基于TSV绑定的三维芯片测试优化策略

本文提出一种三维片上系统(3D SoC)的测试策略,针对硅通孔(TSV,Through Silicon Vias)互连技术的3D SoC绑定中和绑定后的测试进行优化,由于测试时间和用于测试的TSV数目都会对最终的测试成本产生很大的影响,本文的优化策略在有效降低测试时间的同时,还可以控制测试用的TSV数目,从而降低了测试成本.实验结果表明,本文的测试优化策略与同类仅考虑降低测试时间的策略相比,可以进一步降低约20%的测试成本.     

3D芯片绑定中测试绑定次序对成本的影响

针对3D SICs（3D Stacked Integrated Circuits,三维堆叠集成电路）在多次绑定影响下的成本估算问题,现有的方法忽略了实际中经常发生的丢弃成本,从而使得理论的测试技术不能很好的应用于实际生产.本文根据绑定中测试的特点,提出了一种协同考虑绑定成功率与丢弃成本的3D SICs理论总成本模型.基于该模型,提出了一种3D SICs最优绑定次序的搜索算法.最后,进一步提出了减少绑定中测试次数的方法,实现了"多次绑定、一次测试",改进了传统绑定中测试"一绑一测"的方式.实验结果表明,本文提出的成本模型更贴近于实际生产现状,最优绑定次序、最优绑定中测试次数可以更加有效指导3D芯片的制造.     

基于边沿延时翻转的绑定前硅通孔测试方法

硅通孔（Through-Silicon Via,TSV）在制造过程中发生开路和短路等故障会严重影响3D芯片的可靠性和良率,因此对绑定前的TSV进行故障测试是十分必要的.现有的绑定前TSV测试方法仍存在故障覆盖不完全、面积开销大和测试时间大等问题.为解决这些问题,本文介绍一种基于边沿延时翻转的绑定前TSV测试技术.该方法主要测量物理缺陷导致硅通孔延时的变化量,并将上升沿和下降沿的延时分开测量以便消除二者的相互影响.首先,将上升沿延时变化量转化为对应宽度的脉冲信号;然后,通过脉宽缩减技术测量出该脉冲的宽度;最后,通过触发器的状态提取出测量结果并和无故障TSV参考值进行比较.实验结果表明,本文脉宽缩减测试方法在故障测量范围、面积开销等方面均有明显改善.     

一种峰值功耗约束下的SoC蚁群测试调度算法

基于扫描链技术的SoC芯片测试可产生比正常使用模式下更大的功耗,这将会对器件可靠性产生不利影响,故在测试时需要将芯片测试功耗控制在允许峰值功耗之下.文中采用蚁群优化思路设计SoC测试调度算法,用于在峰值功耗和TAM总线最大宽度约束下降低SoC测试时间.实验结果表明,本方法优于先前已发表的相关方法.     

基于跨度和虚拟层的三维芯核测试外壳扫描链优化方法

为减少三维芯核绑定前和绑定后的测试时间,降低测试成本,提出了基于跨度和虚拟层的三维芯核测试外壳扫描链优化方法.所提方法首先通过最大化每条测试外壳扫描链的跨度,使得绑定前高层电路和低层电路的测试外壳扫描链数量尽可能相等.然后,在TSVs(Through Silicon Vias)数量的约束下,逐层的将虚拟层中的扫描元素分配到测试外壳扫描链中,以平衡绑定前后各条测试外壳扫描链的长度.实验结果表明,所提方法有效地减少了三维芯核绑定前后测试的总时间和硬件开销.     

