Microstructure and mechanical behavior of Ti/Cu/Ti laminated composites produced by corrugated and flat rolling

Ti/Cu/Ti laminated composites were fabricated by corrugated rolling (CR) and flat rolling (FR) method. Microstructure and mechanical properties of CR and FR laminated composites were investigated by scanning electron microscopy, numerical simulation methods, peel and tensile examinations. The effect of CR and FR was comparatively analyzed. The results showed that the CR and FR laminated composites exhibited different effective plastic strain distributions of the Ti layer and Cu layer at the interface. The recrystallization texture, prismatic texture and pyramidal texture were developed in the Ti layer by CR, while the R-Goss texture and shear texture were developed in the Cu layer by CR. The typical deformation texture components were developed in the Ti layer and Cu layer of FR laminated composites. The CR laminated composites had higher bond strength, tensile strength and ductility.     

Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder joint

The effects of trace addition of Al₂O₃ nanoparticles (NPs) on thermal reliabilities of Sn-0.5Ag-0.7Cu/Cu solder joints were investigated. Experimental results showed that trace addition of Al₂O₃ NPs could increase the isotheraml aging (IA) and thermal cyclic (TC) lifetimes of Sn-0.5Ag-0.7Cu/Cu joint from 662 to 787 h, and from 1597 to 1824 cycles, respectively. Also, trace addition of Al₂O₃ NPs could slow down the shear force reduction of solder joint during thermal services, which was attributed to the pinning effect of Al₂O₃ NPs on hindering the growth of grains and interfacial intermetallic compounds (IMCs). Theoretically, the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^-10 to 0.79×10^-10 cm²/h in IA process, and from 0.92×10^-10 to 0.53×10^-10 cm²/h in TC process. This indicated that trace addition of Al₂O₃ NPs can improve both IA and TC reliabilities of Sn-0.5Ag- 0.7Cu/Cu joint, and a little more obvious in IA reliability.     

纳米Co/rGO磁性复合吸附材料的制备及对Cu2+的吸附性能

以改进Hummer法制备的薄片状氧化石墨烯(GO)为载体和模板负载钴离子，然后采用原位还原法制得纳米金属Co/石墨烯磁性复合吸附材料(Co/rGO)，并将其应用于对Cu2+的吸附和脱除，以期为高效可复用的铜离子脱除剂的合成与应用提供指导。实验结果证实，Co/rGO复合材料具有超顺磁性，能够很方便的使用磁铁进行分离并在无磁场情况下振荡分散。Co/rGO复合材料对Cu2+具有稳定的吸附/脱附性能，实验条件下对Cu2+的最大吸附容量达到117.5 mg/g且5 min内实现吸附平衡，远优于其原料GO的60 min吸附容量27.6 mg/g。本工作系统考察了NaOH加入量、络合剂种类、溶剂种类等关键因素对Co粒子在rGO载体上形貌和分布特性的影响，比较了不同合成条件下的复合材料对Cu2+吸附效果的影响，并对优选条件下制备的Co/rGO复合材料进行了FT-IR, XRD, SEM表征。研究结果表明，纳米Co/rGO磁性材料对Cu2+的吸附过程更符合Freundlich模型，属于多层吸附。室温下吸附焓ΔH=17.81 kJ/mol，吸附反应平衡常数Kθ=3.65。当初始Cu2+浓度为39.22 mg/L时，对Cu2+的吸附率为93.47%，五次吸附/脱附循环后吸附容量仍保持在初始值的94%，每次吸附后溶液中残余Cu2+浓度均满足钴电解液对杂质铜离子的浓度去除要求(5 mg/L)或GB 8978-1996污水综合排放标准3级(2 mg/L)，有望在相关领域发挥作用。     

熔盐电解CuO/SiO2制备铜硅合金

以质量比为1∶1的CuO、SiO2混合氧化物为反应原料,熔融的CaCl2-NaCl为电解液,在槽电压2.8 V、电解温度700℃下,电解5 h制备得到Cu3Si/Si复合物。热力学计算结果表明,在700℃下,CuO优先被电解还原生成单质Cu,SiO2在SiO2/CaCl2-NaCl电解质/Cu三相反应界面进行电解还原,生成的单质Si与Cu自发进行合金化反应,生成Cu3Si。新生成的Cu3Si合金作为新的导电集流体,推进SiO2的电解反应。电解产物Cu3Si/Si的微观形貌为粒径在0.1~1.9μm之间的多孔颗粒堆积,Si颗粒覆盖在Cu3Si合金颗粒表面。     

