溅射功率对磁控溅射制备Bi薄膜结构和性能的影响

采用直流磁控溅射方法在不同功率下制备了铋(Bi)薄膜,对薄膜的沉积速率、表面形貌、生长模式、晶体结构进行了研究,并对其晶粒尺寸和应力的变化规律进行了分析。扫描电镜(SEM)图像显示：薄膜均为柱状生长,平均晶粒尺寸随溅射功率先增大后减小,薄膜的致密度随着功率的增加而降低,在60W时又变得较致密。X射线衍射(XRD)结果表明：Bi薄膜均为多晶斜六方结构,薄膜内应力随功率的增加由张应力变为压应力。     

金属铀表面非平衡磁控溅射CrNx薄膜的XPS分析与腐蚀性能

金属铀的化学性质十分活泼,极易发生氧化腐蚀。为改善基体的抗腐蚀性能,采用非平衡磁控溅射离子镀技术在金属铀表面制备CrN_x薄膜。采用X射线衍射和X射线光电子能谱研究薄膜表面的物相结构和元素成分分布,采用极化曲线研究薄膜的抗腐蚀性能。结果表明,CrN_x薄膜具有较好的致密性和抗腐蚀性能。当氮分压较小时,生成的薄膜为Cr+CrN+Cr₂N混合相。在金属铀表面制备1层CrN_x薄膜后,其腐蚀电位增大约465 mV,腐蚀电流密度明显降低,有效改善了贫铀表面的抗腐蚀性能。     

磁控溅射制备金属铀膜

研究了通过磁控溅射方法制备高纯金属铀膜的可行性。采用X射线衍射（XRD）、俄歇电子能谱（AES）、扫描电镜（SEM）、表面轮廓仪分析了沉积在单晶硅或金基材上铀薄膜的微观结构、成分、界面结构及厚度、表面形貌和表面粗糙度。分析结果表明：磁控溅射制备的铀薄膜为纯金属态,氧含量和其它杂质含量均低于俄歇电子能谱仪的探测下限;溅射沉积的铀镀层与铝镀层之间存在界面作用,两者相互扩散并形成合金相,扩散层厚度约为10nm。铀薄膜厚度可达微米级,表面光洁,均方根（RMS）粗糙度优于15nm。     

Growth and structural properties of silicon on Ag films prepared by 40.68 MHz very-high-frequency magnetron sputtering

The growth of silicon on Ag films via 40.68 MHz very-high-frequency (VHF) magnetron sputtering was investigated.The energy distribution and flux density of the ions on the substrate were also measured.The results showed that 40.68 MHz magnetron sputtering can produce ions with higher energy and lower flux density.The impact of these ions onto the grown surface promotes the growth of silicon,which is related to the crystalline nature and rnicrostructure of the underlayer of the Ag films,and there is large particle growth of silicon on Ag films with a preferred orientation of (111),and two-dimensional growth of silicon on Ag films with a better face-centered cubic structure.     

Cu Films Deposited by Unbalanced Magnetron Sputtering Enhanced by ICP and External Magnetic Field Confinement

Metallic copper（Cu） films were deposited on a Si （100） substrate by unbalanced magnetron sputtering enhanced by radio-frequency plasma and external magnetic field confinement. The morphology and structure of the films were examined by scanning electron microscopy （SEM）, atomic force microscope （AFM） and X-ray diffraction （XRD）. The surface average roughness of the deposited Cu films was characterized by AFM data and resistivity was measured by a four-point probe. The results show that the Cu films deposited with radio-frequency discharge enhanced ionization and external magnetic field confinement have a smooth surface, low surface roughness and low resistivity. The reasons may be that the radio-frequency discharge and external magnetic field enhance the plasma density, which further improves the ion bombardment effect under the same bias voltage conditions. Ion bombardment can obviously influence the growth features and characteristics of the deposited Cu films.     

