键合线互连电路的优化设计

介绍了一种微波多芯片组件中芯片与传输线互连的键合线互连电路设计。采用低通滤波器方法设计的键合线互连电路结构,在键合线长度一定的情况下,能够显著提高键合线互连电路的频率响应。设计了一种基于3阶低通滤波器的键合线互连电路,将键合线的寄生电感融入了3阶低通滤波器中,改善了键合线互连电路的微波传输特性,提高了键合线互连电路的截止频率。采用微波电路设计软件和三维电磁场软件相结合的设计方法,对键合线互连电路的微波特性进行建模、分析,验证了这种电路设计方法的正确性。     

一些产生互连线降阶模型的方法

随着工艺技术到达深亚微米领域，互连线的耦合电容、电感对电路的影响越来越大。为了有效地捕捉互连线的影响，需要进行精确地电路级模拟，但是从版图自动提取出来的互连线通常是一个大的线性电路。利用spice模拟器来模拟，效率很低。针对线性电路的特点，人们通常采用降阶模型来建模，提出了许多降阶模型方法。本文将介绍各类降阶模型方法，分析它们的原理，比较它们的优缺点。     

互连线RC模型应用条件的仿真研究

研究结果表明,在L与RC比值较小时,阶跃响应的上升时间基本上由RC的乘积决定,电感对电路的影响可以忽略,互连线采用RC模型与RLC模型结果应无多大差别。在L与RC比值较大时,阶跃响应曲线出现振荡,此时使用RC模型需满足工作频率低于RC模型的“上限使用频率;当工作频率超过RC模型的“上限使用频率”时,互连线的模型就必须采用RLC模型。RC模型的“上限使用频率”仅与互连线长度有关:fmax106(Hz·m)。     

超高阶的RLGC互连线时域状态空间模型及其研究

在互连线的建模方面,无论是考虑频变或工艺参数变化还是考虑降解,都需要一个精确的原始模型。它不仅使各种模型简化方法有个精确的起点,而且也是评估各种模型简化方法近似性能的基础。该文用直接闭合式的方法给出了一个计算复杂度为O(N)的精确的超高阶互连线RLGC时域状态空间模型,有3种形式,它是一般互连线树的基本构造元素,也是一种特殊的互连线树。该模型在形式上比文献中给出的更简洁。低阶模型与2000阶模型进行了比较,结果表明阶数较低的RLGC/RLC电路模型与分布参数电路模型相比在电路的振荡特性以及上升时间的描述上存在相当大的误差,因此在互连线树的建模中支路(包括根和叶的互连线)采用低阶原始模型值得商榷。     

用于SPICE模拟高频互连效应的RLC电路模型

提出了一个用于ＳＰＩＣＥ模拟高频互连 应的ＰＣＬ互连电路模型,该模型考虑了频率对互连电感、电阻的影响,适用于从芯片间互连到芯片内互连高频效应的分析。基于所提出的互连模型,对频率达１０００ＭＨｚ时芯片内长互连线的延迟、串扰、过冲等互连寄生效应进行了分析,并指出了抑制互连效应的技术途径。     

互连线和CMOS模型对性能影响的分析

在集成电路中,全局互连线的设计是关键.分析了互连线RC和RLC模型的不同特性;针对互连线与CMOS器件级联的电路进行分析.分析了集成电路中互连线和CMOS的模型对性能的影响,并给出了基于HSPICE软件的仿真结果.仿真结果表明,不同互连线和CMOS模型对系统传输特性有一定影响.     

新型单相电压型准阻抗源AC-AC变换器

给出一种新型的电压型准阻抗源AC-AC变换电路,分析了电路的基本结构和工作原理。这种电路拓扑由大升压比阻抗网络和单相LC滤波器依序级联构成,大升压比阻抗网络是由储能电感L1和依序级联的两个相同的SLCC型二端口阻抗网络单元串联构成。采用脉冲宽度调制法对电路进行控制从而改变输出电压,利用电感伏秒特性,用MATLAB/Simulink对电路仿真,最后在仿真结果的基础上用TMS320F2812搭建出实验电路,实验结果和仿真结果共同验证了电路结构的可靠性和正确性。     

传送快脉冲的微带线

传送快脉冲的微带线Ｍａｒｃ　Ｔｈｏｍｐｓｏｎ在很多实用电路中，快电流脉冲必须从印制板的一端传输到另一端，但是，由于互连线的电感需要进行端到端连接（图１），因此，这样做是有困难的。这种互连会产生寄生电感（Ｌｐ），限制电路的开关速度。现以一种最大输出电压...     

