电容式微加速度传感器控制电路研究

本文首先阐述了电容式微加速度传感器的一般结构及系统建模方法，然后提出一种静电力反馈平衡控制电路，先通过高频调制信号产生检测电压，再经过ＰＩ反馈控制器产生静电反馈力，以提高传感器的噪声抑制能力、输出线性度和动态响应范围。     

基于MEMS技术的微型传感器

和传统的传感器相比，微型传感器具有许多新特性，它们能够弥补传统传感器的不足，具有广泛的应用前景，越来越受到重视。文中详细介绍了一些微型传感器件的结构和原理，说明了微型传感器的基本性能特点和微型传感器的发展趋势。     

悬隔膜材料和制造工艺技术

综合分析比较了各种微传感器中悬隔膜材料和制造工艺技术的优缺点，从中选择工艺简单易行、性能稳定可靠以及与微电子技术相容的微传感器悬隔膜材料和制造工艺技术，以便提高微传感器成品率．     

微机械电子学系统

本文简要地评述了微机构、微传感器、微执行器的发展,提出了微机械电子学系统的概念,指出了微机械电子学系统的发展前景。     

新型电容式微型压力传感器

文中从应用开发ＭＥＭＳ产品的实用角度出发,着力介绍一种新型的电容式微型压力传感器的结构组成和它的ＭＥＭＳ制造工艺。文中详细给出了这种电容式微型压力传感器的结构组成图、组成尺寸和它各部分部件的材料构成以及在硅材料加工过程中存在的主技术难题,最后,详细给出了电容式微型压力传感器的加工工艺过程。     

零点增益可调的电容式微传感器

文中介绍一种可调零点和增益的电容式微型传感器。通过对ＭＯＳ电流镜电路的深入探讨,给出了由ＭＯＳ电流镜电路组成的零点和增益可调的电容式微型传感器测量电路;通过对传感器测量电路的动态过程传真,明确了测量电路的最佳工作频率范围;通过对传感器测量电路静态过程的仿真确定了这种测量电路的线性度和增益。由以上研究表明,零点和增益可调的电容式微过程的仿真,确定了这种测量电路的线性度和增益。由以上研究表明,零点和增     

电容式测压微传感器的特性分析

本文主要对电容式测压微传感器的力学特性和电学特性进行分析。文中通过对测量电路工作过程和特性的深入探讨、仿真和验证,证明这种传感器的测量电路具有良好的线性度和稳定性。通过对传感器的敏感元件硅膜片的力学分析,建立了传感器的力学模型。分析的结果表明：传感器敏感元件和电容器的物理特性是影响传感器输出响应线性的主要因素。     

微机电系统的研究内容与发展现状

概述了微机电系统（MEMS）的定义和特征,从理论基础、技术基础和工程应用三方面,阐述了微机电系统的研究内容,简要介绍了MEMS基础技术及MEMS器件的研究现状。     

Detection of Liquid Water in PEM Fuel Cells' Channels: Design and Validation of a Microsensor

Suitable water management is a critical issue to reach the full potential of PEM fuel cells: whereas the membrane must be hydrated enough, liquid droplets formed by water in excess can block the flow in the gas distribution channels and hinder the fuel cell performance. In order to detect the presence of droplets in cathode flow channel, an electrochemical sensor has been developed and tested in a dedicated emulation cell. It is based on the widely used principle of two‐electrode cells for conductivity measurements; the collected signal is converted to impedance values. The sensor, mounted in a gas flow channel grooved in a graphite plate, reacts to the passage of water droplets, either being injected into the continuous air stream or produced by condensation of humidified air at the graphite plate. The time variation of the electrical impedance could be correlated to the observations allowed by the high‐speed digital camera. Water droplets separated from each other by less than a second can be distinguished by the sensor, which is of a sufficient rapidity.     

In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

Ultrasonic in situ force signals from integrated piezo-resistive microsensors were used previously to describe the interfacial stick-slip motion as the most important mechanism in thermosonic Au wire ball bonding to Al pads. The same experimental method is applied here with a hard and a soft Cu wire type. The signals are compared with those obtained from ball bonds with standard Au wire. Prior to carrying out the microsensor measurements, the bonding processes are optimized to obtain consistent bonded ball diameters of 60 μm yielding average shear strengths of at least 110 MPa at a process temperature of 110 °C. The results of the process optimization show that the shear strength c_pk values of Cu ball bonds are almost twice as large as that of the Au ball bonds. The in situ ultrasonic force during Cu ball bonding process is found to be about 30% higher than that measured during the Au ball bonding process. The analysis of the microsensor signal harmonics leads to the conclusion that the stick-slip frictional behavior is significantly less pronounced in the Cu ball bonding process. The bond growth with Cu is approximately 2.5 times faster than with Au. Ball bonds made with the softer Cu wire show higher shear strengths while experiencing about 5% lower ultrasonic force than those made with the harder Cu wire.