DC磁控溅射制备的TiNx薄膜组分及性能分析

利用DC磁控溅射法在p-Si(111)衬底上制备了TiNx薄膜.利用X射线能谱仪(EDX)、X射线衍射(XRD)、紫外/可见分光光度计、四探针电阻率测试仪等分析了薄膜的组分、结构和光电特性.结果表明,薄膜中N/Ti原子比接近于1;衬底温度对薄膜的择优取向影响显著,240℃附近是TiNx薄膜结晶择优取向由(111)向(200)转变的临界点;薄膜在近红外波段平均反射率随衬底温度的升高,先增大后减小;薄膜的电阻率随着衬底温度的升高而显著降低.     

ZnS薄膜生长温度对ZnS/PS体系结构和发光的影响

用电化学阳极氧化法制备了一定孔隙率的多孔硅(PS,Porous Silicon)样品,然后以PS为衬底用脉冲激光沉积(PLD)的方法在100℃、200℃和300℃下生长ZnS薄膜.X射线衍射(XRD)结果表明,样品都在28.5°附近有一个较强的衍射峰,对应于β-ZnS(111)晶向,说明薄膜沿该方向择优取向生长,但由于衬底PS粗糙的表面结构,衍射峰的半高全宽(FWHM)较大.随着ZnS薄膜生长温度的升高,薄膜的衍射峰强度逐渐增强.扫描电子显微镜(SEM)像显示,随着薄膜生长温度的升高,构成薄膜的纳米晶粒生长变大.室温下的光致发光(PL)谱表明,随着薄膜生长温度的升高,ZnS的发光强度增强而PS的发光强度减弱,把ZnS的蓝绿光与PS的红光叠加,在可见光区450～700 nm形成了一个较宽的光致发光谱带,呈现较强的白光发射.     

PLD法生长Al_2O_3基ZnO薄膜的特性

在不同衬底温度下,用脉冲激光沉积法(PLD),在Al2O3(0001)平面上生长了ZnO薄膜。研究了衬底温度对其结晶质量、电学性质以及发光性质的影响。结果显示:XRD在2θ为34°处出现了唯一的ZnO(0002)衍射峰;ZnO薄膜的电阻率随衬底温度的升高而增大;在衬底温度为500℃时,出现了位于410nm附近的特殊的光致发光(PL)峰。     

退火对N离子注入ZnO:Al薄膜性能的影响

利用溶胶-凝胶法在(0001)Al2O3衬底上制备了Al/Zn原子比为1%的ZnO:Al薄膜,将能量56keV、剂量1×1017ions/cm2的N离子注入到薄膜中.离子注入后,样品在500～900℃氮气气氛中退火,利用X射线衍射(XRD)、光致发光(PL)、透射谱和四探针研究了退火温度对薄膜性能的影响.结果显示,在800℃以下退火,随退火温度提高,薄膜结晶性能逐渐变好;在600℃以上退火,随退火温度提高,紫外近带边发光峰(NBE)和缺陷相关的深能级可见光发光带都逐渐增强;600℃退火时,样品的电阻率仅为83Ω·cm.     

直流磁控溅射工艺条件对TiN薄膜晶面取向及化学计量比的影响

最近的研究表明,TiN薄膜除了具有优良的化学稳定性和力学性能外,如果把它涂在显示器件上,TiN薄膜还具有良好的减反和抗静电性能.由于TiN薄膜的晶面取向和化学计量比影响它的面电阻,从而影响它的减反和抗静电性能.本文用直流磁控溅射法,通过改变基片温度、溅射总气压及氮气与氩气的比例,在玻璃基片上制备了一系列TiN薄膜试样.利用射线衍射仪(XRD)和X射线光电子能谱(XPS)对试样的晶面取向和化学计量比进行了研究.XRD的结果显示,在其它条件不变的情况下,随着基片温度的升高,TiN薄膜的(200)晶面与(111)晶面衍射强度的比值(R)升高,当基片温度大于330°C时,R值超过1;当N2与Ar的比例不变,增加溅射总气压时,R值逐渐增大,在总气压接近1.0 Pa时,R值接近1;当固定溅射总气压,加大溅射气体中N2的比例时,R值随N2比例的增加先增大,然后有所下降,当N2的比例大于10%后,R值几乎不再随N2比例的增加而变化.XPS的结果表明,所有试样的N与Ti的原子比均大于1;基片的温度对N/Ti原子比的影响不大,改变溅射气体中N2的比例可明显改变N/Ti的比值,当N2的比例在10%左右时,N/Ti的比值达1.3.(PH10)     

