石墨烯-硅基混合光子集成电路

近年来硅基光子学已经慢慢走向成熟,它被认为是未来取代电子集成电路,实现下一代更高性能的光子集成电路的关键技术.这得益于硅基光子器件与现代的互补金属氧化物半导体工艺相兼容,能够实现廉价的大规模集成.然而,由于受硅材料本身的光电特性所限,在硅基平台上实现高性能的有源器件仍然存在着巨大挑战.石墨烯-硅基混合光子集成电路的发展为解决这一问题提供了可行的方案.这得益于石墨烯作为一种兼具高载流子迁移率、高电光系数和宽带吸收等优点的二维光电材料,能够方便地与现有硅基器件相集成,并充分发挥自身的光电性能优势.本文结合我们课题组在该领域研究的一些最新成果,介绍了国际上在石墨烯-硅基混合光子集成电路上的一些重要研究进展,涵盖了光源、光波导、光调制器和光探测器四个重要组成部分.     

硅基光栅耦合器的研究进展

硅基光子集成芯片的研究近年来发展迅速, 已成为信息技术领域中最热门的研究方向之一, 光通信、光互连、光传感等相关研发应用机构高度关注其发展, 并积极介入. 硅基光子集成芯片中, 光栅耦合器作为光信号的输入和输出装置受到极大重视, 尤其在封装和测试等环节体现出极具价值的技术优势. 本文主要分析了光栅耦合器的工作原理、基本特性及国内外的发展现状和趋势, 同时也概括了本课题组近期在该方向上的研究成果. 关键词： 光栅耦合器 耦合效率 绝缘体上硅 光子集成     

载流子色散型硅基CMOS光子器件

为了实现硅基单片光电子集成器件的实用化,介绍了采用P-I-N、双极型场效应晶体管、金属氧化物半导体和PN结结构的载流子色散型硅基CMOS光子器件的发展状况和特点,并汇报了硅基CMOS光子器件的设计和制作方面的工作.利用商业的CMOS工艺线制作的器件获得了较好的结果,光调制器消光比约18 dB,1×2光开关消光比约21 dB,谐振环的消光比8～12 dB.采用CMOS技术研制硅基光子器件,将能使集成光子学的发展上一个新的台阶.     

载流子色散型硅基CMOS光子器件

为了实现硅基单片光电子集成器件的实用化,介绍了采用P-I-N、双极型场效应晶体管、金属氧化物半导体和PN结结构的载流子色散型硅基CMOS光子器件的发展状况和特点,并汇报了硅基CMOS光子器件的设计和制作方面的工作.利用商业的CMOS工艺线制作的器件获得了较好的结果,光调制器消光比约18 dB,1×2光开关消光比约21 dB,谐振环的消光比8～12 dB.采用CMOS技术研制硅基光子器件,将能使集成光子学的发展上一个新的台阶.     

光子晶体制备技术和应用研究进展

从光子晶体概念的提出到现在已经过了20余年,光子晶体不仅成为微纳光子学和量子光学的重要研究领域,而且在信息光学以及其他多个学科中得到广泛应用.本文重点综述了光子晶体的制备工艺,尤其是二维光子晶体和三维光子晶体的制备工艺进展,同时也综述了光子晶体的应用研究的进展,在此基础上,提出了一些光子晶体研究的展望.     

可调反射器辅助的可重构微环光滤波器

为了适应光学滤波、微波信号处理等各种应用场景的需求,集成硅基光子滤波器需要具备多功能可重构和灵活可调谐特性.本文提出了一种可调反射器辅助的微环光滤波器芯片设计.通过传输矩阵模型,仿真结果表明,该器件可实现4种自由光谱范围的切换、100 dB消光比滤波、带通与带阻切换、Fano共振、类似电磁感应透明和类似电磁感应吸收等谱型的重构,且每种谱型均可以实现滤波中心频率的大范围调谐.本技术在集成光子模拟信号处理和微波光子学等领域具有广阔的应用前景.     

