Size Control of Nanoscale Silicon Particles Formed in Thermally Annealed A-Si ： H Films and Its Photoluminescence

A method to control the size of nanoscale silicon grown in thermally annealed hydrogenated amorphous silicon （a-Si：H） films is reported. Using the characterizing techniques of micro-Raman scattering, X-ray diffraction and computer simulation, it is found that the sizes of the formed silicon particles change with the temperature rising rate in thermally annealing the a-Si ： H films. When the a-Si：H films have been annealed with high rising rate（～100℃/s）, the sizes of nanoscale silicon particles are in the range of 1.6～15nm. On the other hand, if the a-Si：H films have been annealed with low temperature rising rate（～1℃/s）, the sizes of nanoscale silicon particles are in the range of 23～46nm. Based on the theory of crystal nucleation and growth, the effect of temperature rising rate on the sizes of the formed silicon particles is discussed. Under high power laser irradiation, in situ nanocrystallization and subsequent nc-Si clusters are small enough for visible light emission, authors have not detected any visible photoluminescence（PL） from these nc-Si clusters before surface passivation. After electrochemical oxidization in hydrofluoric acid, however, intense red PL has been detected. Cyclic hydrofluoric oxidization and air exposure can cause subsequent blue shift in the red emission. The importance of surface passivation and quantum confinement in the visible emissions has been discussed.     

High-yield synthesis of silicon nanoparticles via the perpendicular pulsed laser ablation in the inert gas

Si nanoparticles are synthesized at a high rate(400-500 mg/h) using the perpendicular pulsed laser ablation(PPLA) on the silicon target at room temperature in Ar atmosphere.The PPLA method can also be used to obtain Si nanocrystal films with large areas on the glass substrate.These particles are etched with a mixture of hydrofluoric acid(HF) and nitric acid(HNO3) to reduce their sizes and the surfaces of these particles are passivated by the high-pressure water vapor annealing(HWA).After treatin...     

磁控溅射掺铒富硅氮化硅薄膜的光致荧光谱

Er-doped silicon-rich silicon nitride （SRN） films were deposited on silicon substrate by an RF magnetron reaction sputtering system. After high temperature annealing, the films show intense photoluminescence in both the visible and infrared regions. Besides broad-band luminescence centered at 780 nm which originates from silicon nanocrystals, resolved peaks due to transitions from all high energy levels up to 2H11/2 to the ground state of Er^3＋ are observed. Raman spectra and HRTEM measurements have been performed to investigate the structure of thefilms, and possible excitation processes are discussed.     

酞菁锌/氢化非晶硅复合薄膜光电性质的研究

Composites consisting of hydrogenated amorphous silicon （a-Si： H, inorganic） and zinc phthalocyanine （ZnPc, organic） were prepared by vacuum evaporation of ZnPc and sequential deposition amorphous silicon via plasma enhanced chemical vapor deposition （PECVD）. The optical and electrical properties of the composite film have been investigated. The results demonstrate that ZnPc can endure the temperature and bombardment of the PECVD plasma and photoconductivity of the composite film was improved by 89.9% compared to pure a-Si： H film. Electron mobility-lifetime products/lr of the composite film were increased by nearly one order of magnitude from 6.96 × 10^-7 to 5.08 × 10^-6 cm2/V. Combined with photoconductivity spectra of the composites and pure a-Si： H, we tentatively elucidate the improvement in photoconductivity of the composite film.     

Photoconductive properties of lead iodide films prepared by electron beam evaporation

Lead iodide(PbI_2) films have been prepared by the electron beam evaporation technique,and their photoconductive response to visible light was investigated under different deposition and illumination conditions.It is found that the films' photoconductive response speed increases and the relative sensitivity decreases with the increase of substrate temperature due to the opposite requests for photo-carrier lifetime.Further,appropriately increasing the film's thickness and rising substrate temperature simu...     

Luminescent chemically-etched porous poly-crystalline silicon on insulating substrates

Polycrystalline silicon deposited on insulating substrates has been chemically-etched to form thin films of porous material exhibiting room temperature visible photoluminescence with emission wavelengths of around 650 nm. Material of 4000 ? thickness was quickly converted to porous silicon within 15 s of etching, with an etch rate of 1–1.5 μm/h. In contrast to anodization, chemical-etching parameters have little effect on modulating the resultant peak wavelength. Peak photoluminescence intensity was achieved 8–12 s of etching in 1:3:5 parts HF:HNO₃:H₂O at room temperature with ambient lighting. The chemical etching process and its etch characteristics have been discussed in relation to its suitability for large area thin film devices.     

Dependence of Threshold Voltage of a-Si:H TFT on a-SiNx:H Film^①

The relation between threshold voltage for hydrogenated amorphous silicon thin film transistors(a-Si:HTFTs)and deposition conditions for hydrogenated amorphous silicon nitride(a-SiNx:H)films is investigated.It is observed that the threshold voltage,Vth,of a-Si:HTFT increases with the increase of the thickness of a-SiNx:H film,and the threshold voltage is reduced apparently with the increase of NH3/SiH4 gas flow rate ratio.     

