Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature (HPHT) sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, B, and Ti. The thermal conductivity (TC) obtained exhibited as high as 688 W·m-1·K-1, but also as low as 325 W·m-1·K-1. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.     

Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering

Spark plasma sintering was used to fabricate Al/diamond composites. The effect of sintering temperature on the microstructure and thermal conductivity (TC) of the composites was investigated with the combination of experimental results and theoretical analysis. The composite sintered at 550℃ shows high relative density and strong interfacial bonding, whereas the composites sintered at lower (520℃) and higher (580–600℃) temperatures indicate no interfacial bonding and poor interfacial bonding, respectively. High relative density and strong interfacial bonding can maximize the thermal conductivity of Al/diamond composites, and taking both effects of particle shape and inhomogeneous interfacial thermal conductance into consideration can give a fairly good prediction of composites’ thermal conduction properties.     

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.     

Thermal conductivity model of filled polymer composites

Theoretical and empirical models for predicting the thermal conductivity of polymer composites were summarized since the 1920s. The effects of particle shape, filler amount, dispersion state of fillers, and interfacial thermal barrier on the thermal conductivity of filled polymer composites were investigated, and the agreement of experimental data with theoretical models in literatures was discussed. Silica with high thermal conductivity was chosen to mix with polyvinyl-acetate (EVA) copolymer to prepare SiO₂/EVA co-films. Experimental data of the co-films’ thermal conductivity were compared with some classical theoretical and empirical models. The results show that Agari’s model, the mixed model, and the percolation model can predict well the thermal conductivity of SiO₂/EVA co-films.     

氮化硼纤维填充聚乙烯醇导热复合材料的制备

以聚乙烯醇（PVA）为基体,选用六方氮化硼纤维（BN fiber）作为导热填料,通过溶液共混的方法制备导热复合材料。结合X射线衍射仪（XRD）、扫描电子显微镜（SEM）以及导热测试结果,探究填料的微观形貌以及与基体的界面相容性对于提升复合材料导热性能的影响。结果表明：BN fiber对于提升复合材料的面内导热率有很好的效果,而且采用过氧化氢（H₂O₂）溶液进行表面改性,可以有效改善界面相容性;当经过1 400℃热处理再经过表面改性的BN fiber（BN fiber-1400-H₂O₂）的填充量为5%（质量分数）时,复合材料的面内导热率达到了1.32 W·m^-1·K^-1,为纯PVA体系的629%,相比于表面改性前提升了60%。     

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes (CNTs) were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs (W-CNTs) in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vol%, but high content of W-CNTs (10vol%) resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs (<5.0vol%) exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vol%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the (W-CNT)-Cu interface was predicted in terms of Maxwell-Garnett effective medium approximation, and its calculated value was about 3.0×10-9 m2·K·W-1.     

A hybrid hydrogel/textile composite as flame-resistant dress

Currently, the functional and cost-effective flame-resistant textiles(FRTs) are on high demand. However, such FRTs based on general polymer fabrics are always expensive, readily decompose, and their temperatures quickly rise once exposed to thermal environments. Inspired by the large specific heat of water and high decomposition temperature of inorganic substances like SiO_2, this study establishes a simple casting strategy for preparing flameresistant gel/textiles(FR-GTs). The findings showed that active diffusion of aqueous AAM/SiO_2 pre-gel solution into the textile structure enabled the formation of a tough interfacial adhesion between the hydrogel and textiles.The interfacial toughness reached ～272 J/m~2 because the PAAM/SiO_2 nanocomposite hydrogel was filled into textile to form the semi-interpenetrating structure at the interface. The presence of chemical crosslinker(PEGDA)and physical crosslinker(SiO_2) limited the volume expansion of the hydrogel upon swelling. In addition, the PAAM/SiO_2 nanocomposite hydrogel layer prevented burning in high temperature environments(over 100℃),due to the heat dissipation of water during evaporation. This simple strategy provides a guidance towards the fabrication of hybrid hydrogel/textile composites for the applications like household fire resistant materials such as flame-resistant gloves.     

Si对无压浸渗SiCp/Al复合材料显微组织与热导率的影响

研究了Al-8Mg基体中添加Si对无压浸渗SiCp/Al复合材料显微组织和热导率的影响.结果表明,Si能够改善Al与SiC的润湿性,减少复合材料孔隙度,抑制界面反应,提高相对密度.不含Si时,Al与SiC界面反应严重,并且润湿性较差,导致复合材料的热导率和相对密度较低;当基体中添加质量分数12%的Si时,界面反应受到完全抑制,热导率取得最大值;进一步提高基体中Si含量,由于铝基体的热导率随Si含量的增加而降低,导致复合材料的热导率也随之降低.     