基于硅基光子器件的Fano共振研究进展

硅基光子技术的发展为新型微纳光学功能器件和片上系统提供了高可靠、高精度的实现手段.采用硅基光子技术构建的具有连续(准连续)模式微腔与离散模式的微腔耦合产生的Fano共振现象得到了广泛关注.Fano共振光谱在共振波长附近具有不对称且尖锐的谐振峰,传输光的强度在共振波长附近从0突变为1,该机制可显著提高硅基光开关、探测器、传感器,以及光非互易性全光信号处理的性能.本综述分析了Fano共振的一般数学表述,总结了当前硅基光子微腔耦合产生Fano共振的理论模型研究现状,讨论了不同类型硅光器件实现Fano共振的方法,比较各种方案优劣及适用场合,梳理了Fano共振在全光信号处理方面的应用研究情况.最后探讨存在的一些问题及未来可能的相关研究方向.     

一维光子晶体微腔在硅基材料发光中的应用研究

硅基材料的高效发光对未来硅基光电子集成的发展极其关键,含微腔的一维光子晶体可以显著提高其发光强度、窄化其发光峰.介绍了几种硅基材料发光的一维光子晶体微腔结构,包括单缺陷模式的对称与非对称结构、多缺陷模结构及电注入结构.利用传输矩阵法计算其缺陷模透射谱,以间接分析其发光谱.     

二维硅基平板光子晶体器件

硅材料在红外通讯波段具有低损耗和高折射率的特性,使得其成为集成光学领域中应用最广的材料之一.主要介绍了本课题组在二维硅基平板光子晶体中实现微纳尺度上光调控的研究进展,讨论了利用光子晶体的缺陷态实现各种集成光学器件,包括光子晶体波导、微腔和利用光子晶体波导和微腔形成的滤波器.还介绍了光子晶体中特殊的光折射现象,包括红外波...     

基于阵列波导光栅的光纤布拉格光栅解调技术综述

基于阵列波导光栅的光子集成解调技术是硅光领域的研究热点和难点.相比传统解调方法,基于阵列波导光栅的光子集成解调技术因其解调精度高、解调速度快、封装体积小等优势,在光纤布拉格光栅的高速、高精度解调上具有明显优势.近年来,随着光子集成技术的发展,各科研院所和相关机构对阵列波导光栅的光子集成解调法进行了广泛深入的研究与优化.本文通过介绍阵列波导光栅工作原理及基于阵列波导光栅的光纤布拉格光栅波长解调原理,结合基于阵列波导光栅的光纤布拉格光栅解调仪在材料体系和系统性能两个方面的重要进展,归纳了基于阵列波导光栅的解调仪的典型应用场景,从新材料、系统集成和规模化三方面对光纤布拉格光栅解调系统的未来发展提出针对性建议,为基于阵列波导光栅的光子集成解调技术的研究发展提供参考.     

High-efficiency focusing grating coupler with optimized ultra-short taper

A novel high-efficiency focusing non-uniform grating coupler is proposed to couple light into or off silicon photonic chips for large-scale silicon photonic integration. This kind of grating coupler decreases the transition length of the linking taper between the grating and the single-mode waveguide by at least 80%. The radian of the grating lines and the size of the taper are optimized to improve the coupling efficiency. An experimental coupling efficiency of ~ 68% at 1556.24 nm is obtained after optimization and the whole size of the grating is 12 μm × 30 μm, with a very short taper transition of ~15 μm long.     

Multitasking and Cascadable Microwave Photonic Signal Processing Topologies with Silicon Photonic Technologies

ABSTRACT

Microwave photonics (MWPs) is an emerging interdisciplinary field, where photonics technologies are adopted to facilitate the generation, transmission, detection, and processing of signals at radio-wave, microwave, and millimeter-wave frequencies. Recently, the integrated photonic technology has demonstrated its capability to miniaturize photonic circuits on a single chip, which paves the way for next-generation integrated MWP signal processing systems having reduced size, weight, and power consumption (SWaP) specifications. In particular, by means of incorporating complementary metal-oxide-semiconductor (CMOS) electronic, optical, and optoelectronic components on a single integrated chip, silicon photonic circuits have brought new architectures and functionalities for MWP signal processing. This accelerates the evolution of MWPs from a single-use microwave signal processor toward a multitasking and cascadable MWP system, which is readily adaptable for a wide variety of uses and applications. In this review article, we provide an overview of the fundamental principle of the MWP signal processing topology. Developments in the microwave filtering technologies are reviewed with a focus on the integrated microwave filtering enhanced by optical phase equalization. We also review the recent progress and give an outlook for the future trend in MWP signal topologies, exploring the realization of multitasking and cascadable microwave signal processing systems based on silicon photonics.     