含TSV结构的3D封装多层堆叠Cu/Sn键合技术

研究了利用Cu/Sn对含硅通孔(TSV)结构的多层芯片堆叠键合技术。采用刻蚀和电镀等工艺,制备出含TSV结构的待键合芯片,采用扫描电子显微镜(SEM)对TSV形貌和填充效果进行了分析。研究了Cu/Sn低温键合机理,对其工艺进行了优化,得到键合温度280℃、键合时间30 s、退火温度260℃和退火时间10 min的最佳工艺条件。最后重点分析了多层堆叠Cu/Sn键合技术,采用能谱仪(EDS)分析确定键合层中Cu和Sn的原子数比例。研究了Cu层和Sn层厚度对堆叠键合过程的影响,获得了10层芯片堆叠键合样品。采用拉力测试仪和四探针法分别测试了键合样品的力学和电学性能,同时进行了高温测试和高温高湿测试,结果表明键合质量满足含TSV结构的三维封装要求。     

2TF:一种协同考虑过硅通孔和热量的三维芯片布图规划算法

 三维芯片由多个平面器件层垂直堆叠而成,并通过过硅通孔(TSV,Through Silicon Via)进行层间互连,显著缩短了互连线长度、提高了芯片集成度.但三维芯片也带来了一系列问题,其中单个过硅通孔在目前的工艺尺寸下占据相对较大的芯片面积,且其相对滞后的对准技术亦降低了芯片良率,因此在三维芯片中引入过多的过硅通孔将增加芯片的制造和测试成本.垂直堆叠在使得芯片集成度急剧提高的同时也使得芯片的功耗密度在相同的面积上成倍增长,由此导致芯片发热量成倍增长.针对上述问题,本文提出了一种协同考虑过硅通孔和热量的三维芯片布图规划算法2TF,协同考虑了器件功耗、互连线功耗和过硅通孔数目.在MCNC标准电路上的实验结果表明,本文算法过硅通孔数目和芯片的峰值温度都有较大的降低.     

扫描电路测试功耗综述

随着集成电路制造技术的发展.高集成度使得测试时的功耗成为集成电路设计必须考虑的一个重要因素,低功耗测试也就成为了测试领域一个令人关注的热点.目前,低功耗测试技术的研究还在发展之中,工业生产中低功耗测试方法还没有得到充分的应用.在集成电路中采用扫描结构的可测试性设计方法,能够提高测试覆盖率.缩短测试时间,已在集成电路测试中得到大量应用.基于扫描结构的数字集成电路,学术界已提出了许多方法降低该电路的测试功耗,本文对此方面的研究进行综述.随着测试技术的发展,测试功耗的理论也将日益深入.     

3D TSV测试的挑战和潜在解决方案(英文)

3D硅通孔技术增加电路密度、降低功耗、提高带宽的优势在业内已得到广泛的认可。随着3D TSV技术的迅速发展,对于测试成本的优化就显得尤为突出,现有的测试方法已提出了很多挑战3D TSV技术的解决方案。提出了一种不同的应对3D TSV测试技术挑战的完整的3DTSV测试解决方案,其中某些方面涉及到3D TSV测试的前沿技术,而且也是唯一面向3D TSV测试特定的解决方案。最后,给出了一些采用完整3D TSV测试中其余的挑战。     

3D堆叠芯片硅通孔的电-热-力耦合构形设计

建立了3D堆叠芯片硅通孔(TSV)单元体模型,在单元体总体积和TSV体积占比给定时,考虑电-热-力耦合效应,以最高温度、(火积)耗散率、最大应力和最大形变为性能指标,对TSV横截面长宽比和单元体横截面长宽比进行双自由度构形设计优化.结果表明,存在最佳的TSV横截面长宽比使得单元体的最高温度、(火积)耗散率和最大应力取得极小值,但对应不同优化目标的最优构形各有不同,且TSV两端电压和芯片发热功率越大,其横截面长宽比对各性能指标的影响越大.铜、铝、钨3种材料中,钨填充TSV的热学和力学性能最优,但其电阻率较大.铜填充时,4个指标中最大应力最敏感,优先考虑最大应力最小化设计需求以确定TSV几何参数,可以较好兼顾其他性能指标.     

