a direct-conversion transmitter (DCT) suitable for the IEEE standard 802.15.4 radio system at the 2.4-GHz band are presented in 0.18-mum deep n-well CMOS technology. By using vertical NPN (V-NPN) bipolar junction transistors in the baseband analog circuits of the low-IF receiver, the image rejection performance is improved and the power consumption is reduced. In addition, by applying the V-NPN current mirrored technique in a DCT, the carrier leakage is reduced and the linearity performance is improved. The receiver has 10 dB of noise figure, -15 dBm of third-order input intercept point, and 35 dBc of image rejection. The transmitter has more than -2 dBm of transmit output power, -35 dBc of local oscillator leakage, and -46 dBc of the transmit third harmonic component. The receiver and transmitter dissipate 6 and 9 mA from a 1.8-V supply, respectively  相似文献   

16.
This paper presents the design and integration of a fully-integrated dual-conversion zero-IF2 CMOS transceiver for 9-band MB-OFDM UWB systems from 3.1 GHz to 8.0 GHz. The transceiver integrates all building blocks including a variable-gain wideband LNA, a single combined mixer for both RF down-conversion in RX and up-conversion in TX, a fast-settling frequency synthesizer, and IQ ADCs and DACs. Fabricated in a standard 0.18- mum CMOS process, the receiver measures maximum S11 of - 13 dB, maximum NF of 8.25 dB, in-band IIP3 of better than -13.7 dBm, and variable gain from 25.3 to 84.0 dB. IQ path gain and phase mismatches of the receiver chain are measured to be 0.8 dB and 4 deg, respectively. The transmitter achieves a minimum output P-1 dB of -8.2 dBm, sideband rejection of better than -42.2 dBc, and LO leakage of smaller than - 46.5 dBc.  相似文献   

17.
Kim  J.H. Noh  Y.S. Park  C.S. 《Electronics letters》2003,39(10):781-783
A highly linear MMIC power amplifier for wideband code-division multiple-access (W-CDMA) portable terminals has been devised and implemented with a new integrated on-chip lineariser. The proposed lineariser, consisting of an InGaP/GaAs heterojunction bipolar transistor (HBT) active bias circuit partially coupled to RF input power together with a feedback capacitor, effectively improves gain compression with little insertion power loss and no additional die area. The optimised lineariser improves maximum output power (P1 dB) by 2 dB and adjacent channel leakage power ratio (ACLR) by 4 dB, and the implemented HBT MMIC power amplifier exhibits a P1 dB of 30 dBm, a power gain of 30 dB, a power added efficiency of 42% at the maximum output power under an operation voltage of 3.4 V, and an ACLR of -34 dBc at 27 dBm of output power.  相似文献   

18.
A fully integrated low power RF transmitter for a WiMedia 3.1-4.8 GHz multiband orthogonal frequency division multiplexing ultra-wideband system is presented. With a separate transconductance stage, the quadrature up-conversion modulator achieves high linearity with low supply voltage. The co-design of different resonant frequencies of the modulator and the differential to single (D2S) converter ensures in-band gain flatness. By means of a series inductor peaking technique, the D2S converter obtains 9 dB more gain without extra power consumption. A divided-by-2 divider is used for carrier signal generation. The measurement results show an output power between -10.7 and -3.1 dBm with 7.6 dB control range, an OIP3 up to 12 dBm, a sideband rejection of 35 dBc and a carrier rejection of 30 dBc. The ESD protected chip is fabricated in the Jazz 0.18/zm RF CMOS process with an area of 1.74 mm~2 and only consumes 32 mA current (at 1.8 V) including the test associated parts.  相似文献   

19.
This paper describes the design of a 5.7–6.4GHz GaAs Heterojunction bipolar transistor (HBT) power amplifier for broadband wireless application such as wireless metropolitan area networks. A bias circuit is proposed which enhances the power gain and provides a good linearity. Using the wideband matching network tech-niques with trap circuits embedded to filter the harmonics and the diode-based linearizing techniques, a broadband power amplifier module was obtained which exhibited a gain above 28dB. This is about 1dB improvement com-pared with those normal bias circuits at a supply volt-age of 5V in the frequency range of 5.7–6.4GHz, measured with Continuous wave(CW) signals. The saturated output power was greater than 33dBm in 5.7–6.4GHz and the out-put 1dB compression point was greater than 31dBm. The phase deviation was less than 5 degrees when the output power below 33dBm. The second and third order harmonic components were also less than -45dBc and -50dBc.  相似文献   

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