Structure and oil retaining capacity of gasar copper fabricated by radial solidification with a combined crystallizer

Porous copper with elongated pores was fabricated by a radial solidification method. The process was carried out in a combined crystallizer under high pressure of a mixture of hydrogen and argon. Pore size, pore length, pore density and porosity of the porous copper were characterized. Furthermore, the oil retaining capacity including oil content and oil efficiency was also evaluated. It is found that porous copper solidified with water-circulated chiller through a thick graphite jacket possesses a gradient structure with increasing pore size, and thus pore density decreases. Also pore length and pore aspect ratio decrease from lateral inwardly, while its porosity is almost uniform. The results show that the porous copper with radial pores has a good oil retaining capacity.     

Spray-drying of alumina powder for APS: effect of slurry properties and drying conditions upon particle size and morphology of feedstock

In this paper, effects of variables concerning slurry properties and drying conditions on the particle size and morphology of feedstock were discussed. The results indicated that, the increase of powder loading increased D ₅₀ and volume content but reduced recovery rate slightly. Other variables, such as inlet temperature, showed a maximum on the desired property. The particle size of resulting feedstock increased with the rise of feeding rate of slurry, however, decreased with the increase of atomization pressure based on the premise that atomization pressure was enough to force slurry to form the liquid membrane. For preparation of spherical feedstock, optimized variables were as follows: 60 wt.% powder in slurry, 2 wt.% PVA in slurry, inlet temperature of 60°C, atomization pressure of 13 × 10³ KPa and feeding rate of 12 ml min^?1. The volume content of feedstocks with 10–45 μm was above 65% and for D ₅₀ it was 15·42 μm. In addition, according to the heat and mass transfer equation, the drying mechanism was established, which was well in agreement with the experimental results.     

Translucent Mg-α-Sialon Ceramics Prepared by Spark Plasma Sintering

The translucent Mg-α-sialon ceramics have been prepared by spark plasma sintering (SPS) α-Si₃N₄ powder with AlN and MgO as the additives at 1850°C for 5 min. The sample possesses a uniform, dense microstructure under the rapid densification of SPS process. The translucent Mg-α-sialon ceramics achieve the maximum transmittance of 66.4% for the sample of 0.5 mm in thickness in the medium infrared region, which could be attributed to the equiaxed microstructure and few glassy phase confirmed by the observation of transmission electron microscopy. The material also exhibits good mechanical properties of high hardness (21.4±0.3 GPa) and fracture toughness (6.1±0.1 MPa·m^1/2).     

Fabrication and Characterization of Electrodeposited Ni-SiC-h/BN Composite Coatings

Ni—SiC—h/BN composite materials were prepared by electrodeposition technique with the dispersion of SiC（10 g/L） and h/BN nanosheets（10 g/L） in a nickel sulfamate electrolytic bath.Different ratio of sodium dodecyl sulfate（SDS） and cetyltrymethyl ammonium bromide（CTAB） surfactants were used to evaluate the effect of surfactants on the properties of the electrodeposited composite coatings.The coating samples were characterized by scanning electron microscopy,X-ray diffraction,Vickers microhardness test,scratch and tribology tests.The results revealed that the co-deposition of nanoparticles was significantly influenced by surfactants during electrodeposition process.Pyramidal or polyhedral nickel crystallites were observed at higher ratio of SDS/CTAB while smaller oval grains with refined surface morphologies were obtained at lower ratio of SDS/CTAB surfactants.In addition,wt%of particles co-deposition was increased,and Vickers microhardness,wear and coefficient of friction of the electrodeposited composite coatings were improved at increased CTAB and decreased SDS contents in the electrolyte during electrodeposition process.