Al-N共掺P型Zn0.95Mg0.05O薄膜的性能

利用直流反应磁控溅射法,以N2O为N掺杂源,用Al-N共掺技术制备了p型Zn0.95Mg0.05O薄膜.用X射线衍射分析(XRD)、Hall测试仪和紫外可见(UV)透射谱等研究方法对其晶体结构、电学性能和禁带宽度进行分析.XRD分析结果表明,Zn0.95Mg0.05O薄膜具有良好的晶格取向,Hall测试的结果所得p型Zn0.95Mg0.05O薄膜最低电阻率为58.5Ω·cm,载流子浓度为1.95×1017 cm-3,迁移率为0.546cm2/(V·s),UV透射谱所推出的薄膜禁带宽度中,纯ZnO,p型Zn0.95Mg0.05O和p型Zn0.9Mg0.1O分别为3.34,3.39和3.46eV,可以看出Mg在ZnO禁带宽度中起了调节作用.     

N-Al共掺ZnO薄膜的p型传导特性

利用直流反应磁控溅射技术制得N-Al共掺的p型ZnO薄膜,N2O为生长气氛.利用X射线衍射(XRD),Hall实验,X射线光电子能谱(XPS)和光学透射谱对共掺ZnO薄膜的性能进行研究.结果表明,薄膜中Al的存在显著提高了N的掺杂量,N以N-Al键的形式存在.N-Al共掺ZnO薄膜具有优良的p型传导特性.当Al含量为0.15wt%时,共掺ZnO薄膜的电学性能取得最优值,载流子浓度为2.52×1017cm-3,电阻率为57.3Ω·cm,Han迁移率为0.43cm2/(V·s).N-Al共掺p型ZnO薄膜具有高度c轴取向,在可见光区域透射率高达90%.     

N-Al共掺ZnO薄膜的p型传导特性

利用直流反应磁控溅射技术制得N-Al共掺的p型ZnO薄膜，N2O为生长气氛．利用X射线衍射（XRD），Hall实验，X射线光电子能谱（XPS）和光学透射谱对共掺ZnO薄膜的性能进行研究．结果表明，薄膜中Al的存在显著提高了N的掺杂量，N以N-Al键的形式存在．N-Al共掺ZnO薄膜具有优良的p型传导特性.当Al含量为0.15wt%时，共掺ZnO薄膜的电学性能取得最优值，载流子浓度为2.52e17cm－3，电阻率为57.3Ω·cm，Hall迁移率为0.43cm2/(V·s)．N-Al共掺p型ZnO薄膜具有高度c轴取向，在可见光区域透射率高达90%．     

脉冲激光沉积法Li-N双受主共掺p型ZnO薄膜的生长及其特性

采用脉冲激光沉积技术制备了Li-N双受主共掺杂p型ZnO薄膜,其中Li来自Li掺杂ZnO陶瓷靶,N来自N2O生长气氛.室温Hall测试发现Li-N共掺p型ZnO薄膜的最低电阻率为3.99Ω·cm,迁移率为0.17cm2/(V·s),空穴浓度为9.12×1018cm-3.PL谱测试发现了与Li受主和N受主态相关的发光峰,其受主能级分别约为120和222meV.由p-ZnO:(Li,N)薄膜制备的ZnO同质p-n结具有整流特性.     

脉冲激光沉积法Li-N双受主共掺p型ZnO薄膜的生长及其特性

采用脉冲激光沉积技术制备了Li-N双受主共掺杂p型ZnO薄膜,其中Li来自Li掺杂ZnO陶瓷靶,N来自N2O生长气氛.室温Hall测试发现Li-N共掺p型ZnO薄膜的最低电阻率为3.99Ω·cm,迁移率为0.17cm2/(V·s),空穴浓度为9.12×1018cm-3.PL谱测试发现了与Li受主和N受主态相关的发光峰,其受主能级分别约为120和222meV.由p-ZnO:(Li,N)薄膜制备的ZnO同质p-n结具有整流特性.     

