A 0.13 μm CMOS UWB RF Transmitter with an On‐Chip T/R Switch

This paper presents a fully integrated 0.13 μm CMOS MB‐OFDM UWB transmitter chain (mode 1). The proposed transmitter consists of a low‐pass filter, a variable gain amplifier, a voltage‐to‐current converter, an I/Q up‐mixer, a differential‐to‐single‐ended converter, a driver amplifier, and a transmit/receive (T/R) switch. The proposed T/R switch shows an insertion loss of less than 1.5 dB and a Tx/Rx port isolation of more than 27 dB over a 3 GHz to 5 GHz frequency range. All RF/analog circuits have been designed to achieve high linearity and wide bandwidth. The proposed transmitter is implemented using IBM 0.13 μm CMOS technology. The fabricated transmitter shows a ?3 dB bandwidth of 550 MHz at each sub‐band center frequency with gain flatness less than 1.5 dB. It also shows a power gain of 0.5 dB, a maximum output power level of 0 dBm, and output IP3 of +9.3 dBm. It consumes a total of 54 mA from a 1.5 V supply.     

A Novel Unequal Broadband Out‐of‐Phase Power Divider Using DSPSLs

In this paper, a novel unequal broadband out‐of‐phase power divider (PD) is presented. Double‐sided parallel‐strip lines (DSPSLs) are employed to achieve an out‐of‐phase response. Also, an asymmetric dual‐band matching structure with two external isolation resistors is utilized to obtain arbitrary unequal power division, in which the resistors are directly grounded for heat sinking. A through ground via (TGV), connecting the top and bottom sides of the DSPSLs, is used to short the isolation components. Additionally, this property can efficiently improve the broadband matching and isolation bandwidths. To investigate the proposed divider in detail, a set of design equations are derived based on the circuit theory and transmission line theory. The theoretical analysis shows that broadband responses can be obtained as proper frequency ratios are adopted. To verify the proposed concept, a sample divider with a power division of 2:1 is demonstrated. The measured results exhibit a broad bandwidth from 1.19 GHz to 2.19 GHz (59.2%) with a return loss better than 10 dB and port isolation of 18 dB.     

GaAs PIN二极管大功率毫米波单刀双掷开关单片

采用76.2mm(3英寸)GaAs PIN二极管工艺设计和制作了大功率毫米波单刀双掷开关单片。采用并联结构的单刀双掷开关以获得较高的功率特性。在片测试表明,在30～36GHz工作频段,开关导通支路插损1.0dB,驻波优于1.5,开关关断端口隔离度大于34dB。开关在导通态下输入功率0.5dB压缩点P-0.5 dB大于5W。     

Design and analysis for a miniature CMOS SPDT switch using body-floating technique to improve power performance

A low insertion-loss single-pole double-throw switch in a standard 0.18-/spl mu/m complementary metal-oxide semiconductor (CMOS) process was developed for 2.4- and 5.8-GHz wireless local area network applications. In order to increase the P/sub 1dB/, the body-floating circuit topology is implemented. A nonlinear CMOS model to predict the switch power performance is also developed. The series-shunt switch achieves a measured P/sub 1dB/ of 21.3 dBm, an insertion loss of 0.7 dB, and an isolation of 35 dB at 2.4 GHz, while at 5.8 GHz, the switch attains a measured P/sub 1dB/ of 20 dBm, an insertion loss of 1.1 dB, and an isolation of 27 dB. The effective chip size is only 0.03 mm/sup 2/. The measured data agree with the simulation results well, including the power-handling capability. To our knowledge, this study presents low insertion loss, high isolation, and good power performance with the smallest chip size among the previously reported 2.4- and 5.8-GHz CMOS switches.     

