Ar~+激光结晶非晶硅膜电学性质研究

本文使用TEM分析、X射线衍射以及电导和霍耳效应联合测量等手段研究了Ar~+激光结晶a-Si:H膜的结构和电学性质.结果表明a-Si:H液相激光结晶膜(LP-LCR)的平均晶粒尺寸达数十微米,呈<111>择优取向,室温电导率为1.5(Ω·cm)~(-1),电子霍耳迁移率达36cm~2V~(-1)s~(-1),是一种有应用前景的薄膜.     

Al/a-Si:H界面反应和热处理行为光发射研究

利用XPS和AES对Al/a-Si∶H界面进行了研究.实验结果表明,最初阶段Al淀积在a-Si∶H上出现金属团.Al淀积量超过一定值后,起化学反应的Al和Si形成了互溶区,同时没有化学反应的Al在表面上形成金属Al层.此外,真空热处理加剧了Al/aSi∶H的界面反应和元素互扩散.     

Pd/a-Si:H界面的光电子能谱研究

本文利用光电子能谱(XPS、UPS)技术研究了Pd淀积层与离子注入制备的a-Si∶H层组成的系统.本工作分析了Pd/a-Si∶H的界面键合状态及组分分布的变化对价带谱与芯能级谱的影响,并与Pd/C-Si系统的结果进行了比较.结果表明:Pd/a-Si∶H界面具有与Pd/C-Si界面相似的电子结构;但是,Pd原子在a-Si∶H中具有较大的扩散速率,因此,处于更富Si的环境中。     

a-Si/poly-Si叠层太阳能电池的空间电荷效应和稳定性分析

基于pin结构的a-Si∶H太阳能电池中的空间电荷效应,讨论了a-Si/poly-Si叠层太阳能电池的稳定性.结果表明,在光照射下,光生空穴俘获造成了a-Si∶H中正空间电荷密度的增加,从而改变了电池内部的电场分布,提高了a-Si∶H薄膜中的电场强度.空间电荷效应不会给a-Si/poly-Si叠层结构中的a-Si∶H薄膜带来准中性区(低场"死层"),也没有发生a-Si/poly-Si叠层太阳能电池的光诱导性能衰退,因而a-Si/poly-Si叠层结构太阳能电池具有较高的稳定性.     

非晶硅和微晶硅的生长机理与结构模型研究

我们利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)对a-Si,a-Si∶H,a-Si∶Cl和μc-Si薄膜进行了观测。文中讨论了a-Si(或a-Si∶H,a-Si∶Cl)和μc-Si薄膜的生长机理;提出了可能的结构模型,即a-Si(或a-Si∶H,a-Si∶Cl)薄膜具有卵石状结构或柱状结构,μc-Si薄膜具有锥状结构。     

激光定域晶化技术制备纳米硅的研究

利用相移光栅模板使KrF准分子激光形成强度周期分布的激光束,定域晶化a-Si∶H(4nm)/a-SiNx∶H(10nm)多层膜中的超薄a-Si∶H层,成功地制备出了三维有序分布的nc-Si阵列。原子力显微镜(AFM)、微区喇曼光谱、剖面透射电子显微镜(X-TEM)及高分辨电子显微镜(HREM)技术分析揭示了晶化后薄膜中形成了横向周期与移相光栅周期相同、纵向周期与a-Si∶H/a-SiNx∶H多层膜周期(14nm)相等的nc-Si阵列。     

退火气氛对铝诱导a-Si薄膜结晶过程的影响

以玻璃为衬底,室温条件下采用直流磁控溅射技术制备了Glass/Al/a-Si样品.在H2,N2和空气3种不同气氛中进行了退火处理.分别采用XRD,Raman光谱和SEM研究了退火气氛对a-Si薄膜销诱导晶化(AIC)过程的影响.XRD实验结果表明:a-Si薄膜在H2气氛中400℃下经过90min的退火处理就能得到结晶较好的poly-si薄膜.Raman光谱实验结果表明:在500℃下退火处理,相同时间内H2气氛中a-Si结晶程度最好,空气气氛中结晶程度最差.这是因为高温H2退火过程中,高活性H原子能将弱的Si-Si键破坏,并与之反应形成强Si-Si键,使得薄膜结构更加稳定有序,同时能加速薄膜中氧的外扩散,促使薄膜晶化.     