直流反应磁控溅射Al,N共掺方法生长p型ZnO薄膜及其特性

报道了利用直流反应磁控溅射以Al,N共掺杂技术生长p型ZnO薄膜 .ZnO薄膜在不同衬底温度下沉积于α Al2 O3 (0 0 0 1)衬底上 ,N来自NH3 与O2 的生长气氛 ,Al来自ZnxAl1-x(x =0 9)靶材 .利用XRD ,AFM ,Hall,SIMS和透射光谱对其性能进行了研究 .结果表明 ,ZnO薄膜具有高度c轴择优取向 ,4 5 0℃、6 0 0℃分别实现了p型转变 ,电阻率为 1e2 ～ 1e3 Ω·cm ,载流子浓度为 1e15～ 1e16cm-3 ,迁移率为 0.5～ 1.32cm2 / (V·s) .薄膜中Al原子促进了N原子的掺入 .实验还表明 ,p ZnO薄膜在可见光区域具有很高的透射率 (约为 90 % ) ,室温下光学带宽为 3 2 8eV     

掺Al对ZnO薄膜结构和光电性能的影响

采用溶胶-凝胶工艺在普通玻璃片上制备了ZnO∶Al薄膜。通过XRD、UV透射谱和电学测试等分析方法研究了掺Al对薄膜的组织结构和光电性能的影响。分析表明:所制备的薄膜具有c轴择优取向,随着掺Al浓度的增加,(002)峰向低角度移动,峰强逐渐减弱。薄膜电阻率随掺Al浓度变化,当掺Al浓度为1.5%(摩尔分数),薄膜电阻率降至6.2×10-4Ω·cm。掺Al量的增加同时使得薄膜的禁带宽度变大,光吸收边出现蓝移现象。     

溶胶-凝胶法制备ZnO薄膜及表征

采用溶胶-凝胶法在石英玻璃衬底上使用旋转涂覆技术生长了Zn O薄膜.对薄膜的XRD分析表明Zn O薄膜为纤锌矿结构并沿c轴取向生长.透射光谱表明薄膜的禁带宽度为3.2 8e V ,与Zn O体材料的禁带宽度3.30 e V基本相同.用光致发光谱分析了经过5 0 0～70 0℃热处理获得的Zn O薄膜,结果表明Zn O薄膜在室温下有较强的紫外带边发射,但当热处理温度高于70 0℃时,可见光波段发射明显增加     

直流反应磁控溅射Al,N共掺方法生长p型ZnO薄膜及其特性

报道了利用直流反应磁控溅射以Al,N共掺杂技术生长p型ZnO薄膜.ZnO薄膜在不同衬底温度下沉积于α-Al2O3(0001)衬底上,N来自NH3与O2的生长气氛,Al来自ZnxAl1-x(x=0.9)靶材.利用XRD,AFM,Hall,SIMS和透射光谱对其性能进行了研究.结果表明,ZnO薄膜具有高度c轴择优取向,450℃、600℃分别实现了p型转变,电阻率为102～103Ω*cm,载流子浓度为1015～1016cm-3,迁移率为0.5～1.32cm2/(V*s).薄膜中Al原子促进了N原子的掺入.实验还表明,p-ZnO薄膜在可见光区域具有很高的透射率(约为90%),室温下光学带宽为3.28eV.而在450℃生长的p-ZnO具有较小的晶粒度和表面粗糙度.     

用PLD方法制备Li掺杂的p型ZnMgO

在玻璃衬底上用PLD方法成功制备出具有高度(0002)取向性的、晶体质量较好的Li掺杂为0.4%的p型 Zn0.8Mg0.2O薄膜.衬底温度对薄膜的电学性能及结晶质量有重要影响,实验表明:在500℃时薄膜的电学性能最好,其载流子浓度为5.1×1018cm-3,电阻率为6.58Ω·cm,霍尔迁移率为0.189cm2/(V·s),且制备出的薄膜在可见光区具有90%的高透射率及在室温下光学禁带宽度3.625eV.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.