应用于EoC芯片的1.2 GHz/2 GHz/2.4 GHz三频段上混频器

采用0.13 μm RF CMOS工艺,设计了一款可应用于EoC收发芯片的三频段上混频器,通过改变接入并联LC负载谐振网络中电容的值,使电路分别工作在1.2 GHz,2 GHz,2.4 GHz频段。在3.3 V电源电压下,1.2 GHz,2 GHz,2.4 GHz频段上,总电流为35.1 mA;单边带(SSB)电压转换增益分别为3.77 dB,4.97 dB,4.78 dB;输出1 dB压缩点分别为-0.22 dBm,0.78 dBm,0.5 dBm;噪声系数分别为5.13 dB,5.76 dB,6.67 dB。通过控制输入跨导级的偏置实现混频器的开启和关断,上混频器的开启时间为200 ns,关断时间小于100 ns。     

一种应用于GPS射频前端的低噪声混频器

为了克服混频器噪声对GPS接收机灵敏度造成的影响,设计了一种应用于GPS射频前端的低噪声混频器电路.采用自偏置缓冲级放大本振信号,有效地提高了电路性能.该混频器的转换增益为23 dB,噪声系数为4.55 dB,3阶交调点为-9.36 dBm,在1.57 GHz到1.6 GHz频段上,反射系数S11小于-15 dB,电路采用1.8 V电压供电;混频器核心电路静态工作电流1.2 mA,采用CMOS 0.18 μm工艺实现,芯片版图面积为160μm×360μm.     

基于微带线的W波段二次分谐波混频器设计

采用微带混合集成电路技术设计了一款W波段二次分谐波混频器.通过分析二级管封装结构引入的寄生参量,提出了一种减小二级管并联寄生电容的方法.为了避免在W波段使用传统分谐波混频器中普遍使用的过孔接地及侧边平行耦合微带线带通滤波器,提出了一种改进型分谐波混频器结构.测试结果表明混频器在本振频率为45 GHz,中频频率为2.4 GHz时单边带变频损耗最小,最小值为8 dB.射频频率在90 ～ 100 GHz测试频率范围内,变频损耗的测量值小于10.5 dB.     

一种多频带高线性度CMOS单边带混频器

基于TSMC 0.18μm CMOS工艺,设计实现了一种多频带高线性度的单边带(SSB)混频器。该混频器以经典的电流换向结构为基础,采用电阻负载以满足多频带工作、高线性度和高带内增益平坦度要求,并节省了面积。通过集成有源巴伦将混频器输出差分信号转换成单端信号,提高了发射机的系统集成度且有利于降低功耗。测试结果表明:在2.3～2.4 GHz及3.4～3.6 GHz工作频带内,IP1dB大于0 dBm,带内增益平坦度小于0.5 dB,本振泄漏小于-47 dBm,镜像信号抑制大于36 dB,为LTE标准的无线射频前端芯片的进一步研究提供了参考。     

一种基于0.18-μm CMOS工艺的新型超宽频带毫米波混频器设计与分析

本文提出了一种超宽频带毫米波混频器电路.混频器采用分布式拓扑结构和中频功率合成技术,具有宽带宽和高转换增益.该混频器采用TSMC 0.18-μm CMOS工艺设计并制造,芯片总面积为1.67mm².测试结果表明:混频器工作频率从8GHz到40GHz,中频频率为2.5GHz时的转换增益为-0.2dB至4dB,其本振到中频端口和射频到中频端口间的隔离度均大于50dB.整个电路的直流功耗小于32mW.     

一种基于WLAN零中频CMOS混频器的设计

本文提出了一种应用于无线局域网(WLAN)的2.4GHz的零中频下变频混频器的设计方案,采用中芯国际5层金属0.25μm的CMOS工艺制作完成。测试和仿真结果表明,该混频器增益为-1.2dB,IIP3为-11.1dB,其单边带噪声NF为7dB。文中对混频器的噪声进行了简单的分析,提出了一种解决直流溃通的方法。     

应用于EoC芯片的宽带低噪声下混频器设计

基于SMIC 0.13 μm RFCMOS工艺,提出了一种可应用于EoC (Ethernet over Cable)芯片接收机的输出阻抗可调(200~500 Ω)的宽带低噪声下混频器,覆盖了接收机系统中1.2~2.4 GHz工作频段。Cadence SpectreRF后仿真结果表明,在3.3 V电源电压下,该混频器的输入3阶交调点为3.5~5 dBm,转换增益为10~18.2 dB,单边带噪声系数为4.1~5.8 dB,静态电流为20 mA。该电路可在-40 ℃~85 ℃较大温度范围和3~3.6 V电源电压下正常工作。     

一种单片毫米波双平衡二极管混频器

本文介绍了一种采用WIN 0.150.15μm pHEMT设计的单片双平横二极管混频器。本次设计中采用了改进的折叠型Marchand balun来减少芯片面积。同时电路中还使用U型耦合线改善了端口之间的隔离度并提供了中频输出端口。该混频器取得了较好的测试结果,在26-40 GHz频带范围内,混频器具有较低的变频损耗为5.5-10.7dB,隔离度大于26dB,并且中频带宽为DC-14 GHz,芯片面积为0.96mm2     

3 mm单平衡混频器芯片

为满足3 mm收发系统的小型化需求,采用InP高电子迁移率晶体管(HEMT)工艺,设计并制造了一款3 mm单平衡混频器芯片.该单平衡混频器芯片采用了反向并联肖特基二极管对(APDP)和三线耦合Marchand巴伦结构,在获得精确的肖特基二极管非线性模型和巴伦电磁场S参数模型的基础上,对混频器进行了电路设计.最终获得了良好的工作带宽、变频损耗与隔离度指标,在片测试结果显示,该芯片射频、本振频率为82～100 GHz,变频损耗小于9 dB,本振(LO)-射频(RF)隔离度大于20 dB,中频带宽为0.1～18 GHz,整体芯片尺寸为1.1 mm×1.0 mm.     

基于90nm CMOS工艺的超宽带分布式混频器设计北大核心CSCD

摘要：基于TSMC 90nm CMOS工艺设计了一款18～100GHz的超宽带无源漏极混频器,混频器采用了均匀分布式结构,通过牺牲延迟来获得超宽带带宽。同时,提出了一种栅极电压优化技术,通过优化偏置电压Vcs来最小化CMOS混频器的传输损耗。混频器带宽为18—100GHz,带宽内变频损耗为（4±1）dB,端口隔离度优于15dB,45GHz处1dB压缩点输入功率为4dBm,芯片面积仅为0．36mm^2该混频器在低功耗的环境下具有良好的变频损耗性能,非常适合用在低功耗的通信系统当中。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.