$Ka$-Band Low-Loss and High-Isolation Switch Design in 0.13-$mu{hbox {m}}$ CMOS

This paper presents designs and measurements of Ka-band single-pole single-throw (SPST) and single-pole double-throw (SPDT) 0.13-CMOS switches. Designs based on series and shunt switches on low and high substrate resistance networks are presented. It is found that the shunt switch and the series switch with a high substrate resistance network have a lower insertion loss than a standard designs. The shunt SPST switch shows an insertion loss of 1.0 dB and an isolation of 26 dB at >35 GHz. The series SPDT switch with a high substrate resistance network shows excellent performance with 2.2-dB insertion loss and isolation at 35 GHz, and this is achieved using two parallel resonant networks. The series-shunt SPDT switch using deep n-well nMOS transistors for a high substrate resistance network results in an insertion loss and isolation of 2.6 and 27 dB, respectively, at 35 GHz. For series switches, the input 1-dB compression point (1P₁) can be significantly increased to with the use of a high substrate resistance design. In contrast, of shunt switches is limited by the self-biasing effect to 12 dBm independent of the substrate resistance network. The paper shows that, with good design, several 0.13- CMOS designs can be used for state-of-the-art switches at 26-40 GHz.     

基于GaAs PIN二极管的宽带大功率单片单刀双掷开关

GaAs PIN二极管具有开态电阻小、截止频率高以及功率容量大的特点,采用GaAs PIN二极管制作的开关插入损耗较小、隔离度较高、并且功率的线性较好。基于河北半导体研究所GaAs PIN工艺制造了一款单刀双掷开关芯片。该开关采用单级并联结构。通过微波在片测试,在小信号条件下,6～18 GHz范围内插入损耗小于1.45 dB、隔离度大于28 dB,输入输出反射损耗小于7.5 dB。把开关装入夹具中进行功率特性测试,在连续波输入功率37 dBm,12 GHz条件下测试输出功率仅压缩0.5 dB,具有非常好的功率特性。在4英寸(100 mm)晶圆上开关的成品率较高,具有非常好的工程应用前景。     

RF MEMS开关的设计分析

针对具有低损耗、高隔离度性能的微机电系统(Micro-Electro-Mechanical System,MEMS)开关,介绍了串联DC式和并联电容式的开关结构模型,并对并联电容式MEMS开关的工作原理、等效电路模型和制造工艺流程进行了描述,利用其模型研究了开关的微波传输性能,设计了一款电容耦合式开关并进行了仿真。由仿真结果可得,开关"开态"时的插入损耗在40 GHz以内优于-0.3 dB;开关"关态"时的隔离度在20～40 GHz相对较宽的频带内优于-20 dB。     

High power DPDT antenna switch MMIC for digital cellular systems

In this paper, we propose two new types of dual-pole double-throw (DPDT) switch GaAs JFET monolithic microwave integrated circuits (MMICs) for digital cellular handsets. These ICs have the excellent characteristics of low insertion loss and high power handling capability, even with a low control voltage by stacking three JFETs with shallow V_p and using a novel bias circuit using p-n junction diodes. One DPDT switch IC has two shunt FET blocks and can achieve high isolation without external parts. An insertion loss less than 0.6 dB and isolation over 25 dB up to 2 GHz were achieved. P_1dB was about 35 dBm even with a control voltage of 0/3 V. Another DPDT switch IC utilizes parallel resonance of external inductors and parasitic capacitance between the drain and the source of the OFF-state FETs. By attaching 15 nH inductors, for example, the IC exhibited an insertion loss as low as 0.4 dB, an isolation of better than 40 dB at 1.5 GHz, a bandwidth of about 400 MHz for 20 dB isolation, and P_1dB of about 34 dBm with the 0/3 V control     

A GaAs high power RF single-pole dual throw switch IC fordigital-mobile communication system

A high power GaAs monolithic RF switch IC that can handle powers over 5 W (P1 dB: 37 dBm) with a positive 5-V control voltage was developed. This high power handling capability was achieved by using a novel circuit configuration that makes possible the feeding forward of the input-signal to the control gates. The implemented Single Pole Dual Throw switch IC integrated with the coupling capacitors using a high dielectric material, Barium Strontium Titanate, shows an insertion loss less than 0.8 dB at 1 GHz and an isolation over 25 dB in a frequency range of 0.5-1.5 GHz     

一种DC～5GHz串联微波开关的温度特性和功率处理能力的测试与分析

描述了一种串联微波MEMS开关的设计、制造过程,它制作在玻璃衬底上,采用金铂触点,在DC～5GHz,插损小0.6dB,隔离度大于30dB,开关时间小于30μs.对这种微波开关的温度特性和功率处理能力进行了测试,在DC～4GHz,85℃下的插损增加了0.2dB,-55℃下的插损增加了0.4dB,而隔离度基本保持不变.在开关中流过的连续波功率从10dBm上升到35.1dBm,开关的插损下降了0.1～0.6dB,并且在35.1dBm(3.24W)下开关还能工作.和所报道的并联开关最大处理功率(420mW)相比,该结果说明串联开关具有较大的功率处理能力.     

