A high-throughput chaotic advection microreactor for preparation of uniform and aggregated barium sulfate nanoparticles

A high-throughput (105.5 g/h) passive four-stage asymmetric oscillating feedback microreactor using chaotic mixing mechanism was developed to prepare aggregated Barium sulfate (BaSO₄) particles of high primary nanoparticle size uniformity. Three-dimensional unsteady simulations showed that chaotic mixing could be induced by three unique secondary flows (i.e., vortex, recirculation, and oscillation), and the fluid oscillation mechanism was examined in detail. Simulations and Villermaux–Dushman experiments indicate that almost complete mixing down to molecular level can be achieved and the prepared BaSO₄ nanoparticles were with narrow primary particle size distribution (PSD) having geometric standard deviation, σ_g, less than 1.43 when the total volumetric flow rate Q_total was larger than 10 ml/min. By selecting Q_total and reactant concentrations, average primary particle size can be controlled from 23 to 109 nm as determined by microscopy. An average size of 26 nm with narrow primary PSD (σ_g = 1.22) could be achieved at Q_total of 160 ml/min.     

Priority-MECE: A Mobile Edge Cloud Ecosystem Based on Priority Tasks Offloading

Mobile Networks and Applications - With the rapid development of Internet of things, the traditional city model is no longer applicable. Therefore, the emerging concept of smart city meets the...     

依托"大数据行业应用"虚拟教研室培养跨学科人才

在实施国家大数据战略和创新型国家建设的引导下,培养跨学科思维与能力是创新型人才培养的核心要求.大数据是一个典型的学科交叉的技术,资源分散是当前高校大数据人才培养存在的主要问题.该文以长沙理工大学"大数据行业应用"虚拟教研室建设为例,打造"大数据"特色跨学科跨专业教学组织,从课程体系、实践环节、师资队伍、质量监督等方面提出建设措施,为培养跨学科创新型复合型人才提供参考.     

不同场景下铜排通流能力研究

随着电子技术的发展,设备的功率越来越高,铜排作为大通流部件在电气设备和电力系统中有着广泛的应用.铜排在工作时通大电流,设计时必然要考虑其带来的温升问题.温升过大时会加速部件老化甚至导致故障造成经济损失.该文通过对在空气自然对流、强制风冷、封闭或半封闭,截面积相同但厚度不同4种场景下铜排通流能力的测试和分析,得出铜排通流与场景及和尺寸的关系,强制风冷环境温升最低,利于通流,同时薄的铜排单位长度有着更大的散热表面积.该文的结论为相关技术人员提供一些铜排设计和技术上的参考.     

Reaction Mechanism of Lithium-Ion Battery Fire Extinguishing Agent-Perfluorinated Hexanone Oxidizes Metal-Al

Fire Technology - The use of perfluorinated hexanone as a fire extinguishing agent for lithium-ion batteries (LIBs) has been steadily increasing in China in recent years. It successfully handles...     

Form selection of concomitant polymorphs: A case study informed by crystallization kinetics modeling

Molecular mechanisms and process kinetics of crystallizing concomitant polymorphs remain poorly understood. Solvent-mediated phase transformation and concomitant crystallization are difficult to be distinguished in practice, as multiple forms can be detected at the same time. Herein, we developed a population balance model to simulate a concomitant crystallization process of two polymorphs of tolfenamic acid. Our kinetic modeling aims to understand concomitant crystallization and help guide form selection of such a molecular system. Crystallization kinetics of ethanolic solutions were uncovered from induction time measurements, as well as seeded and unseeded crystallization experiments. Experimental and simulation results demonstrate that the stable form I crystallizes concomitantly with the metastable form II. The faster growing form II results in an intermediate decline in the composition of form I in crystallized samples, a characteristic feature of the concomitantly crystallized system. A four-quadrant scheme of attainable polymorph outcome was simulated under various crystallization conditions.     

A new strategy to reduce edge chipping using stress wave impedance matching

To restrain edge chipping and elucidate its mechanism during machining, the initiation of edge chipping was investigated in this study from the propagation properties of stress waves in the fractured media. Three technological principles of the support for chipping suppression were proposed to reduce the intensity of reflected extension waves, namely, the wave impedance matching, the smaller residual gap and the higher viscosity of the gap filler between the workpiece and the support. As demonstrated from the experimental results, using brass support with non-solid epoxy gap filler can significantly restrain the edge chipping of pressureless sintered silicon carbide during grinding.