基于时域滤波技术的土壤阻抗模型研究

时域分析场线耦合问题对于线缆电磁脉冲防护研究具有重要意义.针对时域传输线方程中土壤阻抗与电流卷积计算的复杂性,提出了一种基于数字滤波技术的土壤阻抗模型估算方法.介绍了所采用的土壤阻抗模型以及数字滤波方法的基本原理和建模结果.这一数字滤波建模方法的引入避免了复杂的卷积计算,可用于分析非均匀场入射或终端连接非线性负载条件下场线耦合的时域计算.     

晶上系统电源分配网络建模及IR-drop研究

为预测和评估晶上系统电性能，提出了一种结合电磁和分析模拟的晶上系统电源分配网络（PDN）建模方法。该方法将PDN结构划分为单独组件，用电磁工具和公式计算提取无源电阻、电感、电容参数后，按组件位置组装成等效电路模型。通过与三维全波仿真自阻抗曲线比较对模型进行了验证，并基于模型，用ADS研究了模组位置排布、垂直互连密度、芯片功耗及去耦电容对电压降（IR-drop）的影响。结果表明：模型自阻抗曲线与三维全波仿真基本吻合；在一定范围内，合理排布模组位置、增加垂直互连密度、减少芯片功耗、使用较大去耦电容能降低IR-drop，为晶上系统设计和制造提供了参考。     

Crosstalk and transient analyses of high-speed interconnects andpackages

A multiconductor interconnect is modeled using resistors and linear-dependent current and voltage sources. The analysis of a high-speed circuit including lossy interconnection buses is then reduced to simulation of the circuit together with the equivalent circuits of the interconnects. The authors present a new method for the crosstalk and transient analysis of lossy interconnects with arbitrary termination circuits. In order to analyze an interconnect containing N signal conductors, they derive closed-form formulas to determine its transfer functions, and they apply the inverse Fourier transform to obtain its time-domain pulse response functions. Two types of equivalent circuit models can be formulated once the pulse response functions of the interconnect are found. The circuit schematics of the models depend on the number of the signal conductors, irrespective of the physical parameters of the interconnect. These models are compatible with standard circuit simulation tools since they consist of linear resistive networks and linear-dependent sources only. Two example circuits are studied to examine the accuracy and efficiency of the method     

一个用于VHSIC连接线瞬态分析的电路模拟器

本文介绍了一个可对含连接线的电路进行瞬态分析的电路模拟器,该模拟器是在SPICE基础上经修改扩充而成的,连接线的处理采用了文献[1]的方法.文中介绍了方法的基本原理,讨论了数值Laplace反变换时参数的选择与误差的控制.实际VHSIC电路的试算结果表明,该模拟器是相当有效的.     

超大规模集成电路中互连结构的逻辑模型

本文首次提出一种新观点，超大规模集成电路中互连结构的等效模型应具有层次性，对于底层的电路设计，应将互加看作一种具有分布参数的多端口网络，而对于高层次的模块设计，则应将互连看作一种逻辑元件，基于这种观点，本文提出了一种表格型的逻辑模型，它可以将互连产生的三种主要负效应：串扰、延迟和信号变形人武部考虑在内。     

Time-domain modeling of high-speed interconnects by modified methodof characteristics

In this paper, a new model of lossy transmission lines is presented for the time-domain simulation of high-speed interconnects. This model is based on the modified method of characteristics (MMC). The characteristic functions are first approximated by applying lower order Taylor series in the frequency domain, and then a set of simple recursive formulas are obtained in the time domain. The formulas, which involve tracking performances between two ends of a transmission line, are similar to those derived by the method of characteristics for lossless and undistorted lossy transmission lines. The algorithm, based on the proposed MMC model, can efficiently evaluate transient responses of high-speed interconnects. It only uses the quantities at two ends of the lines, requiring less computation time and less memory space than required by other methods. Examples indicate that the new method has high accuracy and is very efficient for the time-domain simulation of interconnects in high-speed integrated circuits     