短碳纤维增强铜基复合材料的制备及其性能的研究

以化学镀和电镀相结合的方式对碳纤维表面进行涂覆铜处理，采用粉末冶金方法制备了短碳纤维无序增强铜基复合材料，并对复合材料的摩擦磨损性能、力学性能以及导热导电性能进行了研究，研究结果表明：化学镀和电镀相结合的方式对碳纤维表面进行涂覆铜处理，使碳纤维与铜基体结合得较好，用冷压、烧结的粉末冶金法制备出的试样性能良好；碳纤维的加入，虽使复合材料的导热率、电导率有所下降，但仍然保持有良好的导热、导电性能，并且使复合材料的硬度、耐磨性和强度有显著提高，同时碳纤维的加入减小了复合材料的摩擦系数。     

Adjustable thermal expansion in La(Fe,Si)_(13)-based conductive composites by high-pressure synthesis

Providing a suitable contact interface, where a high conductivity material with a desirable coefficient of thermal expansion(CTE) adjoins the target micro-electric devices, is very crucial to optimize the properties and service life of the relevant instruments. Regrettably, a high conductivity, low thermal expansion and relatively inexpensive material is very rare. Composites, fortunately, can offer a method to design materials with adjustable properties by mixing two or more diverse constituents. In this paper, high conductivity composites with adjustable thermal expansion were successfully prepared by a high-pressure synthesis. The composites are based on combining La(Fe,Si)_(13)-based compounds, the materials showing a giant, isotropic negative thermal expansion(NTE) properties, within Cu matrix. The La(Fe,Si)_(13)-based compounds were used to adjust the CTE of the composites, while the Cu phase is in charge of tuning the thermal conductivity properties. Thus, by changing the relative amount of the two components, the composites with high conductivities and adjustable CTE were achieved. Furthermore, the thermal expansion and magnetic properties of the composites were investigated by a physical property measurement system. The present results highlight the potential applications of the Cu-based high conductivity composites with room-temperature NTE properties in the thermal contacts to various semiconductor and microelectronic devices.     

Synergistically optimizing electrical and thermal transport properties of ntype PbSe

In this paper,we report that the thermoelectric performance of n-type Pb Se could be improved through synergistically optimizing electrical and thermal transport properties via Sb doping and Mg alloying.The carrier concentration was firstly optimized through Sb doping,resulting in a maximum power factor of~15.4μW cm~(-1)K~(-2)and maximum ZT of~0.9 at 873 K in Pb_(0.99)Sb_(0.01)Se.Then,Mg was selected for alloying in Pb sites to produce point defects,which can largely intensify the phonon scattering and lower thermal conductivity.After Mg alloying,the thermal conductivity at 300 K(873 K)was significantly suppressed from~4.6 Wm~(-1)K~(-1)(1.5 Wm~(-1)K~(-1))for Pb_(0.99)Sb_(0.01)Se to~2.9 Wm~(-1)K~(-1)(1.1 Wm~(-1)K~(-1))for Pb_(0.99)Sb_(0.01)Se-6%Mg Se.Through combining Sb doping and Mg alloying,a maximum ZT of~1.1 was achieved at 873 K for Pb_(0.99)Sb_(0.01)Se-6%Mg Se,and the average ZT(ZT_(ave))was increased by 28.6%from~0.42 for Pb_(0.99)Sb_(0.01)Se to~0.54 for Pb_(0.99)Sb_(0.01)Se-6%Mg Se.The results indicate that Pb Se is a robust candidate for medium-temperature thermoelectric applications.     

Phase analysis and thermal conductivity of in situ O′-sialon/β-Si3N4 composites

Typical O??-sialon-based ceramics, with a formula of Si_2?x Al _x O_1+x N_2?x , where x was set as 0.25, were fabricated by in-situ synthesis. Si₃N₄, Al₂O₃, and SiO₂ powders were used as raw materials, and MgO and Y₂O₃ were added as sintering additives. All the samples were sintered at different temperatures under a nitrogen pressure of 0.25?C0.30 MPa, and their microstructure, phase content, and thermal conductivity were evaluated. The effects of O??-sialon and ??-Si₃N₄ on the thermal conductivity were analyzed by numerical calculation in detail. In the case of the similar porosity, the thermal conductivity of O??-sialon-based ceramics decreased with the ratio of O??-sialon/??-Si₃N₄ increasing. When the ratio was 12, the thermal conductivity of O??-sialon ceramics sintered at 1360°C was 1.197 W·m^?1·K^?1.     

Carrier transport characteristics of H-terminated diamond films prepared using molecular hydrogen and atomic hydrogen

The H-terminated diamond films, which exhibit high surface conductivity, have been used in high-frequency and high-power electronic devices. In this paper, the surface conductive channel on specimens from the same diamond film was obtained by hydrogen plasma treatment and by heating under a hydrogen atmosphere, respectively, and the surface carrier transport characteristics of both samples were compared and evaluated. The results show that the carrier mobility and carrier density of the sample treated by hydrogen plasma are 15 cm2·V-1·s-1 and greater than 5×1012 cm-2, respectively, and that the carrier mobilities measured at five different areas are similar. Compared to the hydrogen-plasma-treated specimen, the thermally hydrogenated specimen exhibits a lower surface conductivity, a carrier density one order of magnitude lower, and a carrier mobility that varies from 2 to 33 cm2·V-1·s-1. The activated hydrogen atoms restructure the diamond surface, remove the scratches, and passivate the surface states via the etching effect during the hydrogen plasma treatment process, which maintains a higher carrier density and a more stable carrier mobility.     