Microstructure and strengthening mechanism of Mg—5.88Zn—0.53Cu—0.16Zr alloy solidified under high pressure

Mg—5.88Zn—0.53Cu—0.16Zr (wt.%) alloy was solidified at 2—6 GPa using high-pressure solidification technology. The microstructure, strengthening mechanism and compressive properties at room temperature were studied using SEM and XRD. The results showed that the microstructure was refined and the secondary dendrite spacing changed from 35 μm at atmospheric pressure to 10 μm at 6 GPa gradually. Also, Mg(Zn,Cu)₂ and MgZnCu eutectic phases were distributed in the shape of network, while under high pressures the second phases (Mg(Zn,Cu)₂ and Mg₇Zn₃) were mainly granular or strip-like. The solid solubility of Zn and Cu in the matrix built up over increasing solidification pressure and reached 4.12% and 0.32% respectively at 6 GPa. The hardness value was HV 90 and the maximum compression resistance was 430 MPa. Therefore, the grain refinement strengthening, the second phase strengthening and the solid solution strengthening are the principal strengthening mechanisms.     

Role of interface on irradiation damage of Cu−diamond composites using classical molecular dynamics simulations

Cu?diamond composites have been proposed as a candidate thermal management material for spacecraft electronics. Nevertheless, irradiation effects on the composites remain poorly understood at present. Here we focus on investigating the influence of Cu?diamond interfaces (CDIs) on energetic displacement cascades using atomistic simulations. Results show that a primary knock-on atom of Cu (PKA-Cu) can induce more significant damage than a PKA-C. Under almost all circumstances, the statistically averaged fraction of surviving interstitials is not only lower than that of vacancies but also no more than 1. Because of the unique nature in the mobility and interactions with CDIs, Cu interstitials exhibit the lowest concentration among all defects in most cases. The high residual rate of displaced defects in diamond makes it relatively difficult to heal. The structural damage is mainly manifested in a short-range disorder of diamond and a long-range disorder of Cu after irradiation. At elevated temperatures, the atomic displacement region may form compact chain-like defects to restrain lattice loosening. Despite the above, CDIs could act as effective sinks to facilitate the recombination and/or annihilation of irradiation-induced defects in all scenarios. This study provides an important insight into the understanding of the microscopic evolution of irradiation defects for the composites.     

Rochow-Müller反应制备甲基氯硅烷单体工艺的研究进展

Rochow-Müller反应是一种直接合成甲基氯硅烷的方法。由于其原料易得,产物收率高,工艺较易实现,成为有机硅工业单体生产的主流工艺。到目前为止,铜基催化剂仍为Rochow-Müller反应的核心催化剂,催化性能的改善对该工艺的提升具有重大意义。在探索高效催化剂和理解其机理方面已取得相关进展,但由于副产物多,复杂性高,对该反应真实反应路径的追踪仍然较为困难。对Rochow-Müller反应的热力学过程、铜基催化剂及助催化剂的应用、反应机制及动力学过程和工艺条件的影响进行综述讨论。希望这项工作能够准确地反应Rochow-Müller反应催化工艺的最新进展,并可以促进有机硅工业的可持续性发展。     

Influence of addition of nanosize barium cerate on the microstructure and properties of top-seeded melt growth YBCO bulk superconductors

Barium cerate (BaCeO₃) is one of the possible additions to bulk YBa₂Cu₃O₇ single-grain superconductors to suppress the growth of Y₂BaCuO₅ (Y211) particles. This paper investigates the synthesis of barium cerate powder and its use in YBa₂Cu₃O₇ bulk superconductors. Crystalline barium cerate was synthesized by solid-state reaction, by co-precipitation of oxalates and by sol-gel method. Final calcination was held in air or in vacuum. It is shown that the most efficient in refining Y211 is nanocrystalline barium cerate prepared by sol-gel method calcined in vacuum. The effective refinement of Y211 particles occurred over the entire interval of nanocrystalline BaCeO₃ addition from 0.38 to 1.90 wt%. The optimal concentration of nanosize barium cerate was determined, microstructure and superconducting properties were characterized. The effect of Y211 content on trapped field in YBCO bulks with addition of nanocrystalline barium cerate is shown.