360-nm Photoluminescence from Silicon Oxide Films Embedded with Silicon Nanocrystals

Si-rich silicon oxide films were deposited by RF magnetron sputtering onto composite Si/SiO2 targets. After annealed at different temperature, the silicon oxide films embedded with silicon nanocrystals were obtained. The photoluminescenee（PL） from the silicon oxide films embedded with silicon nanocrystals was observed at room temperature. The strong peak is at 360 nm, its position is independent of the annealing temperature. The origin of the 360-nm PL in the silicon oxide films embedded with silicon nanoerystals was discussed.     

快速退火BF+注入非晶硅薄膜的显微分析

BF⁺ with 92keV and 1×10¹⁵/cm² was implanted into a-Si∶H film prepar ed by PECVD,then implanted sample has been rapid annealed using CWCO₂ Laser wi th output of 60W and spot size 0.2cm in diameter at 10s time.Microscopic topogr aphies analysis with SEM indicate thatUnder our annealing condition,the profile s of multi-structure defects in a-Si∶H film produced by BF⁺ implanting are some shapes of rectangle-like and square-like.Crystallization started from the edges of multi-structure defects.Crystallized procedure and the mechanism have been discussed.     

Characteristic diode parameters in thermally annealed Ni/p-InP contacts

The Ni/p-InP Schottky diodes（SDs） have been prepared by DC magnetron sputtering deposition. After the diode fabrication, they have been thermally annealed at 700 ℃ for 1 min in N2 atmosphere. Then, the current–voltage characteristics of the annealed and non-annealed（as-deposited） SDs have been measured in the measurement temperature range of 60–400 K with steps of 20 K under dark conditions. After 700 ℃ annealing,an improvement in the ideality factor value has been observed from 60 to 200 K and the barrier height（BH）value approximately has remained unchanged in the measurement temperature range of 200–400 K. The BH of the annealed diode has decreased obeying the double-Gaussian distribution（GD） of the BHs with decreasing measurement temperature from 200 to 60 K. The BH for the as-deposited diode has decreased with decreasing temperature obeying the single-GD over the whole measurement temperature range. An effective Richardson constant value of54:21 A/cm²K² for the as-deposited SD has been obtained from the modified Richardson plot by the single-GD plot, which is in very close agreement with the value of 60 A/K²cm² for p-type InP. The series resistance value of the annealed SD is lower than that of the non-annealed SD at each temperature and approximately has remained unchanged from 140 to 240 K. Thus, it can be said that an improvement in the diode parameters has been observed due to the thermal annealing at 700 ℃ for 1 min in N₂ atmosphere.     

Photoconductive properties of lead iodide films prepared by electron beam evaporation

Lead iodide (PbI2) films have been prepared by electron beam evaporation technique, and their photoconductive response to visible light was investigated under different deposition and illumination conditions. It is found that the films’ photoconductive response speed increases and the relative sensitivity decreases with the increase of substrate temperature due to the opposite requests for photo-carrier lifetime. Further, appropriately increasing the film’s thickness and rising substrate temperature simultaneously can effectively balance the opposite demands. Under the optimized conditions of substrate temperature of 200℃, source-substrate distance of 30cm and deposition time of 10min, the prepared films exhibit best response properties. In addition, the response to illumination with different wavelengths was also measured, revealing that the decline of response performance with increasing wavelength is due to lower photon energy of incident light.     

Influence of substrate temperature on the deposition and structural properties of μc-Si: H thin films fabricated with VHF-PECVD

With in situ optical emission spectroscopy (OES) diagnosis on VHF-generated H₂+SiH₄ plasmas, and with the measurements of deposition rate and structure of μc-Si: H thin films fabricated with VHF-PECVD technique at different substracte temperature, influence of substrate temperature on the deposition of μc-Si: H thin film and on its structural properties have been investigated. The results show that with the increase of substrate temperature, the crystalline volume fraction Xc and average grain size d are enhanced monotonously, but the deposition rate increases firstly and then decreases. The optimized substrate temperature for (μc-Si: H thin films deposition under our current growth system is about 210 °C, at which deposition rate 0.8 nm/s of μc-Si: H thin film with Xc?60% and d?9 nm can be obtained.     

Dielectric Characteristics of Ba0.65Sr0.35TiO3 Thin Films Sol-Gel Method

Ferroelectric Ba0.65Sr0.35TiO3 （BST） thin films on the Pt/Ti/SiO2/Si substrate have been successfully prepared by sol-gel. Such films have approximately 300 nm thicknesses with a remnant polarization of about 2.95 μ℃/cm^2 and a coercive field of about 21.5 kV/cm. The investigations of X-ray diffraction and atomic force microscopy show that the BST films annealed at 650 ℃ exhibit a tetragonal structure and that the films dominantly consist of large column or grains of about 89 nm in diameter. The curves of the temperature dependence of dielectric coefficient in different frequencies display the curie transition at the temperature around 23 ℃. The dielectric loss tangent of BST thin fdms at 100 kHz is less than 0.04. As a result, the BST thin films are more applicable for fabrication of infrared detector compared with the BST thin films reported previously.     