退火气氛对铝诱导a-Si薄膜结晶过程的影响

以玻璃为衬底,室温条件下采用直流磁控溅射技术制备了Glass/Al/a-Si样品.在H2,N2和空气3种不同气氛中进行了退火处理.分别采用XRD,Raman光谱和SEM研究了退火气氛对a-Si薄膜销诱导晶化(AIC)过程的影响.XRD实验结果表明:a-Si薄膜在H2气氛中400℃下经过90min的退火处理就能得到结晶较好的poly-si薄膜.Raman光谱实验结果表明:在500℃下退火处理,相同时间内H2气氛中a-Si结晶程度最好,空气气氛中结晶程度最差.这是因为高温H2退火过程中,高活性H原子能将弱的Si-Si键破坏,并与之反应形成强Si-Si键,使得薄膜结构更加稳定有序,同时能加速薄膜中氧的外扩散,促使薄膜晶化.     

衬底对a-Si:H激光结晶的影响

文章报道了a-Si∶H在石英,SiO_2/Si,WSi_2/Si和Al/Si四种不同衬底上激光结合的结果.     

μc-Si∶H/a-Si∶H多层膜的周期性结构和量子尺寸效应

利用射频辉光放电法,通过周期性交替切换两种耦合电极的方式,制备了μc-Si∶H/a-Si∶H多层膜．低角度X射线衍射(LAXRD)测试表明,这种多层膜具有良好的周期性结构．观察了上述多层膜的光学性质及电导率与温度的关系,发现其吸收边随着a-Si∶H层的减薄而蓝移,低温下的电导激活能Ea随着a-Si∶H层的减薄而减小     

Grain boundary diffusion mechanisms in metals

In recent years it has become well established that fast diffusion along grain boundaries plays a key role in many important metallurgical processes including cases where net mass is transported along boundaries which act as sources and/or sinks for the fluxes of atoms. In addition, considerable advances have been made in understanding grain boundary structure, and new techniques have become available for studying kinetic phenomena in grain boundaries. This lecture will attempt to review our current knowledge of the atomistic mechanisms responsible for these grain boundary diffusion phenomena. Relevant aspects of the structure of grain boundaries and the point and line defects which may exist in grain boundaries are described first. The important experimental observations are then discussed. Diffusion models are then taken up, and it is concluded that the atomic migration occurs by a point defect exchange mechanism which, in at least the vast majority of boundaries in simple metals, most likely involves grain boundary vacancies. The grain boundary sources and/or sinks required to support divergences in the atomic (vacancy) fluxes are grain boundary dislocations. Phenomena therefore occur which resemblethe Kirkendall Effect in the bulk lattice in certain respects. Additional topics are discussed which include effects of boundary structure on boundary diffusion and the question of whether or not boundary diffusion is faster along migrating than stationary boundaries.     

Oxygen and indium diffusion into SiO2 encapsulated polycrystalline CdSe films

The diffusion of oxygen into SiO₂ encapsulated polycrystalline CdSe films and the diffusion of indium into polycrystalline CdSe films have been investigated over the temperature range 350 C to 500 C using SIMS. The oxygen profiles in the SiO₂ indicated that both isotopic oxygen exchange and the diffusion of molecular oxygen along short circuit paths were occurring with activation energies of 1.1 eV and 0.66 eV, respectively. The activation energies determined for the diffusion of the oxygen and indium in the grains (0.39 eV and 0.10 eV, respectively) were smaller than the values determined for the diffusion in the grain boundaries (0.70 eV and 0.78 eV, respectively), and was attributed to impurities and intrinsic defects accumulating at the grain boundaries.     

Effects of grain boundaries on the current-voltage characteristics of polycrystalline silicon solar cells

The current components associated with the grain boundaries of diffused p/n junction polysilicon solar cells made on n- and p-type Wacker substrates are analyzed and experimentally identified. New electrical methods for determining the presence or absence of preferential diffusion along the grain boundaries and for determining the average doping density of preferentially diffused regions along the grain boundaries are described. For p-type substrates, these methods revealed preferential phosphorus diffusion along grain boundaries; no preferential boron diffusion along grain boundaries was observed. The recombination current components were analyzed for the cells in which preferential diffusion occurred. The analysis shows that the dominant current component at small bias levels (0-300 mV) is the recombination current at the grain boundaries within the p/n junction space-charge region. At higher bias levels (V simeq V_{OC} simeq 500-600mV), both this current component and the current component due to recombination at that part of the grain boundary below the preferentially diffused region are important. The grain-boundary shunt resistance does not contribute a significant current component. It is shown that the preferential diffusion makes negligible the recombination current injected into the sidewall of the preferentially diffused region. This is consistent with a model in which the phosphorus diffusion significantly lowers the surface recombination velocity at the grain boundaries and in which the retarding built-in electric field further decreases the recombination current.     