A high-performance 40-85 GHz MMIC SPDT switch using FET-integrated transmission line structure

A compact ultra-broadband distributed SPDT switch has been developed using GaAs PHEMTs. An FET-integrated transmission line structure, where the source pad of the shunt FET has been integrated into the signal line while the drain has been grounded to a via-hole with minimum parasitic inductance, has been proposed to extend the operating bandwidth of the distributed switches. SPDT and SPST switches using this structure have been fabricated using a commercial GaAs PHEMT foundry. The SPDT switch showed low insertion loss (<2 dB) and good isolation (>30 dB) over an octave bandwidth from 40 to 85 GHz. At 77 GHz, the SPDT switch showed extremely low insertion loss of 1.4 dB and high isolation of 38 dB. The chip size was as small as 1.45/spl times/1.0 mm/sup 2/. To the best of our knowledge, this is among the best performance ever reported for an octave-band SPDT switch at this frequency range. SPST switch also showed the excellent performance with the insertion loss of 0.4 dB and isolation of 34 dB at 60 GHz.     

Diode SPDT Switching at High Power with Octave Microwave Bandwidth

A SPDT diode switch was designed for use at 1-2 GHz, having 1.3 dB maximum insertion loss and 43 dB minimum isolation. It was tested to a burnout peak power of 6 kW at 1 /spl mu/s pulse length and 0.001 duty cycle. The switch configuration uses a transmission-line tee with diodes mounted in shunt with the line for convenient mechanical access and efficient heat removal. This configuration is examined to optimize both the transmission and isolation properties over an octave bandwidth. Special attention is given to the procedures for resonantly tuning the diode capacity and inductance parameters. A design criterion for a circuit that minimizes ohmic losses contributed by the diodes is also presented.     

W波段高功率铁氧体开关的研制

毫米波频段具有波长短、频率高、带宽宽等优势,毫米波器件的需求日益迫切。然而因要求小尺寸且 受限于工艺水平,毫米波器件实现难度大。文中将折叠双T、差相移段、电桥依次通过法兰级联的方式辅以控制电 路,实现了W 波段高功率铁氧体开关的切换;通过优化器件匹配结构,解决了加工精度受限问题;通过简化铁氧体样 品,在可操作范围内实现了90°差相移,最终实现了8 GHz 大带宽、单级损耗小于2 dB、驻波比小于1. 2、隔离度大于 13 dB、开关切换时间3 ms 左右的差相移式开关。对3 个单级开关进行级联、调试并改进控制电路,可在W 频 段8 GHz 的带宽内,实现驻波比小于1. 2、插入损耗小于5. 9 dB、隔离度大于52. 9 dB 的优良性能,接入雷达整 机后的开关时间为1. 5 ms,耐功率1. 2 kW。     

A 900 MHz Zero‐IF RF Transceiver for IEEE 802.15.4g SUN OFDM Systems

This paper presents a 900 MHz zero‐IF RF transceiver for IEEE 802.15.4g Smart Utility Networks OFDM systems. The proposed RF transceiver comprises an RF front end, a Tx baseband analog circuit, an Rx baseband analog circuit, and a ΔΣ fractional‐N frequency synthesizer. In the RF front end, re‐use of a matching network reduces the chip size of the RF transceiver. Since a T/Rx switch is implemented only at the input of the low‐noise amplifier, the driver amplifier can deliver its output power to an antenna without any signal loss; thus, leading to a low dc power consumption. The proposed current‐driven passive mixer in Rx and voltage‐mode passive mixer in Tx can mitigate the IQ crosstalk problem, while maintaining 50% duty‐cycle in local oscillator clocks. The overall Rx‐baseband circuits can provide a voltage gain of 70 dB with a 1 dB gain control step. The proposed RF transceiver is implemented in a 0.18 μm CMOS technology and consumes 37 mA in Tx mode and 38 mA in Rx mode from a 1.8 V supply voltage. The fabricated chip shows a Tx average power of ?2 dBm, a sensitivity level of ?103 dBm at 100 Kbps with , an Rx input P_1dB of ?11 dBm, and an Rx input IP3 of ?2.3 dBm.     

