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1.
一种高工作频率、低相位噪声的CMOS环形振荡器   总被引:4,自引:0,他引:4  
采用全开关状态的延时单元和双延时路径两种电路技术设计了一种高工作频率、低相位噪声的环形振荡器。环路级数采用偶数级来获得两路相位相差90°的正交输出时钟,芯片采用台湾TSMC0.18μmCMOS工艺。测试结果表明,振荡器在5GHz的工作频率上,在偏离主频10MHz处相位噪声可达-89.3dB/Hz。采用1.8V电源电压时,电路的功耗为50mW,振荡器核芯面积为60μm×60μm。  相似文献   

2.
文章采用全开关状态的延时单元和双延时路径两种电路技术设计了一种高工作频率、低相位噪声的环形振荡器.环路级数采用偶数级来获得两路相位相差90 ℃的正交输出时钟.采用TSMC 0.18 μm CMOS工艺进行流片,电压控制振荡器(VCO)的频率范围为4.9~5.5 GHz,模拟的相位噪声为-119.3 dBc/Hz@5 M,采用1.8 V电源电压,核芯电路的功耗为30 mW, 振荡器核芯面积为60 μm×60 μm.  相似文献   

3.
提出一种带有开关电流源的电感电容压控振荡器(LC VCO)。该技术通过反馈电容将电感电容压控振荡器的输出耦合到电流源,形成了电流源的开关特性,从而减小了电感电容压控振荡器的相位噪声。提出的电感电容压控振荡器采用华虹 NEC的0.18μm SiGe BiCMOS工艺,工作频率为5.7 GHz,相位噪声为-113.0 dBc/Hz@1MHz,功耗为2.3 mA。在其他性能相同的情况下,提出的电感电容压控振荡器的振荡频率比典型的电感电容压控振荡器的相位噪声小4.5 dB。  相似文献   

4.
光电振荡器通过自振荡产生超低相位噪声微波信号,具有光、电两种输出,有望从源头突破现有雷达、电子战等射频系统性能瓶颈。文章介绍了光电振荡器的基本结构和理论模型,回顾了光电振荡器相位噪声、边模抑制比、工作频率、稳定度和小型化等关键性能提升的研究进展,并讨论了光电振荡器的功能拓展及光电振荡器在雷达等领域的应用。  相似文献   

5.
刘武广  王增双 《半导体技术》2021,46(9):686-689,743
基于推推振荡器结构设计了一种低相位噪声的毫米波压控振荡器,相比传统采用直接振荡和倍频实现的振荡器,该振荡器具有体积小、相位噪声低及电路简单等优点.振荡器中的谐振电路采用多级串联谐振,电感采用微带线的形式,提高了谐振器的品质因数,进而降低了振荡器的相位噪声,且在谐振电路通过微带耦合方式实现了基频输出.基于GaAs异质结双极晶体管(HBT)工艺对振荡器进行了设计和流片,芯片尺寸为1.8 mm×1.4 mm.在5V工作电压和0~13 V调谐电压条件下,振荡器的输出频率为42.1~46.2 GHz,电流为120 mA,输出功率为1 dBm,1/2次谐波抑制大于15 dB,相位噪声为-60 dBc/Hz@10 kHz、-85 dBc/Hz@100 kHz和-105 dBc/Hz@1 MHz.  相似文献   

6.
介绍了微波低相位噪声介质振荡器的设计方法。就影响介质振荡器相位噪声的因素进行了讨论,从谐振回路有载Q值、有源器件、增益压缩量、电路模式等几个方面提出了降低相位噪声的方法,并给出了一个C波段微波低相噪振荡器的设计实例。测试结果表明:该振荡器工作频率3 900 MH z,输出功率大于10 dBm,相位噪声达到-102 dB c/H z@1 kH z;-128 dB c/H z@10 kH z。  相似文献   

7.
采用集总元件变容二极管和超高频三极管设计900 MHz压控振荡器,根据ADS2006A软件仿真确定了压控振荡器的电路参数,并对相关指标如相位噪声、调谐带宽、稳定系数、输出功率和谐波电平等进行了仿真,通过调整电路参数,优化电路结构,实现了工作频率为1 GHz、调谐带宽为90 MHz的压控振荡器,其相位噪声在偏移中心频率10 kHz处为-105 dBc/Hz,在100 kHz处为-120 dBc/Hz,该设计大大降低了系统成本.  相似文献   

8.
薛兵  高博  路小龙  龚敏  陈昶 《微电子学》2015,45(1):23-25, 31
基于65 nm CMOS标准工艺库,设计了一个工作频率在10 GHz的具有低相位噪声的CMOS电感电容型压控振荡器。该压控振荡器选用CMOS互补交叉耦合型电路结构,采用威尔逊型尾电流源负反馈技术来降低相位噪声。仿真结果表明,此压控振荡器工作频率覆盖范围为9.9~11.2 GHz,调谐范围为12.3%,中心频率为10.5 GHz,在频率偏移中心频率1 MHz下的相位噪声为-113.3 dBc/Hz,核心功耗为2.25 mW。  相似文献   

9.
光电振荡器是一种采用光电结合方式的新型微波频率源,其利用光学长时储能,可以实现极低相位噪声的信号输出。文章研究了光纤中散射噪声对光电振荡器相位噪声的影响,重点介绍了基于相位调制等效展宽激光线宽,抑制布里渊散射噪声架构,通过理论公式推导以及实验验证,表明了上述架构可极大改善光电振荡器的相位噪声。实验中采用调制频率为50 MHz、调制幅度为3.1的相位调制信号对激光线宽进行等效展宽,得到在10 GHz频率下为-157.3 dBc/Hz@10 kHz的极低相位噪声信号输出。  相似文献   

10.
设计了一款3.7 GHz宽带CMOS电感电容压控振荡器.采用了电容开关的技术以补偿工艺、温度和电源电压的变化,并对片上电感和射频开关进行优化设计以得到最大的Q值.电路采用和舰0.18 μm CMOS混合信号制造工艺,芯片面积为0.4 mm×1 mm.测试结果显示,芯片的工作频率为3.4~4 GHz,根据输出频谱得到的相位噪声为-100 dBc/Hz@1 MHz,在1.8 V工作电压下的功耗为10 mW.测试结果表明,该VCO有较大的工作频率范围和较低的相位噪声性能,可以用于锁相环和频率合成器.  相似文献   

11.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

12.
IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…  相似文献   

13.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

14.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

15.
A doping system consisting of NPB and PVK is employed as a composite hole transporting layer (CHTL). By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK : NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK : NPB at 1:3.  相似文献   

16.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

17.
Due to variable symbol length of digital pulse interval modulation(DPIM), it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation(FDPIM) method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.  相似文献   

18.
It is a key problem to accurately calculate beam spots' center of measuring the warp by using a collimated laser. A new method, named double geometrical center method (DGCM), is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device (CCD) is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What's more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.  相似文献   

19.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

20.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

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