An efficient systematic approach to model extraction for passivemicrowave circuits

This paper introduces a new systematic approach to equivalent circuit model extraction for linear microwave passive circuits directly from full-wave frequency domain simulation. The devices being modeled may be either lossless or lossy. Adaptive frequency sampling is used to minimize the computational effort of EM simulation while critically assisting in determining the pole locations of an RF circuit. A simple circuit model for lossy RF circuits along with a determined starting point of optimization of lumped element component values is also presented in detail. The overall result is an efficient and accurate means to produce a complete equivalent lumped element model for RF circuits that is suitable for use in conventional SPICE-like simulation software     

Improved global rational approximation macromodeling algorithm fornetworks characterized by frequency-sampled data

Recently, the demand for high-performance wireless designs has been increasing while simultaneously the speed of high-end digital designs have crossed over the gigahertz range. New simulation tools which accurately characterize high-frequency interconnects are needed. This paper presents improvements to a new macromodeling algorithm. The algorithm employs curve-fitting techniques to achieve a pole-residue approximation of the frequency-sampled network. The frequency sampled S-parameters or Y-parameters can be obtained from measurement or full-wave simulation to characterize the frequency-dependent interconnects behavior. The improvements extend the approach to lossless structures, increase its accuracy with pole-clustering, and ensure its validity with a passivity test. This paper addresses some of the special considerations that must be made to the method so it can efficiently and accurately be applied to lossless circuits and structures. The resulting algorithm is now capable of accurately extracting a wide-band frequency domain macromodel from frequency-sampled data for either LC circuit (lossless) or RLC circuits (lossy). The frequency-domain macromodel can be linked to a SPICE circuit simulator for mixed signal circuit analysis using RF, analog, and digital circuits. The circuit can be simulated in the time domain using recursive convolution     

Transient analysis of transmission line circuits based on the semidiscretization of telegraph equations

A new transient analysis method for the transmission line circuits is presented in this paper. Based on the semidiscretization of the telegraph equations, a discretized time domain companion models for the transmission lines which can be conveniently implemented in a general circuit simulator such as SPICE is derived. The computation required for the model is linear with time, equivalent to the recursive convolution-based method. The formulations for both single and coupled lossy transmission lines are given. Numerical experiments are carried out to demonstrate the validity of the method.     

射频高损耗硅基双互连线建模

针对高损耗硅衬底,采用部分元等效电路法和准静磁积分公式,将衬底涡流等效为衬底镜像电流,建立射频硅基双互连线等效电路模型。该模型考虑了趋肤效应、邻近效应和衬底损耗对互连线串联电感Ls和串联电阻Rs频率特性的制约。通过与全波分析方法对比,验证了在20 GHz范围内由该模型导出的互连线等效电感L、等效电阻R误差均在8%以内。该模型可望应用于硅基射频集成电路设计。     

Analysis of crosstalk and field coupling to lossy MTLs in a SPICEenvironment

This paper proposes a circuit model for lossy multiconductor transmission lines (MTLs) suitable for implementation in modern SPICE simulators, as well as in any simulator supporting differential operators. The model includes the effects of a uniform or nonuniform disturbing field illuminating the line and is especially devised for the transient simulation of electrically long wideband interconnects with frequency dependent per-unit-length parameters. The MTL is characterized by its transient matched scattering responses, which are computed including both dc and skin losses by means of a specific algorithm for the inversion of the Laplace transform. The line characteristics are then represented in terms of differential operators and ideal delays to improve the numerical efficiency and to simplify the coding of the model in existing simulators. The model can be successfully applied to many kinds of interconnects ranging from micrometric high-resistivity metallizations to low-loss PCBs and cables, and can be considered a practical extension of the widely appreciated lossless MTL SPICE model, which maintains the simplicity and efficiency     

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

The development of a physically consistent multiconductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is presented which constructs SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion. Simulations using wideband measurement data of alumina demonstrate the effect of the Debye based permittivity model.