Polymer 1×2 Thermo‐Optic Digital Optical Switch Based on the Total‐Internal‐Reflection Effect

This letter presents a polymer 1×2 thermo‐optic total‐internal‐reflection digital optical switch (TIR‐DOS) with an index contrast of 1.5%‐Δ operating at low power consumption. The structure of our 1×2 TIR‐DOS was created by adding a reflection port to that of a conventional multimode filtering variable optical attenuator. To improve the total‐internal‐reflection efficiency, a heater offset was applied to the crossing region of multimode waveguides of the TIR‐DOS. The fabricated 1×2 TIR‐DOS shows a low electrical power consumption of 18 mW for an on‐off ratio of 35 dB.     

高隔离度X波段RF MEMS电容式并联开关

研究了一种新型的、应用于X波段的高隔离度RF MEMS电容式并联开关结构。相比于普通的并联结构,该开关通过共面波导(CPW)传输线与地平面之间的衬底刻槽结构将隔离度提高了7dB,关态时在13.5GHz谐振频率处的隔离度为-54.6dB,执行电压为26V。弹簧梁结构开关的执行电压下降为14V,在11GHz处其隔离度为-42.8dB。通过两个并联开关级联与开关间的高阻传输线构成的π型调谐开关电路,在11.5GHz处的隔离度为-81.6dB。     

航管应答机中多模式大功率开关设计

根据航管应答机的应用需求,基于PIN 二极管设计了一款低插损、高隔离度、多模式的国产大功率开 关;理论分析了电路结构,介绍了器件选型以及锡金焊料烧结和金丝键合工艺设计;通过在设计中切换不同通道,实 现了不同功率模式的输出,利用ADS 软件对电路进行仿真和优化,进行了小信号和大信号下的测试。实物测试表 明,在1~2 GHz 频带内,开关插损<0. 5 dB,隔离度>60 dB,切换时间<500 ns,功率容量可达1000 W(峰值,占空比 4%),指标优异,可靠性高,具有很高的实用价值。     

基于Q-MMIC技术的W波段低成本PIN管开关

采用低成本方法设计了一款W波段单刀单掷开关。通过在单独加工的石英基片无源电路上安装倒装PIN管,获得了一款W波段准毫米波单片（Q-MMIC）开关。为了获得低损耗、高隔离度性能,开关设计中采用了3-D PIN管模型和电路补偿结构。测试结果表明开关在88GHz时插入损耗最小,最小值为0.5dB;在80-101 GHz频率范围内,开关导通时的插入损耗小于2 dB;在84-104 GHz频率范围内,开关隔离度大于30 dB。整个开关电路尺寸为1.5 mm× 3.0 mm。     

All-metal high-isolation series and series/shunt MEMS switches

This paper presents a novel all-metal series switch with several different pull-down electrode geometries. The switch results in an up-state capacitance of 5-9 fF and an isolation of -25 to -30 d8 at 10 GHz. The fabrication process is completely compatible with the standard capacitive (or dc-contact) shunt switch, A dc-30 GHz series/shunt switch is also presented with an isolation of -60 dB at 5 GHz and -42 dB at 10 GHz. This is the highest isolation switch available to-date. The performance is limited by radiation in the CPW lines and not by the series/shunt switch characteristics. The application areas are in high-isolation switches for basestations and satellite systems     

采用DGS降低相位噪声和提高输出功率的倒扣集成振荡器

设计了一种新型的缺陷接地结构(DGS)并将之应用到倒扣集成毫米波振荡器中.分析并比较了具有DGS结构和没有DGS结构的两种振荡器性能.测试数据显示具有DGS结构的振荡器与没有DGS结构的振荡器相比,相位噪声降低4～6dB,输出功率增加0.8dBm.研究结果表明DGS结构嵌入到振荡器的谐振电路和输出端时,振荡器的相位噪声降低且输出功率增大.