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薄膜SOI/CMOS的SPICE电路模拟
引用本文:王阳元,奚雪梅.薄膜SOI/CMOS的SPICE电路模拟[J].电子学报,1994,22(5):88-93.
作者姓名:王阳元  奚雪梅
作者单位:北京大学微电子学研究所
摘    要:鉴于SPICE是目前世界上广泛采用的通用电路模拟程序,具具有可扩展模型的灵活性,我们通过修改SPICE源程序把新器件模型--SOIMOSFET模型移植入SPICE中,通过我们的模拟工作,证实了我们模型的正确性和电路实用性,分析了器件参数对SOI/CMOS电路速率的影响,这些结论可以很好地指导电路设计和工艺实践。

关 键 词:薄膜电路  SOI  CMOS电路  SPICE电路

TFSOI/CMOS ICs Simulation Using SPICE
Wang Yangyuan, Xi Xuemei, Gan Xuewen, Cheng Yuhua, LiYingxue.TFSOI/CMOS ICs Simulation Using SPICE[J].Acta Electronica Sinica,1994,22(5):88-93.
Authors:Wang Yangyuan  Xi Xuemei  Gan Xuewen  Cheng Yuhua  LiYingxue
Abstract:A charge-based model for dc and transient circuit simulation has been implemented in SPICE,thereby enabling proper simulation and CAD of SOI/CMOS integrated circuits to be realized. The utility and computing efficiency of the SOIMOSFET model implementation are demonstrated by simulating several representative SOI/CMOS circuits. It has been shown that the shorter channel-length and the thinner Si-film thickness,the faster SOI/CMOS circuit speed,which can compensate low speed caused by decreased power voltage.
Keywords:SPICE circuit simulation  Thin-film SOI/CMOS circuits  Implementation of device models
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