Conforming block inversion for low power memory

In this paper, we propose a scheme for reducing the power consumption of memory components by conforming memory contents to a precharging value. The scheme is oriented to application to single bitline structure of memory. It selectively stores normal or inverted data to reduce the number of bit accesses that have different values from the precharging value, which reduces overall bitline toggling and ultimately contributes to power reduction of the memory     

基于双模式LFSR的低功耗BIST结构

传统的BIST结构中,由于LFSR产生大量的测试矢量在测试过程中消耗了大量的功耗。为了减少测试矢量的数目而不影响故障覆盖率,我们提出了一种新的基于双模式LFSR的低功耗BIST结构。首先介绍了功耗模型和延迟模型的基础知识,然后给出了用于生成双模式LFSR的矩阵,并介绍了解矩阵方程式的算法。随后说明了新的BIST结构和用于矢量分组的模拟退火算法。最后,基于Benchmark电路的实验证明这种结构可以在不降低故障覆盖率的同时减少70％的功耗。     

CSSA-低功耗Montgomery模乘的环形脉动阵列

文章提出了一种环形脉动阵列CSSA（Circular Structured Systolic Array），用于实现Montgomery模乘算法MMM（Montgomery Modular Multiplication）。该阵列采用循环结构，迭代计算。仿真结果表明，与基于一维脉动阵列的MMM硬件实现相比，该结构牺牲了运算时间，但是降低了功耗和芯片面积（本文实现的两个例子，功耗和芯片面积均减少了约97％）。并且，处理单元的数量可配置，以平衡速度和功耗。     

A new extension method of retention time for memory cell on dynamic random access memory

Demands have been placed on dynamic random access memory (DRAM) to not only increase memory capacity and data transfer speed but also to reduce operating and standby currents. When a system uses DRAM, the restricted data retention time necessitates a refresh operation because each bit of the DRAM is stored as an amount of electrical charge in a storage capacitor. Power consumption for the refresh operation increases in proportion to memory capacity. A new method is proposed to reduce the refresh power consumption dynamically, when full memory capacity is not required, by effectively extending the memory cell retention time. Conversion from 1 cell/bit to 2^N cells/bit reduces the variation of retention times among memory cells. The proposed method reduces the frequency of disturbance and power consumption by two orders of magnitude. Furthermore, the conversion itself can be realized very simply from the structure of the DRAM array circuit, while maintaining all conventional functions and operations in the full array access mode.     

超宽禁带半导体金刚石功率电子学研究的新进展

以SiC/GaN为代表的第三代半导体功率电子学已成为当今功率电子学创新发展的主流,超宽禁带半导体金刚石功率电子学将有可能成为下一代固态功率电子学的代表,受到研究人员的广泛关注。介绍了金刚石功率电子学的最新进展,如金刚石单晶、金刚石化学气相沉积同质和异质单晶外延、金刚石多晶外延、金刚石二极管、金刚石MOSFET、金刚石结型场效应晶体管、金刚石双极结型晶体管、金刚石逻辑电路、金刚石射频场效应晶体管和金刚石上GaN HEMT等。还介绍了金刚石材料的大尺寸、低缺陷和p型及n型掺杂等制备技术,金刚石新器件结构设计,金刚石新器件工艺,转移掺杂H端-金刚石沟道和金刚石/GaN界面热阻等研究成果。分析了金刚石功率电子学的发展由来、关键技术突破和发展态势。     

Design for Low Power Testing of Computation Modules with Contiguous Subspace in VLSI

A kind of pseudo Gray code presentation of test patterns based on accumulation generators is presented and a low power test scheme is proposed to test computational function modules with contiguous subspace in very large scale integration （VLSI）, especially in digital signal processors （DSP）. If test patterns from accumulators for the modules are encoded in the pseudo Gray code presentation, the switching activities of the modules are reduced, and the decrease of the test power consumption is resulted in. Results of experimentation based on FPGA show that the test approach can reduce dynamic power consumption by an average of 17.40% for 8-bit ripple carry adder consisting of 3-2 counters. Then implementation of the low power test in hardware is exploited. Because of the reuse of adders, introduction of additional XOR logic gates is avoided successfully. The design minimizes additional hardware overhead for test and needs no adjustment of circuit structure. The low power test can detect any combinational stuck-at fault within the basic building block without any degradation of original circuit performance.     