低温下磁控溅射AIN薄膜择优取向研究

研究了衬底温度从-20～20℃下射频磁控溅射A1N薄膜的择优取向程度.利用X线衍射(XRD)、原子力显微镜(AFM)和场发射电子显微镜(FESEM)对A1N薄膜的晶体结构、租糙度及表面和断面形貌进行了分析.研究结果表明,当衬底温度低于0℃时,AIN薄膜中的(100)衍射峰消失,A1N薄膜以(002)面择优取向生长.当衬底温度降低时,AIN薄膜的晶粒大小和表面粗糙度减小.AIN薄膜在0℃下沉积具有最佳的择优取向程度和较低的表面粗糙度.     

Si(111)上生长LiNbO_3薄膜的研究

利用射频磁控溅射的方法,在Si(111)衬底上制备了LiNbO3薄膜。采用X射线衍射(XRD)和扫描电子显微镜(SEM)研究了衬底温度、退火温度和溅射气体压强对LiNbO3薄膜结晶和表面形貌的影响,并用椭圆偏振仪测量了薄膜的厚度和折射率。结果表明:衬底温度为450℃时制备的薄膜,退火前后都没有LiNbO3相生成;衬底温度为500～600℃时,LiNbO3薄膜出现(012)、(104)和(116)面衍射峰,经600℃退火后3个衍射峰的强度加强;衬底温度为600℃时,经600～900℃退火得到的LiNbO3薄膜,除出现(012)、(104)和(116)面衍射峰外,还出现(006)面衍射峰;溅射气体压强从0.8 Pa增大到2.4 Pa时,经800℃退火后得到的LiNbO3薄膜表面晶粒团簇变小,而0.8 Pa制备的薄膜经800℃退火后LiNbO3相的结晶程度较其它压强下完善;900℃退火后得到的LiNbO3薄膜折射率为2.25,与LiNbO3晶体相当。     

衬底温度对PLD法制备的ZnO:Ga薄膜结构和性能的影响

利用脉冲激光沉积法在石英衬底上制备了镓掺杂氧化锌(ZnO:Ga)透明导电薄膜,研究了衬底温度对薄膜的结构、表面形貌和光电性能的影响.研究表明:制备的ZnO:Ga薄膜是具有六角纤锌矿结构的多晶薄膜.随着衬底温度的增加,衍射峰明显增强,晶粒尺寸增大.当衬底温度为450℃时,薄膜的最低电阻率为8.5×10<'-4>Ω·cm,...     

衬底温度对ZnO薄膜氧缺陷的影响

采用射频磁控溅射在石英玻璃和单晶硅Si(100)衬底上制备了ZnO薄膜，研究了衬底温度对ZnO薄膜中氧缺陷的影响。实验发现，ZnO薄膜c轴取向性随温度的升高而增强；当衬底温度达到550。C时，XRD谱上仅出现一个强的(002)衍射峰和一个弱的(004)衍射峰，显示ZnO具有优异c轴取向性。同时，随着温度的升高，ZnO薄膜的紫外透射截止边带向高波长方向漂移，其电导率也随衬底温度的升高逐渐增大，表明薄膜中的氧缺陷逐渐增多。这种氧缺陷是由于ZnO的氧平衡分压高于Zn所致，可通过提高溅射气体中氧含量来改善。     

PLD法制备ZnO薄膜的退火特性和蓝光机制研究

通过脉冲激光沉积(PLD)方法,在O2中和100～500℃衬底温度下,用粉末靶在Si(111)衬底上制备了ZnO薄膜,在300℃温度下生长的薄膜在400～800℃温度和N2氛围中进行了退火处理,用X射线衍射(XRD)谱、原子力显微镜(AFM)和光致发光(PL)谱表征薄膜的结构和光学特性。XRD谱显示,在生长温度300℃时获得较好的复晶薄膜,在退火温度700℃时获得最好的六方结构的结晶薄膜;AFM显示,在此退火条件下,薄膜表面平整、晶粒均匀;PL谱结果显示,在700℃退火时有最好的光学特性。     