磁控溅射法制备金/钆柱腔工艺研究

采用直流磁控溅射方法制备金/钆(Au/Gd)多层膜,并研究不同制备参数对多层膜结构与性能的影响。溅射压强高于1Pa时,Au膜与Gd膜的沉积速率均随溅射压强的增大而下降;在较低溅射气压下,随着溅射气压的降低,金膜与钆膜的均方根粗糙度有所减小;随着溅射功率的减小,金/钆多层膜的周期性结构变好,界面更为清晰。本工作制备了不同原子比的金/钆膜柱腔,探讨了有关柱腔成型的解决方法。     

直流磁控溅射钛及钛合金薄膜的性能研究

用直流磁控溅射的方法在Si及Mo基片上制取Ti及其Ti合金薄膜。研究了基片温度等镀膜工艺参数对薄膜性能的影响,并用XPS、XRD、SEM分析薄膜的化学组成和结构特征,对薄膜的生长模式进行分析。结果表明,合金的加入降低了晶粒尺寸;升高温度可增大薄膜晶粒尺寸,改善薄膜结合能力;合金膜的成分与靶材基本一致。     

磁控溅射制备纳米厚度连续金膜

研究了磁控溅射工艺参数对Au膜生长速率、表面粗糙度和微观结构的影响。结果表明:当溅射功率低于200W时,溅射功率对薄膜表面粗糙度、微观结构的影响不明显。标定了溅射功率为20W条件下的Au膜生长速率,观察了Au的生长过程,在Si基底沉积的Au为岛状(Volver-Weber)生长模式,Au膜厚度为8nm时,薄膜开始连续。晶粒尺寸与薄膜厚度的关系研究结果表明:在生长初期,晶粒尺寸随厚度线性增大;随后,晶粒尺寸增速变缓,直至停滞;趋于70nm时,新晶粒形成取代晶粒长大。     

合金化对溅射Ti膜材结构和力学性能的影响

研究了直流磁控溅射Ti、TiMo、TiMoY及TiMoYAl薄膜的形貌、结构和力学性能,探讨了合金化对Ti膜的影响。结果表明,合金化使Ti膜由α相结构转变为α+β双相结构,改变了薄膜的择优取向,降低了薄膜表面粗糙度,并改善了薄膜的力学性能。     

Control of growth and structure of Ag films by the driving frequency of magnetron sputtering

The growth and structural properties of Ag films prepared by radio-frequency (2,13.56 and 27.12 MHz) and very-high-frequency (40.68 and 60 MHz) magnetron sputtering were investigated.Using 2 MHz sputtering,the Ag film has a high deposition rate,a uniform and smooth surface and a good fcc structure.Using 13.56 and 27.12 MHz sputtering,the Ag films still have a high deposition rate and a good fcc structure,but a non-uniform and coarse surface.Using 40.68 MHz sputtering,the Ag film has a moderate deposition rate and a good fcc structure,but a less smooth surface.Using 60 MHz sputtering,the Ag film has a uniform and smooth surface,but a low deposition rate and a poor fcc structure.The growth and structural properties of Ag films are related to the ions' energy and flux density.Therefore,changing the driving frequency is a good way to control the growth and structure of the Ag films.     

直流磁控溅射法制备含氦铝膜

采用氦氩混合气氛下直流磁控溅射沉积方法制备含有氦原子的金属铝膜。经碳原子弹性前冲散射分析（C-ERDA），薄膜中氦原子浓度可达约7％，且分布均匀。实验研究了薄膜中的氦含量与溅射真空室气氛中氦的相对含量、基底偏压及沉积温度间的关系。薄膜的X射线衍射分析结果显示：膜中的氦含量变化并未引起明显的峰位移，只是随氦含量增加谱峰宽化。热释放实验证实，氦在薄膜中稳定存在，约500℃以上时方出现氦的释放。     

Effect of Frequency and Power of Bias Applied to Substrate on Plasma Property of Very-High-Frequency Magnetron Sputtering

The effect of the frequency and power of the bias applied to the substrate on plasma properties in 60 MHz(VHF) magnetron sputtering was investigated.The plasma properties include the ion velocity distribution function(IVDF),electron energy probability function(EEPF),electron density n_e,ion flux Γ_i,and effective electron temperature T_(eff).These parameters were measured by a retarding field energy analyzer and a Langmuir probe in the 60 MHz magnetron sputtering,assisted with 13.56 MHz or 27.12 MHz substrate bias.The 13.56 MHz substrate bias led to broadening and multi-peaks IVDFs,Maxwellian EEPFs,as well as high electron density,ion flux,and low electron temperature.The 27.12 MHz substrate bias led to a further increase of electron density and ion flux,but made the IVDFs narrow.Therefore,the frequency of the substrate bias was a possible way to control the plasma properties in VHF magnetron sputtering.     