A Reconfigurable Power Conscious Core Wrapper and its Application to System-on-Chip Test Scheduling

The increasing test application times required for testing system-on-chips (SOCs) is a problem that leads to higher costs. For modular core based SOCs it is possibly to employ a concurrent test scheme in order to lower the test application times. To allow each core to be tested as a separate unit, a wrapper is inserted for each core, the scan chains at each core are configured into a fixed number of wrapper chains, and the wrapper chains are connected to the test access mechanism. A problem with concurrent testing is that it leads to higher power consumption as several cores are active at a time. Power consumption above the specified limit of a core or above the limit of the system will cause damage and must be avoided. The power consumption must be controlled both at core level as well as on system level. In this paper, we propose a reconfigurable power conscious core wrapper that we include in a preemptive power constrained test scheduling algorithm. The advantages with the wrapper are that the number of wrapper chains at each core can dynamically be changed during test application and the possibility, through clock gating, to select the appropriate test power consumption for each core. The scheduling technique produces optimal solutions in respect to test time and selects wrapper configurations in a systematic manner while ensuring the power limits at core level and system level are not violated. The wrapper configurations are selected such that the number of wrapper configurations as well as the number of wrapper chains at each wrapper are minimized, which minimizes the wrapper logic as well as the total TAM routing. We have implemented the technique and the experimental results show the efficiency of our approach. The research is supported by the Swedish Foundation on Strategic Research (SFS) under the Strategic Integrated Electronic Systems Research (STRINGENT) program.     

铁路5G-R基站太阳能供电架构及应用

针对铁路5G专用移动通信(5G-R)系统基站布置密集、单体功耗高的特点,结合铁路无线通信的需求,研究采用太阳能(PV)为5G-R系统基站的射频拉远单元(RRU)设备供电的方案。对比分析5G-R系统RRU设备日用电规律及太阳能电池日发电规律,确定了采用太阳能结合储能与外电源的供电体系,通过比较几种太阳能电池与外电源组合供电架构的经济性与可靠性,推荐采用直流侧切换的供电架构,并进一步提出了采用直流侧智能配电的太阳能供电方案。本研究在保证5G-R系统运行安全可靠的同时,通过采用太阳能供电方式降低了铁路5G-R系统对外电源的需求。     

Multiple-Constraint Driven System-on-Chip Test Time Optimization

The cost of testing SOCs (systems-on-chip) is highly related to the test application time. The problem is that the test application time increases as the technology makes it possible to design highly complex chips. These complex chips include a high number of fault sites, which need a high test data volume for testing, and the high test data volume leads to long test application times. For modular core-based SOCs where each module has its distinct tests, concurrent application of the tests can reduce the test application time dramatically, as compared to sequential application. However, when concurrent testing is used, resource conflicts and constraints must be considered. In this paper, we propose a test scheduling technique with the objective to minimize the test application time while considering multiple conflicts. The conflicts we are considering are due to cross-core testing (testing of interconnections between cores), module testing with multiple test sets, hierarchical conflicts in SOCs where cores are embedded in cores, the sharing of the TAM (test access mechanism), test power limitations, and precedence conflicts where the order in which tests are applied is important. These conflicts must be considered in order to design a test schedule that can be used in practice. In particular, the limitation on the test power consumption is important to consider since exceeding the system's power limit might damage the system. We have implemented a technique to integrate the wrapper design algorithm with the test scheduling algorithm, while taking into account all the above constraints. Extensive experiments on the ITC'02 benchmarks show that even though we consider a high number of constraints, our technique produces results that are in the range of results produced be techniques where the constraints are not taken into account.     

具有带外抑制特性的Ka波段低功耗低噪声放大器

基于0.15μm GaAs赝配高电子迁移率晶体管(PHEMT)工艺,成功研制了一款30~34 GHz频带内具有带外抑制特性的低功耗低噪声放大器(LNA)微波单片集成电路(MMIC)。该MMIC集成了滤波器和LNA,其中滤波器采用陷波器结构,可实现较低的插入损耗和较好的带外抑制特性;LNA采用单电源和电流复用结构,实现较高的增益和较低的功耗。测试结果表明,该MMIC芯片在30~34 GHz频带内,增益大于28 dB,噪声系数小于2.8 dB,功耗小于60 mW,在17~19 GHz频带内带外抑制比小于-35 dBc。芯片尺寸为2.40 mm×1.00 mm。该LNA MMIC可应用于毫米波T/R系统中。