Zn0.8Na0.1Co0.1O薄膜的制备及衬底温度对其影响

采用脉冲激光沉积(PLD)技术.在温度为400、500和600℃的SiO2衬底上成功制备出Zn0.8Nao.1Co0.1O薄膜.用x射线衍射(XRD)、原子力显微镜(AFM)、荧光光谱仪、四探针电阻率测试台等对薄膜的结构、表面形貌和光电性质进行了表征,讨论了不同衬底温度对薄膜结构、光学和电学性质的影响.结果表明:掺杂没...     

基底温度对直流磁控溅射ITO透明导电薄膜性能的影响

用直流磁控溅射法制备透明导电锡掺杂氧化铟(ITO)薄膜,靶材为ITO陶瓷靶,组分为m(In2O3):m(SnO2)=9:1.运用分光光度计,四探针测试仪研究了基底温度对薄膜透过率、电阻率的影响,并用X射线衍射(XRD)仪对薄膜进行结构分析.计算了晶面间距和晶粒尺寸,分析了薄膜的力学性质.实验结果表明,在实验设备条件下,直流磁控溅射ITO陶瓷靶制备ITO薄膜时,适当的基底温度(200℃)能在保证薄膜85%以上高可见光透过率下,获得最低的电阻率,即基底温度有个最佳值.薄膜的结晶度随着基底温度的提高而提高.     

衬底温度对磁控溅射法制备的ZnO:In薄膜光电性能的影响

以粉末靶为溅射源,采用射频磁控溅射法在玻璃衬底上制备掺铟氧化锌(ZnO:In)透明导电膜.利用X射线衍射仪、原子力显微镜、霍尔测试仪,以及分光光度计等对不同衬底温度下生长的ZnO:In薄膜的结构、光电性能进行表征.结果表明,所有制备的ZnO:In薄膜均为六角纤锌矿结构的多晶膜,具有(002)择优取向.ZnO:In薄膜的电阻率随着衬底温度的升高先减小后增大,当衬底温度为100℃时,薄膜的最低电阻率为3.18×10~(-3)Ω·cm.制备的薄膜可见光范围内透过率均在85%以上.

Abstract：

Indium doped zinc oxide (ZnO : In) films were deposited on glass substrates by RF magnetron sputtering method using a powder target.The influence of the substrate temperature on the structure,optical and electrical properties was investigated by X-ray diffraction (XRD),atom force microscope (AFM),Hall measurement and optical transmission spectroscopy.The results show all the obtained films are polycrystalline with a hexagonal wurtzite structure and grow preferentially in the (002) direction,and the grain size is about 22～29 nm.The conductivity of the ZnO : In films change with the substrate temperature,and the lowest electrical resistivity is about 3.18 × 10~3 Ω·cm for the samples deposited at substrate temperature 100 ℃.The transmittance of our films in the visible range is all higher than 85%.     

Preparation and characteristics of Nb-doped indium tin oxide thin films by RF magnetron sputtering

Niobium-doped indium tin oxide(ITO:Nb)thin films are fabricated on glass substrates by radio frequency(RF)magnetron sputtering at different temperatures.Structural,electrical and optical properties of the films are investigated using X-ray diffraction(XRD),atomic force microscopy(AFM),ultraviolet-visible(UV-VIS)spectroscopy and electrical measurements.XRD patterns show that the preferential orientation of polycrystalline structure changes from(400)to(222)crystal plane,and the crystallite size increases with the increase of substrate temperature.AFM analyses reveal that the film is very smooth at low temperature.The root mean square(RMS)roughness and the average roughness are 2.16 nm and 1.64 nm,respectively.The obtained lowest resistivity of the films is 1.2×10-4?.cm,and the resistivity decreases with the increase of substrate temperature.The highest Hall mobility and carrier concentration are 16.5 cm2/V.s and 1.88×1021 cm-3,respectively.Band gap energy of the films depends on substrate temperature,which is varied from 3.49 eV to 3.63 eV.     