Reactive DC Magnetron Sputter Deposited Titanium-Copper-Nitrogen Nano-Composite Thin Films with an Argon/Nitrogen Gas Mixture

A sintered Ti13Cu87 target was sputtered by reactive direct current (DC) magnetron sputtering with a gas mixture of argon/nitrogen for different sputtering powers. Titanium-copper-nitrogen thin films were deposited on Si (111), glass slide and potassium bromide (KBr) substrates. Phase analysis and structural properties of titanium-copper-nitrogen thin films were studied by X-ray diffraction (XRD). The chemical bonding was characterized by Fourier transform infrared (FTIR) spectroscopy. The results from XRD show that the observed phases are nano-crystallite cubic anti rhenium oxide (anti ReO3) structures of titanium doped Cu3N (Ti:Cu3N) and nano-crystallite face centered cubic (fcc) structures of copper. Scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM/EDX) were used to determine the film morphology and atomic titanium/copper ratio, respectively. The films possess continuous and agglomerated structure with an atomic titanium/copper ratio ( 0.07) below that of the original target ( 0.15). The transmittance spectra of the composite films were measured in the range of 360 to 1100 nm. Film thickness, refractive index and extinction coefficient were extracted from the measured transmittance using a reverse engineering method. In the visible range, the higher absorption coefficient of the films prepared at lower sputtering power indicates more nitrification in comparison to those prepared at higher sputtering power. This is consistent with the formation of larger Ti:Cu3N crystallites at lower sputtering power. The deposition rate vs. sputtering power shows an abrupt transition from metallic mode to poisoned mode. A complicated behavior of the films’ resistivity upon sputtering power is shown.     

Fabrication and characterization of He-charged ODS-FeCrNi films deposited by a radio-frequency plasma magnetron sputtering technique

He-charged oxide dispersion strengthened(ODS)FeCrNi films were prepared by a radiofrequency(RF)plasma magnetron sputtering method in a He and Ar mixed atmosphere at150℃.As a comparison,He-charged FeCrNi films were also fabricated at the same conditions through direct current(DC)plasma magnetron sputtering.The doping of He atoms and Y_2O_3 in the FeCrNi films was realized by the high backscattered rate of He ions and Y_2O_3/FeCrNi composite target sputtering method,respectively.Inductive coupled plasma(ICP)and x-ray photoelectron spectroscopy(XPS)analysis confirmed the existence of Y_2O_3 in FeCrNi films,and Y_2O_3 content hardly changed with sputtering He/Ar ratio.Cross-sectional scanning electron microscopy(SEM)shows that the FeCrNi films were composed of dense columnar nanocrystallines and the thickness of the films was obviously dependent on He/Ar ratio.Nanoindentation measurements revealed that the FeCrNi films fabricated through DC/RF plasma magnetron sputtering methods exhibited similar hardness values at each He/Ar ratio,while the dispersion of Y_2O_3 apparently increased the hardness of the films.Elastic recoil detection(ERD)showed that DC/RF magnetron sputtered FeCrNi films contained similar He amounts(~17 at.%).Compared with the minimal change of He level with depth in DC-sputtered films,the He amount decreases gradually in depth in the RF-sputtered films.The Y_2O_3-doped FeCrNi films were shown to exhibit much smaller amounts of He owing to the lower backscattering possibility of Y_2O_3 and the inhibition effect of nano-sized Y_2O_3 particles on the He element.     

Ion property and electrical characteristics of 60 MHz very-high-frequency magnetron discharge at low pressure

The pre-ionized 60 MHz very-high-frequency (VHF) magnetron discharge at low pressure, assisted by inductively coupled plasma (ICP) discharge, was developed. The measurement of ion flux density and ion energy to the substrate was carried out by a retarding field energy analyzer. The electric characteristics of discharge were also investigated by voltage–current probe technique. It was found that by reducing the discharge pressure of VHF magnetron discharge from 5 to 1 Pa, the ion flux density increased about four times, meanwhile the ion energy also increased doubly. The electric characteristics of discharge also showed that a little improvement of sputtering effectiveness was achieved by reducing discharge pressure. Therefore, the deposition property of VHF (60 MHz) magnetron sputtering can be improved by reducing the discharge pressure using the ICP-assisted pre-ionized discharge.     

