Effects of Growth Parameters on the Morphology of CNTs/Cu Composite Powder Prepared Using Cr/Cu Catalyst by Chemical Vapor Deposition

采用化学共沉淀法制备了Cr/Cu复合粉体催化剂,并用化学气象沉淀法（CVD）原位合成CNTs/Cu复合粉末。利用SEM, TEM和Raman光谱分别对其微观形貌和结构进行表征。结果表明：采用化学气相沉淀法,使用10 wt%Cr/Cu 的催化剂,在混合气体(Ar/H2/C2H4) 流量2450/300 mL/min下,于1073 K 温度生长30 min,可以得到优质、结晶良好的 CNTs/Cu 复合粉末     

额外纯Cu对Cu-Nb复合线材力学及导电性能的影响

通过拉伸试验和四点测电阻法,对中心含额外纯Cu的Cu-Nb复合线材的力学及导电性能进行测试,并利用SEM观察其微观结构和断口形貌。结果表明:从断口中心到边沿,断裂方式从正断逐渐转向剪切断裂。中间纯Cu有利于导电性和强度的优化。线材的强度随着Nb芯丝间距的减小呈指数上升趋势。当间距小于100 nm时,尺寸效应对强度有显著影响,且77 K下强度随间距减小而增大的速度大于室温下强度随间距减小的速度。而当间距大于300 nm时,尺寸效应对强度的贡献很小。     

High activity and wide temperature window of Fe‐Cu‐SSZ‐13 in the selective catalytic reduction of NO with ammonia

Fe‐Cu‐SSZ‐13 catalysts were prepared by aqueous solution ion‐exchange method based on the one‐pot synthesized Cu‐SSZ‐13. The catalysts were applied to the selective catalytic reduction (SCR) of NO with NH₃ and characterized by the means of XRD, UV‐Vis, EPR, XPS, NH₃‐TPD, and so on. The selected Fe‐Cu‐SSZ‐13‐1 catalyst exhibited the high NO conversion (>90%) in the wide temperature range (225–625°C), which also showed good N₂ selectivity and excellent hydrothermal stability. The results of XPS showed that the Cu and Fe species were in the internal and outer parts of the SSZ‐13 crystals, respectively. The results of UV‐Vis and EPR indicated that the monomeric Cu²⁺ ions coordinated to three oxygen atoms on the six‐ring sites and Fe monomers are the real active species in the NH₃‐SCR reaction. Furthermore, the influence of intracrystalline mass‐transfer limitations on the Fe‐Cu‐SSZ‐13 catalysts is related to the location of active species in the SSZ‐13 crystals. © 2015 American Institute of Chemical Engineers AIChE J, 61: 3825–3837, 2015     

由Cu~(2+)引起的氰化物滚镀铜故障及控制方法

氰化物滚镀铜溶液中Cu2+明显影响镀层的光泽。降低槽电压和增加阳极面积,有利于降低Cu2+的质量浓度。用硫代硫酸钠处理镀液,Cu2+被还原成Cu+。用硫化钾也可以处理Cu2+,两者反应生成硫化铜,同时加活性炭吸附沉淀物,从而消除Cu2+的不良影响。     

Cu~+/13X分子筛吸附分离丁烷-丁烯混合体系

采用等体积浸渍法制备了一系列负载型Cu+/13X分子筛吸附剂,利用固定床吸附装置对该系列吸附剂分离丁烷-丁烯混合体系的性能进行了评价,考察了吸附剂中Cu Cl2负载量、焙烧还原时间、吸附温度、吸附压力、再生次数等对吸附剂性能的影响,并采用TPD方法分析了碳四组分与活性中心π-络合能力的强弱。实验结果表明,Cu+/13X分子筛吸附剂是一种分离丁烷-丁烯混合体系的优良吸附剂,当Cu Cl2负载量为5.67%(w)、350℃下焙烧1.00 h、吸附温度为35~40℃时,常压下吸附效果最佳。升高吸附压力使吸附剂的穿透吸附时间缩短,且吸附压力过高时会引起吸附柱死体积内的气体体积增加,不利于分离。Cu+/13X分子筛吸附剂的再生性能良好,多次再生后仍保持较高的活性。     

Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics

We report on a systematic study of the electromechanical properties of flexible copper (Cu) thin film for flexible electronics. Cu ink is synthesized with chemical reduction process. Cu ink film spin-coated on a polyimide substrate is annealed with white flash light, also known as intense pulsed light (IPL), which guarantees a room temperature and sub-second process in ambient conditions. IPL annealed Cu film shows the electrical resistivity of 4.8 μΩ cm and thickness of 200 nm. The electromechanical properties of IPL annealed Cu film are investigated via outer/inner bending, stretching, and adhesion tests, and it is compared with conventional electron-beam evaporated Cu film. IPL annealed Cu film shows a constant electrical resistance within a bending radius of 6 mm. The bending fatigue test shows that the Cu film can withstand 10,000 bending cycles. In the stretching test, the Cu film shows a 50% increase in resistance when a strain of 2.4% was induced. At 4% strain, the resistance increases more than 200%. Meanwhile, the electron-beam evaporated film shows a constant resistance up to a strain of 4%. Lower stretchability of IPL annealed Cu film is attributed to its inherent cracks and porous film morphologies. IPL annealing induces the local melting at the interface between the substrate and Cu film, which increases the adhesion strength of the Cu film. These results provide useful information regarding the mechanical flexibility and durability of the nanoparticle films for the development of flexible electronics.     

添加Cu和T6下Mg2Si/Al复合材料的组织与性能

采用铸造法制备原位自生亚共晶Al-10Mg₂Si复合材料,研究Cu和T6热处理对该复合材料组织与力学性能的影响。结果表明:适量Cu的添加能显著减小共晶Mg₂Si相晶粒尺寸,使其晶体结构由粗大的长条状和汉字状转变为细小的条状和纤维状;同时使针状的β-Al₅Fe Si相转变为细小的不规则富Cu颗粒。经T6热处理后,质量分数为1.5%的Cu复合材料中的共晶Mg₂Si相完全球化。质量分数为1.5%的Cu添加同时提高了材料铸态下的抗拉强度(R_m)、屈服强度(R_p0.2)和伸长率(A),达317、169 MPa和2.3%,比未添加Cu提高了42.2%、24.3%和53.3%;经T6热处理的R_m和R_p0.2值分别增至332、181 MPa,而A值保持不变。同时,材料由脆性断裂完全转变为韧性断裂。     

电路板嵌入元器件有机模块技术的开发

为了提高电子组装密度,基板嵌入元器件的三维安装模式受到人们更多的关注.介绍了一种以铜芯为基板核心材料的元器件嵌入技术(EOMIN),详细叙述了其外形结构和制造工艺,并通过实验与FR-4基板嵌入元器件和低温共烧陶瓷基板(LTCC)安装元器件进行比较,通过实验数据对比得出EOMIN元器件嵌入技术具有导热性能好,抗疲劳性强,承受热冲击时铜的塑性变形量小,连接可靠性高等优良特性的结论.     

Effect of microstructure and overaging on the tensile behavior at room and elevated temperature of C355-T6 cast aluminum alloy

The present study was focused on the microstructural and mechanical characterization of the Al–Si–Cu–Mg C355 alloy, at room and elevated temperature. In order to evaluate the influence of microstructural coarseness on mechanical behavior, samples with different Secondary Dendrite Arm Spacing (SDAS) (20–25 μm for fine microstructure and 50–70 μm for coarse microstructure), were produced through controlled casting conditions. The tensile behavior of the alloy was evaluated at T6 condition and at T6 with subsequent high temperature exposure (41 h at 210 °C, i.e. overaging), both at room and elevated temperature (200 °C). Microstructural investigations were performed through optical and electron microscopy.The results confirmed the important role of microstructure on the tensile behavior of C355 alloy. Ultimate tensile strength and elongation to failure strongly increased with the decrease of SDAS. Larger SDAS, related to lower solidification rates, modify microstructural features, such as eutectic Si morphology and size of the intermetallic phases, which in turn influence elongation to failure. Overaging before tensile testing induced coarsening of the strengthening precipitates, as observed by STEM analyses, with consequent reduction of the tensile strength of the alloy, regardless of SDAS. A more sensible decrease of tensile properties was registered at 200 °C testing temperature.     

集成电路用Ti靶材和Cu62Zn38合金背板焊接技术研究

研究了高纯Ti和Cu62Zn38合金在不同的工艺条件下的扩散焊接性能和界面情况。结果表明,热等静压温度为510℃时,加工态Ti板硬度下降明显,与退火态Cu62Zn38接近;退火态Ti板和退火态Cu62Zn38两种材料硬度较为接近,而在温度接近525℃时,退火态Cu62Zn38合金硬度明显高于退火态Ti板。退火态Cu62Zn38合金与退火态高纯Ti经过焊接温度525℃,压力120 MPa,保温4 h的扩散焊接后,平均抗拉强度能达到136 MPa,焊接界面达到冶金结合,满足Ti靶材的使用要求。