溅射功率对磁控溅射制备Bi薄膜结构和性能的影响

采用直流磁控溅射方法在不同功率下制备了铋(Bi)薄膜，对薄膜的沉积速率、表面形貌、生长模式、晶体结构进行了研究，并对其晶粒尺寸和应力的变化规律进行了分析。扫描电镜(SEM)图像显示：薄膜均为柱状生长，平均晶粒尺寸随溅射功率先增大后减小，薄膜的致密度随着功率的增加而降低，在60W时又变得较致密。X射线衍射(XRD)结果表明：Bi薄膜均为多晶斜六方结构，薄膜内应力随功率的增加由张应力变为压应力。

Effect of Sputtering Power on Structure and Properties of Bi Film Deposited by DC Magnetron Sputtering

Bi film was fabricated at different sputtering powers by DC magnetron sputtering.The deposition rate of Bi film as the function of sputtering power was studied.The surface topography of Bi film was observed by SEM,and the growth mode of Bi film was investigated.The crystal structure was analyzed by XRD.The grain size and stress of Bi film were calculated.The SEM images show that all the films are columnar growth.The average grain size firstly increases as the sputtering power increases,then decreases at 60 W.The film becomes loose with the increase of sputtering power,while,the film gets compact when the sputtering power becomes from 45 to 60 W.The XRD results show that films are polycrystalline of hexagonal.And the stress transforms from the tensile stress to compressive stress as the sputtering power increases.