8″×8″全色飞机座舱显示器

有源矩阵液晶显示器(AMLCD)是航空和航天应用中优选的平板显示器。本文介绍一种为军用飞机设计的8″×8″全色AMLCD。在讨论其性能特点的同时还介绍了有源矩阵技术。     

TFT AMLCD视频系统驱动电路

介绍了TFT AMLCD视频系统的构成和驱动方式，具体分析了有源矩阵液晶显示的模拟驱动电路，以及其中参数的选择和需要注意的问题。     

用非晶硅薄膜晶体管寻址的有源矩阵液晶显示的视频特性

引言近来,平板显示有源矩阵液晶显示(LCD)得到广泛的开发。各种类型的有源矩阵液晶显示已有报导。我们已报导过可用激光再结晶的多晶硅来获得重复性和一致性好的薄膜晶体管(TFT)。然而,由于激光再结晶TFT是用某些高温过程的大规模集成工艺制作的,而且,在大规模集成工艺设备中存在某些尺寸限制,使得激光再结晶多晶硅TFT阵列不适用于大面积显示。另一方面,非晶硅TFT目前普遍用作有源矩阵LCD中的开关管。最近,我们已经制成由非晶硅TFT组成的,对角线尺寸为5英寸和10英寸的有源矩阵LCD。     

采用新技术制备16灰度级10英寸TFT——LCDs

一、引言显示面积大并具有多个灰度级的有源矩阵TFT—LCDs已得到广泛地发展。我们制做了10英寸对角线16个灰度级(4096种颜色)的a—Si TFT—LCDs,矩阵分辨率高达480(V)×640×33(H)个象素。由于a—Si TFT矩阵的制备技术是实现高性能TFT—LCDs的重要因素之一,本文主要介绍一种制备a—Si TFT矩阵的新技     

新型有源液晶显示板

美国加利福尼亚州的一家公司出售一种有源矩阵平板显示器,它用非晶硅薄膜晶体管(TFT)作为开关元件。应用有源开关TFT矩阵,可提高显示速度。这     

三星和夏普分别展示22英寸和28英寸TFT LCD

在最近举行的LCD国际展览会上,韩国三星电于公司展示了一种22英寸薄膜晶体管(TFT)有源矩阵显示器,而日本夏普公司则展示了一种28英寸TFT液晶显示器(LCD).据夏普公司说,28英寸LCD是世界上最大的TFT LCD.其应用范围有PC监视器、壁挂电视和演示板.夏普在TFT有源矩阵技术方面处于领先地位,而三星则是新参与LCD的研制开发,并决心与日本公司一争高低.三星的22英寸TFT LCD样品是该公司正在开发的30英寸TFT LCD的     

彩色LCD组件

日本夏普电子公司生产的两种高分辨率超紧凑型彩色LCD组件是采用TFT有源矩阵专利技术,3inLQ323Y09和4inLQ424Y01均可跟高性能CRT监视器的质量相媲美。这四种组件均采用有源矩阵驱动系统,TFT材料为a-Si。LQ323Y09有92160个像素,其尺寸为94.2(宽)mm×78.5(高)mm×6.1(深)     

其它电路与技术

0603638 TFT-OLED像素单元电路及驱动系统分析[刊,中]／朱儒晖／／中国集成电路．-2005,(11)．-70-76(G) 本文基于TFT-OLED有源矩阵像素单元电路,着重分析了两管TFT结构、三管TFT结构、四管TFT 结构及多管TFT结构的电压控制型与电流控制型像     

驱动视频TFT—LCD的CMOS集成电路

北京大学微电子所于1991年4月在国内首次研制成功了用于驱动薄膜晶体管(TFT)有源矩阵液晶电视显示屏的专用GMOS集成电路。它包括栅驱动器——扫描电极总线驱动电路BDD1001和漏驱动器——信号电极总线驱动电路BDD2001两块IC。适合于驱动200线左右的TFT有源矩阵液晶电视显示屏。 用于TFT有源矩阵液晶电视显示屏的专用IC的具体结构参数、性能要求是由矩阵驱动方式、扫描方法、液晶材料的性质及电光特性、TFT的性     

自动在线检查和修复技术将提高LCD生产率

衣袋式电视、高清晰度电视、个人膝上计算机和工作站均得益于有源矩阵液晶显示(AMLCD)屏的高信息容量。AMLCD 比以前的直接多路驱动的简单矩阵液晶显示器更明亮,对比度更高、响应速度更快。然而,具有这些优点的结构却会引起高金属化缺陷率,而且     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.