高质量类金刚石薄膜的制备与性能分析

采用直流/射频耦合磁控溅射法在Si(100)衬底上成功制备出类金刚石(DLC)薄膜。利用Raman光谱仪、X射线光电子能谱仪表征不同射频功率下所制备薄膜的化学结构,讨论射频功率对薄膜化学结构的影响。采用X射线小角反射法表征薄膜的质量密度,利用曲率弯曲法表征薄膜的残余内应力,采用扫描电镜和原子力显微镜表征所制备薄膜的表面形貌与粗糙度。研究表明:薄膜中sp3键的含量随着射频功率的增加而呈现出先增大后减小的趋势,且在射频功率为40 W时达到最大值45.6%。随着射频功率的增加,薄膜的表面粗糙度呈现出先减小后增大的趋势,当射频功率为40 W时薄膜的表面粗糙度最小,为1.6 nm。直流/射频耦合磁控溅射法在不同射频功率下制备出的薄膜,其内应力均低于1.0 GPa,薄膜质量密度的变化范围为2.26~2.44 g/cm~3,有望成功制备出内应力低、密度高的高质量DLC薄膜。     

Phase changes of the ZrO2—12wt%Y2O3 film with Ar^＋ irradiation

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Characteristics of TiVCrAlZr multi-element nitride films prepared by reactive sputtering

Nitride films of multi-element TiVCrAlZr alloy were prepared on silicon substrates by reactive radio-frequency magnetron sputtering under different nitrogen/argon flow ratios ranging from 0% to 66.7%. The alloy film deposited in pure argon exhibited an amorphous structure and a very smooth surface, while a face-center-cubic solid-solution structure with strong (2 2 0), (1 1 1) to (2 0 0) orientation and different fracture feature and surface morphologies was observed in those films which were prepared under various nitrogen flow ratios. With increasing nitrogen flow ratio, the hardness and elastic modulus of the films increased and reached maximum values of 11 and 151 GPa at 50%.     

Structure and tribological properties of Ti-containing amorphous carbon coatings prepared by cathode arc-enhanced middle-frequency magnetron sputtering

Ti-containing amorphous carbon （Ti-aC） coatings were deposited on cemented carbide and Si substratcs by cathode-arc-enhanced closed field middle-frequency unbalanced magnetron sputtering. The coatings were studied by using atomic force microscopy, Raman scattering, nanoindentation, and pin-on-disk testing. The measurements showed that the hardness of the coatings increased from 12 GPa at a Ti content of 1 at.% to 27 GPa at 31 at.%. The coatings exhibited different friction behaviors when facing different mating materials and changed with increasing Ti content, The coating with 4 at.% Ti exhibited excellent tribological performance with a low friction coefficient of 0.07 when facing the cemented carbide.     

氢气流量对类金刚石薄膜结构与性能的影响

采用直流/射频耦合反应磁控溅射法在Si（100）衬底上成功制备出类金刚石（DLC）薄膜。利用表面轮廓仪、Raman光谱仪、X射线光电子能谱仪表征所制备薄膜在不同氢气流量下的沉积速率和化学结构,讨论了氢气流量对薄膜沉积速率和化学结构的影响;利用纳米压痕技术及曲率弯曲法表征薄膜的力学性能;利用扫描电镜和原子力显微镜表征薄膜的表面形貌与粗糙度。研究表明：随着氢气流量的增加,所制备薄膜的沉积速率逐渐减小,而薄膜中sp³键的含量逐渐增大。当氢气流量为25 mL/min时,薄膜中sp³键的含量为36.3%,薄膜的硬度和体弹性模量分别达到最大值17.5 GPa和137 GPa。同时,所制备薄膜的内应力均低于0.5 GPa,有望成功制备出低内应力的高质量DLC厚膜。随着氢气流量的增加,DLC薄膜的表面变得更致密光滑,且表面均方根粗糙度由5.40 nm降为1.46 nm。