Nanoscale strained-Si MOSFET physics and modeling approaches: a review

In this paper, an attempt has been made to give a detailed review of strained silicon technology. Various device models have been studied in this paper that consider the effect of strain on the devices and their comparisons have been drawn. A review of some modeling issues in strained silicon technology has also been outlined. The review indicates that this technology is very much required in nanoscale MOSFETs due to its several potential benefits and there is a strong need of an analytical model which describes the complete physics of the strain technology.     

Pb(Zr_(0.52)Ti_(0.48))O_3 memory capacitor on Si with a polycrystalline silicon/SiO_2 stacked buffer layer

Pb(Zr_(0.52)Ti_(0.48))O_3(PZT) thin films have been deposited on a p-type Si substrate separated by a polycrystalline silicon/SiO_2 stacked buffer layer.The X-ray diffraction peaks of the PZT thin films prepared on the polycrystalline silicon annealed at different temperatures were measured.In addition,the polarization of the Pt/PZT/polycrystalline silicon capacitor has been investigated.The memory capacitor of the metal/ferroelectric/polycrystalline silicon/SiO_2/semiconductor structure annealed at 650℃...     

沉积、退火条件以及刻蚀液对PECVD氮化硅薄膜湿法刻蚀速率的影响

The influence of deposition, annealing conditions, and etchants on the wet etch rate of plasma enhanced chemical vapor deposition （PECVD） silicon nitride thin film is studied. The deposition source gas flow rate and annealing temperature were varied to decrease the etch rate of SiNx：H by HF solution. A low etch rate was achieved by increasing the SiH4 gas flow rate or annealing temperature, or decreasing the NH3 and N2 gas flow rate. Concentrated, buffered, and dilute hydrofluoric acid were utilized as etchants for Sit2 and SiNx：H. A high etching selectivity of Sit2 over SiNx：H was obtained using highly concentrated buffered HE     

Dielectric Characteristics of Ba_(0.65)Sr_(0.35)TiO_3 Thin Films by Sol-Gel Method

Ferroelectric Ba0.65Sr0.35TiO3(BST) thin films on the Pt/Ti/SiO2/Si substrate have been successfully prepared by sol-gel. Such films have approximately 300 nm thicknesses with a remnant polarization of about 2.95 μC/cm2 and a coercive field of about 21.5 kV/cm. The investigations of X-ray diffraction and atomic force microscopy show that the BST films annealed at 650 °C exhibit a tetragonal structure and that the films dominantly consist of large column or grains of about 89 nm in diameter. The curves of the temperature dependence of dielectric coefficient in different frequencies display the curie transition at the temperature around 23 °C. The dielectric loss tangent of BST thin films at 100 kHz is less than 0.04. As a result,the BST thin films are more applicable for fabrication of infrared detector compared with the BST thin films reported previously.     

Investigation of Induced Distortions in a-Si∶H/a-SiNx∶H Multilayers by Raman Scattering Technique

The a-Si∶H/SiNx∶H sample series are investigated by means of Raman scattering technique(RST). The result shows that due to the structural mismatch between a-Si∶H and a-SiNx∶H, severe induced distortions are produced in the interface of the heterojunction, and these induced distortions tend towards a certain energy state. The ordering of the interface structure depends on the periodic number of multilayer thin films.     

Cadmium sulfide thin films growth by chemical bath deposition

Cadmium sulfide (CdS) thin films have been prepared by a simple technique such as chemical bath deposition (CBD).A set of samples CdS were deposited on glass substrates by varying the bath temperature from 55 to 75 ℃ at fixed deposition time (25 min) in order to investigate the effect of deposition temperature on CdS films physical properties.The determination of growth activation energy suggests that at low temperature CdS film growth is governed by the release of Cd2+ ions in the solution.The structural characterization indicated that the CdS films structure is cubic or hexagonal with preferential orientation along the direction (111) or (002),respectively.The optical characterization indicated that the films have a fairly high transparency,which varies between 55％ and 80％ in the visible range of the optical spectrum,the refractive index varies from 1.85 to 2.5 and the optical gap value of which can reach 2.2 eV.It can be suggested that these properties make these films perfectly suitable for their use as window film in thin films based solar cells.     

Electrochemical C-V Characteristics and Photoluminescence of a-C∶N Films

Amorphous carbon (a-C) films and amorphous carbon films incorporating with the nitrogen (a-C∶N) were deposited on silicon substrates in a radio-frequency driven plasma enhanced chemical vapour deposition system, while the surface electrical properties of films were investigated by electrochemical capacitance-voltage measurements. It was examined the effect of the interface defects on the properties and deduced that the conducting type of a-C∶N films was n-type. Subsequently, a comparative studies of a-C and a-C∶N films were performed by photoluminescence spectra depending on the temperature. With the decrease of the temperature, the main band with peak energy of 2.48 eV in the a-C∶N films was more intense compared with the other three bands caused by amorphous C in the a-C films.