High voltage SOI LDMOS with a compound buried layer

An SOI LDMOS with a compound buried layer (CBL) was proposed. The CBL consists of an upper buried oxide layer (UBOX) with a Si window and two oxide steps, a polysilicon layer and a lower buried oxide layer (LBOX). In the blocking state, the electric field strengths in the UBOX and LBOX are increased from 88 V/μm of the buried oxide (BOX) in a conventional SOI (C-SOI) LDMOS to 163 V/μm and 460 V/μm by the holes located on the top interfaces of the UBOX and LBOX, respectively. Compared with the C-SOI LDMOS, the CBL LDMOS increases the breakdown voltage from 477 to 847 V, and lowers the maximal temperature by 6 K.     

A 150%enhancement of PMOSFET mobility using hybrid orientation

正A high-performance PMOSFET based on silicon material of hybrid orientation is obtained.Hybrid orientation wafers,integrated by(100) and(110) crystal orientation,are fabricated using silicon-silicon bonding, chemical mechanical polishing,etching silicon and non-selective expitaxy.A PMOSFET with W/L = 50μm/8μm is also processed,and the measured results show that the drain-source current and peak mobility of the PMOSFET are enhanced by up to 50.7%and 150%at V_(gs) =-15 V and V_(ds) =-0.5 V,respectively.The mobility values are higher than that reported in the literature.     

微纳米CMOS VLSI电路可靠性仿真与设计

介绍了CMOS VLSI的可靠性建模和仿真技术的发展历史、相应的仿真工具、失效机理等效电路和算法,重点总结了当前最新的CMOS超大规模集成电路可靠性建模仿真技术,为促进我国集成电路可靠性设计水平起到积极的作用。     

一种10位80 Ms/s逐次逼近A/D转换器

基于65 nm CMOS工艺,设计了一种10位80 Ms/s的逐次逼近A/D转换器。该A/D转换器采用1.2 V电源供电以及差分输入、拆分单调的DAC网络结构。采用拆分单调的电容阵列DAC,可以有效降低A/D转换所消耗的能量,缩短DAC的建立时间,降低控制逻辑的复杂度,提高转换速度;避免了由于比较器共模电平下降过多引起的比较器失调,从而降低了比较器的设计难度,改善了ADC的线性度。动态比较器降低了A/D转换的功耗。使用Spectre进行仿真验证,结果表明,当采样频率为80 MHz,输入信号频率为40 MHz时,该A/D转换器的SFDR为72 dBc。