测量散射参数的交互换位双信号方法及其应用

叙述了外内向功率波复数比的测量方法,给出了散射参数测量的交互换位双信号测量线方法。用此方法测量了双栅ＧａＡｓＭＥＳＦＥＴ适用散射参数,并用它设计Ｓ波段混合集成双栅ＧａＡｓＭＥＳＦＥＴ可控增益放大器。测试结果与设计吻合。     

S-Band 1mm SiC MESFET with 2W Output on Semi-Insulated SiC Substrate

介绍了用热壁反应炉在50mm SiC半绝缘衬底上制备的SiC MESFET外延材料.其沟道层厚度约为0.35μm,掺杂浓度约为1.7×1017cm-3.沟道和衬底之间的缓冲层为非有意掺杂的弱n型.欧姆接触用的帽层掺杂浓度约1019cm-3.器件制备采用了ICP刻蚀等技术.微波测试结果表明,1mm栅宽功率器件封装后在2GHz下输出功率达到了2W.     

An improved analytical model of 4H-SiC MESFET incorporating bulk and interface trapping effects

An improved analytical model for the current-voltage (I-V) characteristics of the 4H-SiC metal semiconductor field effect transistor (MESFET) on a high purity semi-insulating (HPSI) substrate with trapping and thermal effects is presented. The 4H-SiC MESFET structure includes a stack of HPSI substrates and a uniformly doped channel layer. The trapping effects include both the effect of multiple deep-level traps in the substrate and surface traps between the gate to source/drain. The self-heating effects are also incorporated to obtain the accurate and realistic nature of the analytical model. The importance of the proposed model is emphasised through the inclusion of the recent and exact nature of the traps in the 4H-SiC HPSI substrate responsible for substrate compensation. The analytical model is used to exhibit DC I-V characteristics of the device with and without trapping and thermal effects. From the results, the current degradation is observed due to the surface and substrate trapping effects and the negative conductance introduced by the self-heating effect at a high drain voltage. The calculated results are compared with reported experimental and two-dimensional simulations (Silvaco^®-TCAD). The proposed model also illustrates the effectiveness of the gate-source distance scaling effect compared to the gate-drain scaling effect in optimizing 4H-SiC MESFET performance. Results demonstrate that the proposed I-V model of 4H-SiC MESFET is suitable for realizing SiC based monolithic circuits (MMICs) on HPSI substrates.     

SiC MESFET反向截止漏电流的研究

给出了一种减小SiC MESFET栅漏反向截止漏电流的工艺方法,通过采用LPCVD淀积厚SiO2和高温氧化工艺,使器件的性能得到一定的提升.从实验数据看出,器件在S波段工作时,器件的反向截止漏电流大幅度下降,且分散性得到改善,其功率附加效率和功率增益也分别提高了10%和1.5 dB.该方法充分发挥了SiC材料能形成自身氧化层的优势,结合Si工艺的特点,减小了氧化层的缺陷,并在一定程度上减小了器件的寄生电容.     

The growth of buffered GaAs mesfet structures by LPE

Layers of LPE GaAs have been grown with background carrier levels in the low 10¹⁴ cm⁻³ range by systematic bakeouts of the Ga melts together with between-run loading in a dry N₂ environment. High resistivity layers in the range 10₃-10⁴Ω cm have been grown by making use of the compensation of free carriers by the out diffusion of Cr from the substrate. Intentional Cr-doping from the melt resulted in layers with poor surface morphologies. Buffered MESFET structures have been grown which show near ideal carrier concentration profiles and which do not exhibit interfacial space charge effects.     

Drain temperature determination in dual-gate GaAs MESFETs

This paper describes the temperature dependence of the drain current and the drain temperature in dual-gate GaAs MESFETs. The model presented, effectively couples together the effects of the operating temperature and the polarization voltages on the electron temperature and the drain current. This offers improved accuracy over existing models by considering a nonlinear field-dependent diffusivity-to-mobility ratio. Two-dimensional numerical simulation is used to describe significant physics in the characteristics for 0.5 μm gates GaAs DGMESFET.     

数字射频存储器用GaAs超高速3bit相位ADC的设计与实现

详细讨论、分析了用于3bit相位体制数字射频存储器（DRFM）系统的3bit相位体制ADC的设计、实现及测试．利用南京电子器件研究所标准GaAs Φ76mm全离子注入工艺，采用全耗尽非自对准MESFET器件加工实现了3bit超高速相位体制ADC．测试结果表明，该电路可在2GHz时钟速率下完成采样、量化，达到1.2Gbps的输出码流速率，其瞬时带宽可达150MHz，具备±0.22LSB的相位精度．     

GaN-based optoelectronic devices on sapphire and Si substrates

A recessed gate AlGaN/GaN high-electron mobility transistor (HEMT) on sapphire (0 0 0 1), a GaN metal-semiconductor field-effect transistor (MESFET) and an InGaN multiple-quantum well green light-emitting diode (LED) on Si (1 1 1) substrates have been grown by metalorganic chemical vapor deposition. The AlGaN/GaN intermediate layers have been used for the growth of GaN MESFET and LED on Si substrates. A two-dimensional electron gas mobility as high as 9260 cm²/V s with a sheet carrier density of 4.8×10¹² cm⁻² was measured at 4.6 K for the AlGaN/GaN heterostructure on the sapphire substrate. The recessed gate device on sapphire showed a maximum extrinsic transconductance of 146 mS/mm and a drain–source current of 900 mA/mm for the AlGaN/GaN HEMT with a gate length of 2.1 μm at 25°C. The GaN MESFET on Si showed a maximum extrinsic transconductance of 25 mS/mm and a drain–source current of 169 mA/mm with a complete pinch-off for the 2.5-μm-gate length. The LED on Si exhibited an operating voltage of 18 V, a series resistance of 300 Ω, an optical output power of 10 μW and a peak emission wavelength of 505 nm with a full-width at half-maximum of 33 nm at 20 mA drive current.     

Influence of Si<Subscript>3</Subscript>N<Subscript>4</Subscript> passivation on surface trapping in SiC metal-semiconductor field-effect transistors

The SiC metal-semiconductor field-effect transistors (MESFETs) have been reported to have current instability and strong dispersion caused by trapping phenomena at the surface and in the substrate, which degrade direct-current (DC) and radio-frequency (RF) performance. This paper illustrates the change in electrical characteristics of SiC MESFETs after Si₃N₄ passivation. Because of a reduction of surface trapping effects, Si₃N₄ passivation can diminish current collapse under pulsed DC conditions, increasing the RF power performance. The reduction of surface trapping effects is verified by the change in the ratio of the drain current to the gate current under pinch-off conditions.