Ga掺杂ZnO薄膜的MOCVD生长及其特性

利用低压MOCVD技术在(0002)蓝宝石上外延获得高质量的ZnO:Ga单晶薄膜,并研究了Ga的不同掺杂浓度对材料电学和光学特性的影响.当Ga/Zn气相摩尔比为3.2 at%时,ZnO(0002)峰半高宽仅为0.26°,载流子浓度高达2.47×1019cm-3,透射率高于90%;当载流子浓度升高时,吸收边出现明显的Burstein-Moss蓝移效应.同时室温光致发光谱显示,紫外峰位随载流子浓度的增加而发生红移,峰形展宽,这和Ga高掺杂所引起的能带重整化效应有关.当Ga/Zn比达到6.3 at%时,由于高掺杂浓度下Ga的自补偿效应导致载流子浓度下降.     

溶胶-凝胶旋涂法制备In掺杂ZnO薄膜结构和光学性能的研究

采用溶胶-凝胶(sol-gel)旋涂法在常规玻璃衬底 上生长了In掺杂浓度分别为1at%、2at%、3at%、4at%、5at%的ZnO薄膜。借助X射线衍射仪(X RD)、扫描电子显微镜(SEM)、紫外- 可见分光光度计(UV-Vis)对样品的晶粒生长、结构以及光学性能进行表征。结果如下:所 制 备的薄膜均沿(002)方向择优生长,且随着In³⁺掺杂浓度增加 ,衍射峰的峰型及半高宽均呈 先降低后升高的趋势;In³⁺掺入后,ZnO薄膜晶粒由原来的六边形状发展成类似蠕虫 状,同 时粒径变小且大小不一;与本征样品相比,掺杂后的ZnO光透过率提高了10%,且吸收边向短 波长方向偏移,同时随着In³⁺的掺入,薄膜的光学带隙值从3.49 eV增加到3.80 eV。当In³⁺掺 杂浓度为4at%时,薄膜(002)峰的峰形最为尖锐、峰值最大,晶粒较为均匀、 晶格间距更小,光透过率最高,光学带隙值相对较大为3.77 eV。     

Ag掺杂浓度对ZnO纳米花荧光增强的影响

采用水浴与光照相结合的方法制备了Ag/ZnO纳米复 合结构,研究了不同Ag掺杂浓度对 ZnO发光强度的影响。通过X射线衍射(XRD)、扫描电子显微镜(SEM)和光致发光 (PL)光谱对Ag/ZnO纳米复合物的结构、形貌和光学性能进行了研究。SEM表明,由水浴法制 得的ZnO纳米花结构长约1.0μm,直径为200nm左右。XRD结果显示,Ag掺杂后Ag/ZnO 纳米复合结构衍射峰的强度都增强,当掺杂浓度为0.153wt%时,在38.28°出现了Ag₂O的衍射峰。PL表明,Ag浓度极大影响了ZnO紫外发光强度。当Ag的掺杂 浓度为0.051wt% 时,Ag/ZnO纳米复合结构具有最强的紫外发射强度,同未掺杂的ZnO相比,紫外发光强度提 高了11倍。研究结果表明,利用Ag纳米颗粒的局域表面等离子共振(LSPR)特性增强了ZnO纳 米结构的荧光强度,从而提高了荧光检测的灵敏度。     

Al掺杂ZnO薄膜的表面形貌和光学性质

用原子力显微镜、紫外-可见分光光度计和荧光光谱仪观察采用溶胶-凝胶法制备的Al掺杂ZnO薄膜的表面形貌、透射光谱和光致发光谱.结果表明,Al掺杂量为0.5at 9/6的ZnO薄膜经550℃退火处理后,粗糙度为1.817,Al掺杂量为1.0at%的ZnO薄膜经600℃退火处理后,粗糙度增大到4.625.样品在可见光范围内的平均透过率均大于80%.当激发波长为325 nm时,在397 nm(3.13 eV)附近出现紫外发光峰;当激发波长为360 nm时,在443 nm(2.80 eV)附近出现蓝色发光峰.探讨了样品的蓝光发光机制.     