Interfacial reaction between the oxidized SiC particles and Al-Mg alloys

The interfacial reactions of oxidized SiC particles reinforced Al-Mg matrix composites were investigated by the field emission-scanning electron microscopy (FE-SEM), TEM and X-ray diffraction. It was found that the nanoscale MgO forms initially due to the interfacial reaction, then whether it reacts with molten Al continuously or not depends on the content of Mg in the matrix and its covering densification at the surface of particles. When there is not enough Mg in the matrix for the formation of dense MgO layer, MgO will transform into MgAl₂O₄ crystal owing to the continuous reaction with SiO₂ and molten Al. When dense MgO layer forms at the surface of the particles due to the affluence of Mg for the initial reaction, it will protect the inner SiC from the attack of molten Al. However, the reaction products of both MgO and MgAl₂O₄ are thermo-stable phases at the surface of the particles under high temperature. The results clarify the interfacial reaction route and they are of great value to the control of the interfacial reactions and their interfacial design of the composites.     

高性能铜铝复合排的制备及界面研究

采用固-液法浇注和铸轧工艺制备铝/铜复合材料.研究不同工艺对铜/铝复合排界面结合强度的影响,并对铜/铝复合排界面结构和复合机理进行分析.结果表明:当进行300°C×1h热处理时,所得复合排的结合强度最高,多次热循环后复合排界面结合强度有所增加.电子探针能谱扫描分析(EDS)和X射线衍射分析(XRD)表明铜/铝复合界面上生成金属间化合物Al2Cu,Al4Cu9和AlCu相,从而使得界面层硬度增大.采用该方法制备的铜/铝复合排,整体拉伸强度达98MPa,电阻率为0.021 6×10-6Ω.m.     

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.     

电热式化学镀铜地热地板的表面化学结构与导热性

用X射线光电子能谱及激光导热性能测试仪测试化学镀铜杨木单板的表面化学结构及其复合后地热地板的导热性.结果表明:镀铜后杨木单板的Cu元素与其复合后的地热地板导热率呈正相关关系;镀层中Cu元素以Cu~(2+)的形式存在,随着施镀时间的增加,Cu~+的歧化反应更加完全,CuOH与Cu_2O逐渐还原为金属Cu;在相同含水率条件下,镀铜地热地板复合材料的导热率比全素复合材料的导热率高2倍多,且随着施镀时间的增加,其导热率也随之增大.     

Enhanced electrochemical properties of LaFeO3 with Ni modification for MH-Ni batteries

In this work, we synthesized LaFeO₃-xwt%Ni (x=0, 5, 10, 15) composites via a solid-state reaction method by adding Ni to the reactants, La₂O₃ and Fe₂O₃. Field-emission scanning electron microscopy (FE-SEM) and energy-dispersive X-ray spectroscopy (EDS) results revealed that Ni powders evenly dispersed among the LaFeO₃ particles and apparently reduced their aggregation, which imparted the composites with a loose structure. Moreover, the Ni formed a conductive network, thus improving the conductivity of the composites. The maximum discharge capacity of the LaFeO₃ electrodes remarkably increased from 266.8 mAh·g-1 (x=0) to 339.7 mAh·g-1 (x=10). In particular, the high-rate dischargeability of the LaFeO₃-10wt%Ni electrode at a discharge current density of 1500 mA·g-1 reached 54.6%, which was approximately 1.5 times higher than that of the pure LaFeO₃. Such a Ni-modified loose structure not only increased the charge transfer rate on the surface of the LaFeO₃ particles but also enhanced the hydrogen diffusion rate in the bulk LaFeO₃.     

Preparation and anti atomic oxygen erosion properties of OPPOSS/PI composites

Atomic oxygen (AO) found in low earth orbit can cause serious erosion to polyimide (PI) materials, which greatly limits their lifetime. 8-phenyl silsesquioxane (OPPOSS) was synthesized, and OPPOSS/PI composites were prepared by physical blending, followed by thermal imidization to enhance the AO erosion resistance of PI materials. The morphology, composition, and structure of the composites were analyzed before and after AO exposure in a ground simulated facility of atomic oxygen. After 16 h AO exposure, the OPPOSS/PI composite with 5wt% OPPOSS addition shows an erosion rate of about 1.4×10?24 cm3/atom with only 48% mass loss of that of PI without OPPOSS addition. The mixture of OPPOSS nano molecules is assembled into a kind of regular square structure and distributed evenly in OPPOSS/PI composites. Some SiO₂ particles are formed in the composites during AO exposure, which can act as “inert points” to reduce the AO erosion rate of OPPOSS/PI composites.     

Synthesis of dental resins using diatomite and nano-sized SiO2 and TiO2

The mechanical properties of dental composites were improved by porous diatomite and nano-sized silica (OX-50) used as co-fillers.The resin composites,filled with silanized OX-50 and silanized diatomit...