Effect of thickness on optoelectrical properties of Nb-doped indium tin oxide thin films deposited by RF magnetron sputtering

Niobium-doped indium tin oxide （ITO:Nb） thin films are prepared on glass substrates with various film thicknesses by radio frequency （RF） magnetron sputtering from one piece of ceramic target material. The effects of thickness （60-360 nm） on the structural, electrical and optical properties of ITO: Nb films are investigated by means of X-ray diffraction （XRD）, ultraviolet （UV）-visible spectroscopy, and electrical measurements. XRD patterns show the highly oriented （400） direction. The lowest resistivity of the films without any heat treatment is 3.1×10^-4 Ω·cm^-1, and the resistivity decreases with the increase of substrate temperature. The highest Hall mobility and carrier concentration are 17.6 N·S and 1.36×10²¹ cm^-3, respectively. Band gap energy of the films depends on substrate temperature, which varies from 3.48 eV to 3.62 eV.     

准分子脉冲激光沉积法制备的ZrO2薄膜结构和电学性能的研究

采用准分子脉冲激光沉积法 (PLD)分别在Pt/Ti/SiO2 /Si和SiO2 /Si衬底上制备了ZrO2 薄膜 ,采用扩展电阻法 (SRP)研究了薄膜纵向电阻分布 ;采用X射线衍射法 (XRD)研究了衬底温度对ZrO2 薄膜结晶性能的影响 ;精确测试了薄膜的表面粗糙度 ;讨论了薄膜结晶性能与其电学I V特性之间的关系。     

衬底温度和氮气分压对氮化锌薄膜的性能影响

采用射频磁控溅射法在不同衬底温度和不同氮气分压下在石英玻璃衬底上制备氮化锌薄膜. 利用XRD和喇曼散射仪分析了样品的晶体结构和组成. 结果表明当氮气分压为1/2时可以生成多晶单一相的氮化锌薄膜. 利用霍尔效应和光学透过谱测量了样品的电学和光学性质. 结果表明衬底温度对样品的电学和光学性质有很大的影响. 衬底温度从100℃上升到300℃时,样品的电阻率从0.49降低到0.023Ω·cm. 电子浓度从2.7×1016升高到8.2×1019cm-3. 在衬底温度为200℃,氮气分压为1/2时,样品的光学带隙为1.23eV.     

Effects of substrate temperature on electrical and structural properties of copper thin films

This paper addresses the effects of substrate temperature on electrical and structural properties of dc magnetron sputter-deposited copper (Cu) thin films on p-type silicon. Copper films of 80 and 500 nm were deposited from Cu target in argon ambient gas pressure of 3.6 mTorr at different substrate temperatures ranging from room temperature to 250 °C. The electrical and structural properties of the Cu films were investigated by four-point probe and atomic force microscopy. Results from our experiment show that the increase in substrate temperature generally promotes the grain growth of the Cu films of both thicknesses. The RMS roughness as well as the lateral feature size increase with the substrate temperature, which is associated with the increase in the grain size. On the other hand, the resistivity for 80 nm Cu film decreases to less than 5 μΩ-cm at the substrate temperature of 100 °C, and further increase in the substrate temperature has not significantly decreased the film resistivity. For the 500 nm Cu films, the increase in the grain size with the substrate temperature does not conform to the film resistivity for these Cu films, which show no significant change over the substrate temperature range. Possible mechanisms of substrate-temperature-dependent microstructure formation of these Cu films are discussed in this paper, which explain the interrelationship of grain growth and film resistivity with elevated substrate temperature.     

Studies on the properties of sputter-deposited Ag-doped ZnO films

Ag-doped ZnO films were prepared by simultaneous rf magnetron sputtering of ZnO and dc magnetron sputtering of Ag on glass substrate. The influences of dopant content and substrate temperature on the properties of the as-grown films were investigated. Several analytical tools such as X-ray diffraction, spectrophotometer, atomic force microscopy, scanning electron microscopy and four-point probe were used to explore the possible changes in electrical and optical properties. The as-grown film has a preferred orientation in the (0 0 2) direction. As the amounts of the Ag dopant were increased, the crystallinity as well as the transmittance and optical band gap were decreased while the electrical resistivity increased. However, as the substrate temperature was increased, the crystallinity and the transmittance were increased. A small amount of Ag (<1 at%) lowered the resistivity by 30% with only a slight decrease in the visible transparency.