Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations

This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations.The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution.The global placement is based on a top-down recursive bisection framework.The partitioning alg...