Lattice electromigration in narrow Al alloy thin-film conductors at low temperatures

At low temperatures, electromigration in polycrystalline Al thin-film conductors has been considered to occur predominantly along grain boundaries. As conductor widths decrease below the average grain size, however, other transport mechanisms will become important. Here we examine electromigration transport mechanisms in narrow AlSiCu conductors in the temperature range 190 to 290°C using the stripe drift technique. For conductors with widths between 0.9 and 2.75 μm both the absolute values of the drift velocity and the activation energy for drift are consistent with a lattice diffusion mechanism. Over this linewidth range the Al microstructure ranges from near-bamboo to approximately 20 μm long polycrystalline segments. The independence of the drift data from the linewidth shows that steady state transport is controlled by the bamboo regions of the conductors, which results from the slower rate of diffusion of Al through the lattice compared to along grain boundaries.     

SOI/SOI/Bulk-Si triple-level structure for three-dimensional devices

The fabrication procedure of the SOI/SOI/bulk-Si triple-level structure is developed by using the improved selective laser recrystallization technique and MOS LSI technology. The enlarged crystal stripes sandwiched by straight grain boundaries are produced on the planarized insulating film which overlies the device structure in bulk-Si, and also SOI/bulk-Si double-layered structure. The basic characteristics of MOSFET's in a triple-level structure are evaluated.     

Adsorption of alkali metals and their effect on electronic properties of grain boundaries in bulk of polycrystalline silicon

The adsorption of alkali metals and their effect on the electronic properties of grain boundaries in bulk of polycrystalline silicon has been studied experimentally. The results obtained show that the potential barrier grows during diffusion and adsorption of alkali metal atoms along grain boundaries.     

Impact of Al in Cu alloy interconnects on electro and stress migration reliabilities

The reliability of Cu interconnects was successfully improved by applying a CuAl alloy seed. However, the effect of additive Al on the reliability is not fully understood. In order to reveal the reliability improvement mechanism, Cu films using CuAl alloy seed were investigated in detail. As stress induced voiding (SIV) as well as electromigration is caused by migration of vacancies and/or Cu atoms, the measured activation energy value of electromigration using CuAl indicates that the fast diffusion paths are Cu grain boundaries. The analysis using high lateral resolution scanning type secondary ion mass spectrometry (nano-SIMS) clarifies that additive Al in ECP-Cu film is mainly localized at grain boundaries. Furthermore, positron annihilation was used to probe vacancy-type defects in Cu films. The CuAl films before recrystallization contain larger and higher density vacancy-type defects. Whereas, the recrystallized CuAl films after annealing above 250 °C contain smaller and lower density defects. Furthermore, CuAl films with annealing above 350 °C contain less Al inside the grains. These results represent that Al atoms in Cu films with annealing above 350 °C are exhausted from inside grains to the grain boundaries, and the spewed Al atoms existing at Cu grain boundary effectively prevents the diffusion of Cu and/or vacancies.     

Effect of alkali metals on the electronic properties of grain boundaries on a polycrystalline silicon surface

The effect of alkali metals on carrier drift from grain boundaries to a polycrystalline silicon surface is experimentally studied. The results obtained show that an increase in the dopant concentration during the diffusion, desorption, and adsorption of alkali metals along grain boundaries leads to an increase in the potential barrier.     

Moderate inversion in SOI MOSFET's with grain boundaries

Our previous model for the effects of grain boundaries on the strong-inversion (linear region) conductance of silicon-on-insulator (SOI) MOSFET's is extended to account for moderate inversion. The extension, which is supported by measurements of laser-recrystallized devices, predicts a nearly exponential dependence for the conductance on the (front) gate voltage that is controlled by the grain boundaries.