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The separation of generation lifetimes of Si and SiGe using capacitance-transient measurements on MOS capacitors formed by plasma anodisation of Si:Si0.9Ge0.1:Si substrates
Authors:LS Riley  S Hall  JM Bonar
Affiliation:a Department of Electrical Engineering and Electronics, University of Liverpool, Brownlow Hill, Liverpool, L69 3GJ, UK;b Department of Electronics and Computer Science, University of Southampton, Highfield, Southampton SO17 1BJ, UK
Abstract:A simple technique leading to the measurement of minority carrier lifetimes of UHV compatible LPCVD Si and SiGe by Ct depth profiling of Metal:Oxide:Si:SiGe:Si structures is reported. A high quality gate oxide is realised by low temperature (<100°C) plasma anodisation thereby reducing any oxidation effects on the underlying epitaxial layer quality. Capacitance response times were observed for an impurity concentration of not, vert, similar2.5×1017 cm−3, giving rise to generation lifetimes of the Si and Si0.9Ge0.1 of >0.55 and 2.6 μs respectively, reflective of very high quality epitaxial semiconductor material.
Keywords:Chemical vapour deposition  Plasma anodisation  Silicon  Silicon germanium  Generation lifetime
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