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91.
AbstractSuperconducting materials have contributed significantly to the development of modern materials science and engineering. Specific technological solutions for their synthesis and processing helped in understanding the principles and approaches to the design, fabrication and application of many other materials. In this review, we explore the bidirectional relationship between the general and particular synthesis concepts. The analysis is mostly based on our studies where some unconventional technologies were applied to different superconductors and some other materials. These technologies include spray-frozen freeze-drying, fast pyrolysis, field-assisted sintering (or spark plasma sintering), nanoblasting, processing in high magnetic fields, methods of control of supersaturation and migration during film growth, and mechanical treatments of composite wires. The analysis provides future research directions and some key elements to define the concept of ‘beautiful’ technology in materials science. It also reconfirms the key position and importance of superconductors in the development of new materials and unconventional synthesis approaches. 相似文献
92.
93.
We investigate the characteristics of Cu2O thin films deposited through the addition of N2 gas. The addition of N2 gas has remarkable effects on the phase changes, resulting in improved electrical and optical properties. An intermediate phase (6CuO·Cu2O) appears at a N2 flow rate of 1 sccm, and a Cu2O (200) phase is then preferentially grown at a higher feeding amount of N2. The optical and electrical properties of Cu2O thin films are improved with a sufficient N2 flow rate of more than 15 sccm, as confirmed through various analyses. Under this condition, a high bandgap energy of 2.58 eV and a conductivity of 1.5×10?2 S/cm are obtained. These high‐quality Cu2O thin films are expected to be applied to Cu2O‐based heterojunction solar cells and optical functional films. 相似文献
94.
《Vacuum》2013
The synthesis of graphene on Cu foils has been carried out using a low-pressure chemical vapor deposition (LPCVD) process. Under certain growth conditions apart from the graphene flakes, undesired CuxO nanodots appear. The samples were characterized by scanning electron microscopy, atomic force microscopy, Raman spectroscopy and X-ray photoemission spectroscopy. On the basis of the results, we investigated the effect of growth parameters such as pressure, methane-to-hydrogen ratio and cooling atmosphere on the growth rate, the composition, especially the cleanliness of graphene by scanning electron microscopy in detail. It is shown that the obtained film is quite sensitive on the preparation conditions and the appearance of CuxO nanodots is preventable. 相似文献
95.
Jiasong Zhong Weidong Xiang Zhaoping Chen Haijun Zhao Xiaojuan Liang 《Materials Science and Engineering: B》2013,178(15):998-1003
Cu nanocrystals embedded in sodium borosilicate glass of varied Cu contents from 0.5 to 1.5 wt% have been successfully prepared through a sol–gel process. According to the results of X-ray diffraction (XRD) and the energy dispersive X-ray spectrometry (EDS), the metal Cu nanocrystals in cubic crystal system were well distributed inside glass matrix. Fourier Transform Infrared (FTIR) indicated the sodium borosilicate matrix had no major structural change for gels with different Cu contents. The optical absorption peaks due to the surface plasmon resonance of Cu particles were observed in the wavelength range of 550–600 nm. The absorption peak showed a red-shift trend with increasing Cu contents from 0.5 to 1.5 wt%. Transmission electron microscopy (TEM) revealed the existence of spherical Cu nanocrystals in the matrix. The diameter of Cu nanocrystals varied from 1 to 3.5 nm. Furthermore, the third-order nonlinear optical properties were investigated by Z-scan technique at 800 nm. Experimental results indicated the Cu nanocrystals have obvious positive refractive nonlinearities and reverse saturated absorption performance. 相似文献
96.
97.
《Ceramics International》2021,47(23):33078-33088
The wetting behaviour and interfacial reaction mechanism between Ag–Cu alloy fillers (with varying copper contents) and Si3N4 ceramics using reactive air brazing at 970 °C were systematically investigated. As the copper content increased, the contact angles of the Ag–Cu filler on the Si3N4 ceramics decreased. A violent boiling-like interfacial reaction was observed during the experiment, and mass spectrometry analysis identified the gaseous products as N2, NO and NO2. The solid products SiO2 and Cu–O formed at the interface, and the interfacial reactions improved the wettability of the Ag–Cu filler on the Si3N4 ceramics. Owing to buoyancy and the pushing of the gases, the interfacial products floated to the surface of the filler and their distribution increased along with the increasing copper content. Two different microstructures were formed at the interface near the triple line. Thick and thin SiO2 layers were respectively formed on the triple line interface of the fillers with low (Ag–3Cu/Ag–5Cu) and high (Ag–6.6Cu/Ag–16Cu) copper content. The interfacial bonding zones formed in Ag–5Cu, Ag–6.6Cu, and Ag–16Cu samples indicated that the corresponding Ag–Cu fillers were effectively brazed with the Si3N4 ceramics. 相似文献
98.
《中国有色金属学会会刊》2021,31(11):3342-3355
The properties of Sc-doped θ′ (Al2Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations. Sc-doped semi-coherent and coherent θ′ (Al2Cu)/Al interfaces (Sc doped in Al slab (S1 site), Sc doped in θ′ slab (S2 site)) were modeled based on calculated results and reported experiments. Through the analysis of interfacial bonding strength, it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion. In particular, the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength. The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site, and the Al—Al bonds at the interfaces with Sc at S2 site are formed. The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength. 相似文献
99.
100.
Rochow-Müller反应是一种直接合成甲基氯硅烷的方法。由于其原料易得,产物收率高,工艺较易实现,成为有机硅工业单体生产的主流工艺。到目前为止,铜基催化剂仍为Rochow-Müller反应的核心催化剂,催化性能的改善对该工艺的提升具有重大意义。在探索高效催化剂和理解其机理方面已取得相关进展,但由于副产物多,复杂性高,对该反应真实反应路径的追踪仍然较为困难。对Rochow-Müller反应的热力学过程、铜基催化剂及助催化剂的应用、反应机制及动力学过程和工艺条件的影响进行综述讨论。希望这项工作能够准确地反应Rochow-Müller反应催化工艺的最新进展,并可以促进有机硅工业的可持续性发展。 相似文献