Graphene integrated photodetectors and opto-electronic devices — a review

Graphene and other two-dimensional materials have recently emerged as promising candidates for next-generation,high-performance photonics. In this paper, the progress of research into photodetectors and other electro-optical devices based on graphene integrated silicon photonics is briefly reviewed. We discuss the performance metrics, photo-response mechanisms, and experimental results of the latest graphene photodetectors integrated with silicon photonics. We also lay out the unavoidable performance trade-offs in meeting the requirements of various applications. In addition, we describe other opto-electronic devices based on this idea. Integrating two-dimensional materials with a silicon platform provides new opportunities in advanced integrated photonics.     

Ultra‐low loss waveguide platform and its integration with silicon photonics

Planar waveguides with ultra‐low optical propagation loss enable a plethora of passive photonic integrated circuits, such as splitters and combiners, filters, delay lines, and components for advanced modulation formats. An overview is presented of the status of the field of ultra‐low loss waveguides and circuits, including the design, the trade‐off between bend radius and loss, and fabrication rationale. The characterization methods to accurately measure such waveguides are discussed. Some typical examples of device and circuit applications are presented. An even wider range of applications becomes possible with the integration of active devices, such as lasers, amplifiers, modulators and photodetectors, on such an ultra‐low loss waveguide platform. A summary of efforts to integrate silicon nitride and silica‐based low‐loss waveguides with silicon and III/V based photonics, either hybridly or heterogeneously, will be presented. The approach to combine these integration technologies heterogeneously on a single silicon substrate is discussed and an application example of a high‐bandwidth receiver is shown.     

Demonstration of Automated Adjustment and Coupling of Fiber Array to PICs Based on the Detection of Edges

ABSTRACT

Progress in integrated photonics enables development of photonics integrated circuits (PIC) with new unique properties and overcomes current limits in information and communication technologies. The effective coupling of optical radiation between telecom optical fiber and photonic integrated circuits is necessary. To address these challenges, we present our concept of photonics integrated circuit (PIC) fully customized packaging with microwave, direct current, and fiber array ports with automated active alignment system. Automated adjustment and coupling of single-mode fiber (SMF) arrays with 8 fibers to PIC based on the detection of edges and markers on PIC and SMF arrays were successfully realized.     

Integrated microwave photonics

Microwave photonics (MWP) is an emerging field in which radio frequency (RF) signals are generated, distributed, processed and analyzed using the strength of photonic techniques. It is a technology that enables various functionalities which are not feasible to achieve only in the microwave domain. A particular aspect that recently gains significant interests is the use of photonic integrated circuit (PIC) technology in the MWP field for enhanced functionalities and robustness as well as the reduction of size, weight, cost and power consumption. This article reviews the recent advances in this emerging field which is dubbed as integrated microwave photonics. Key integrated MWP technologies are reviewed and the prospective of the field is discussed.     

On‐chip stimulated Brillouin Scattering for microwave signal processing and generation

Demonstration of continuously tunable delay, low‐noise lasers, dynamically controlled gratings, and optical phase shifting using the stimulated Brillouin scattering (SBS) process has lead to the emergence of SBS as a promising technology for microwave photonics. On‐chip realization of SBS enables photonic integration of microwave photonic signal processing and offers significantly enhanced performance and improved efficiency. On‐chip stimulated Brillouin scattering is reviewed in the context of slow‐light based tunable delay, low‐noise narrow linewidth lasers and filtering for integrated microwave photonics. A discussion on key material and device properties, necessary to enable on‐chip Brillouin scattering using both the single‐pass and resonator geometry, is presented along with an outlook for photonic integration of microwave signal processing and generation in other platforms.