首页 | 官方网站   微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   1728篇
  免费   72篇
  国内免费   7篇
工业技术   1807篇
  2024年   6篇
  2023年   45篇
  2022年   57篇
  2021年   82篇
  2020年   77篇
  2019年   68篇
  2018年   94篇
  2017年   86篇
  2016年   78篇
  2015年   48篇
  2014年   83篇
  2013年   157篇
  2012年   86篇
  2011年   95篇
  2010年   87篇
  2009年   86篇
  2008年   66篇
  2007年   64篇
  2006年   48篇
  2005年   35篇
  2004年   21篇
  2003年   24篇
  2002年   24篇
  2001年   24篇
  2000年   18篇
  1999年   21篇
  1998年   17篇
  1997年   27篇
  1996年   27篇
  1995年   19篇
  1994年   17篇
  1993年   25篇
  1992年   14篇
  1991年   14篇
  1990年   8篇
  1989年   5篇
  1988年   4篇
  1987年   5篇
  1986年   4篇
  1985年   8篇
  1984年   6篇
  1983年   4篇
  1981年   2篇
  1980年   3篇
  1979年   5篇
  1978年   3篇
  1976年   4篇
  1974年   3篇
  1969年   1篇
  1967年   1篇
排序方式: 共有1807条查询结果,搜索用时 15 毫秒
1.
2.
Lund  Brady D.  Maurya  Sanjay Kumar 《Scientometrics》2020,125(3):2491-2504
Scientometrics - This study investigates a potential relationship between highly-cited scholarly papers and the number of citations received by other papers with which they share a journal issue....  相似文献   
3.
Metallurgical and Materials Transactions B - The effect of the surface tension–viscosity dissipation driving liquid Ti flow into a B4C packed bed was analyzed at 1941 K and 2573 K. The model...  相似文献   
4.
The need for electronics to operate at temperatures of 200°C and above continues to grow. These applications include avionics, aerospace, automotive, downhole drilling, mining, and many others. To satisfy this demand, a significant amount of research and development has been conducted. Despite the efforts, the number of new electronic components designed specifically for high-temperature operation is still relatively limited. In Low Temperature Co-fired Ceramic (LTCC) packages, LTCC materials are generally used as the host media for a number of pre-fabricated semiconductor components. As a result, reliability of the entire LTCC package largely depends on the performance of the least robust component. Ferro A6M-E and Ferro L8 are the two well-established and recognized LTCC dielectrics widely used for mid and high frequency LTCC applications, including several high reliability aerospace and defense applications that require demanding Mil-Spec qualifications. This study is our first attempt to characterize and understand basic high-temperature dielectric properties of these two commercial LTCC materials. The secondary objective is to initiate a dialogue in attempt to establish reliability requirements for LTCC packages dedicated for high-temperature operation.  相似文献   
5.
Proficiency on underlying mechanism of rubber-metal adhesion has been increased significantly in the last few decades. Researchers have investigated the effect of various ingredients, such as hexamethoxymethyl melamine, resorcinol, cobalt stearate, and silica, on rubber-metal interface. The role of each ingredient on rubber-metal interfacial adhesion is still a subject of scrutiny. In this article, a typical belt skim compound of truck radial tire is selected and the effect of each adhesive ingredient on adhesion strength is explored. Out of these ingredients, the effect of cobalt stearate is found noteworthy. It has improved adhesion strength by 12% (without aging) and by 11% (humid-aged), respectively, over control compound. For detailed understanding of the effect of cobalt stearate on adhesion, scanning electron microscopy and energy dispersive spectroscopy are utilized to ascertain the rubber coverage and distribution of elements. X-ray photoelectron spectroscopy results helped us to understand the impact of CuXS layer depth on rubber-metal adhesion. The depth profile of the CuXS layer was found to be one of the dominant factors of rubber-metal adhesion retention. Thus, this study has made an attempt to find the impact of different adhesive ingredients on the formation of CuXS layer depth at rubber-metal interface and establish a correlation with adhesion strength simultaneously.  相似文献   
6.
Corner detection is a low-level feature detection operator that is of great use in image processing applications, for example, optical flow and structure from motion by image correspondence. The detection of corners is a computationally intensive operation. Past implementations of corner detection techniques have been restricted to software. In this paper we propose an efficient very large-scale integration (VLSI) architecture for detection of corners in images. The corner detection technique is based on the half-edge concept and the first directional derivative of Gaussian. Apart from the location of the corner points, the algorithm also computes the corner orientation and the corner angle and outputs the edge map of the image. The symmetrical properties of the masks are utilized to reduce the number of convolutions effectively, from eight to two. Therefore, the number of multiplications required per pixel is reduced from 1800 to 392. Thus, the proposed architecture yields a speed-up factor of 4.6 over conventional convolution architectures. The architecture uses the principles of pipelining and parallelism and can be implemented in VLSI.  相似文献   
7.
8.
Yung  Sanjay   《Computer Networks》2007,51(18):4919-4937
Motivated by the scale and complexity of simulating large-scale networks, recent research has focused on hybrid fluid/packet simulators, where fluid models are combined with packet models in order to reduce simulation complexity as well as to track dynamics of end-sources accurately. However, these simulators still need to track the queuing dynamics of network routers, leading to considerable simulation complexity in a large-scale network model. In this paper, we propose a new hybrid simulator – FluNet – where queueing dynamics are not tracked, but instead, an equivalent rate-based model is used. The FluNet simulator is predicated on a fast-queueing regime at bottleneck routers, where the queue length fluctuates on a faster time-scale than end systems. This allows us to simulate large-scale systems, where the simulation “time step-size” is governed only by the time-scale of the end-systems, and not by that of the intermediate routers; whereas a queue-tracking based fluid simulator would require decreasingly smaller step-sizes as the system scale size increases. We validate our model using a ns-2 based implementation. Our results indicate a good match between packet systems and the associated FluNet system.  相似文献   
9.
The influence of processing conditions on the morphology of calcium hexaluminate (CA6) grains in Al2O3: 30 vol% CaO·6Al2O3 (CA6) ceramic composites was investigated. Specimens were prepared by in-situ reaction sintering using precursor powders of alumina, and either calcium carbonate or calcium oxide. In some samples, 1 vol% anorthite glass was added as a sintering aid. X-ray diffraction was used to study the phase development in the as-calcined and sintered states. The resultant microstructures were characterized using both scanning electron microscopy (SEM), and imaging secondary ion mass spectrometry (SIMS). It was found that the CA6 grains developed a platelike morphology when CaCO3 was used as the starting calcium-rich powder. In contrast, samples prepared using CaO resulted in equiaxed CA6 grains. This result was observed to be independent of the anorthite glass addition. The findings are rationalized in terms of distinct CA6 reaction mechanisms, resulting from differences in the reactivity of the powders during the early stages of calcining.Cement Nomenclature C CaO - A Al2O3  相似文献   
10.
When dopants are indiffused from a heavily implanted polycrystalline silicon film deposited on a silicon substrate, high thermal budget annealing can cause the interfacial “native” oxide at the polycrystalline silicon-single crystal silicon interface to break up into oxide clusters, causing epitaxial realignment of the polycrystalline silicon layer with respect to the silicon substrate. Anomalous transient enhanced diffusion occurs during epitaxial realignment and this has adverse effects on the leakage characteristics of the shallow junctions formed in the silicon substrate using this technique. The degradation in the leakage current is mainly due to increased generation-recombination in the depletion region because of defect injection from the interface.  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号