Ga-N共掺氧化锌纳米线阵列制备及发光性能研究

采用化学气相沉积法（CVD）以一氧化氮（NO）和氧化镓（Ga2O3）为掺杂源,在c轴取向单晶蓝宝石衬底上外延生长镓氮（Ga-N）共掺氧化锌（ZnO）纳米线阵列。利用SEM, XRD, HRTEM, XPS, PL等测试手段对掺杂后的ZnO纳米线阵列进行结构、成分和光学性能表征。结果表明,Ga-N共掺ZnO纳米线阵列保持六方纤锌矿结构,沿（002）方向择优生长;掺杂元素在样品中均匀分布。随着掺杂浓度增加,纳米线由六棱柱结构转变为尖锥层状结构,长度由2 μm减小到1 μm,锥度增加至0.95;N 1s/Ga 2p/Zn 2p峰结合能向低能态方向移动。PL光谱分析表明,所有样品均出现紫外发光峰和绿光发光峰,不同掺杂浓度的缺陷发光强度不同。     

Ag掺杂ZnO/GaN异质结可见光吸收特性的第一性原理

ZnO/GaN异质结带隙宽度较宽,制约了对可见光的吸收。为研究Ag对ZnO/GaN异质结可见光吸收的影响,在(1-100)非极性面上构建GaN/ZnO异质结,并用Ag分别取代不同位置的Zn和Ga原子,采用第一性原理计算Ag掺杂对ZnO/GaN异质结稳定性、电子结构、光学性质和带边位置的影响。研究结果表明：Ag掺杂ZnO/GaN异质结形成能为负值,结构稳定;Ag置换Zn和Ga使带隙宽度由2.93 eV分别减小至2.7 eV和2.3 eV,吸收系数和光电导产生红移,有利于可见光的吸收,Ag掺杂ZnO/GaN异质结具有良好的光催化活性。     

利用椭偏仪研究氢气退火处理对ZnO-Ga薄膜光学性能的影响

通过溶胶凝胶技术制备了不同Ga掺杂含量的ZnO透明导电薄膜,研究了Ga掺杂对GZO薄膜结构、电学及光学性能的影响.从X射线衍射光谱分析,所有薄膜均表现为六方纤锌矿结构,经过氢气退火处理之后,薄膜的电学性能均得到提高,当Ga掺杂含量为5 at%时,得到薄膜的电阻率为3.410×10-3 Ω·cm.利用可变入射角椭圆偏振光谱仪(VASE)在270~1 600 nm波长范围内研究了GZO薄膜折射率和消光系数的变化,采用双振子模型对实验数据进行拟合.     

有机金属气相外延GaAs的载流子浓度与外延气氛中As/Ga值的关系

OMV法非有意掺杂外延GaAs的载流子浓度受外延气氛中As/Ga值的控制。本研究中发现: As/Ga值等于十四左右, N型外延GaAs的迁移率有一个最大值,相应的载流子浓度较低。掺硫N型外延GaAs的载流子浓度随As/Ga值的增加而下降。 本文分析了OMV法的外延机构,提出了质量输运控制下的界面反应区部分反应热力学平衡模型,从而导出了Ⅵ族、Ⅱ族以及Ⅳ族元素的掺杂关系式。应用这些关系式能满意地解释OMV法外延GaAs的载流子浓度与As/Ga值的关系,并能说明其他工艺条件(外延温度、生长速率、掺杂量等)对外延GaAs载流子浓度的影响。 研究结果已经应用于GaAs FET材料的制备工艺,因而掺S外延GaAs的载流子浓度得到了有效的控制。     

常压MOCVD生长的ZnO薄膜的电学性能

利用常压MOCVD法在蓝宝石(0001)衬底上沉积了非故意掺杂ZnO单晶薄膜．用Van der Pauw法测量了其从15K到室温的载流子浓度和霍耳迁移率，并用双层结构单施主模型对载流子浓度和迁移率进行了拟合分析．研究表明：ZnO薄膜浅施主能级为20.4meV，温度较低时，以电离杂质散射为主，温度较高时，以极性光学波散射为主．     

利用椭偏仪研究氢气退火处理对ZnO-Ga薄膜光学性能的影响（英文）

通过溶胶凝胶技术制备了不同Ga掺杂含量的Zn O透明导电薄膜,研究了Ga掺杂对GZO薄膜结构、电学及光学性能的影响.从X射线衍射光谱分析,所有薄膜均表现为六方纤锌矿结构,经过氢气退火处理之后,薄膜的电学性能均得到提高,当Ga掺杂含量为5 at%时,得到薄膜的电阻率为3.410×10-3Ω·cm.利用可变入射角椭圆偏振光谱仪(VASE)在270~1 600 nm波长范围内研究了GZO薄膜折射率和消光系数的变化,采用双振子模型对实验数据进行拟合.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.