Diffusion in metallic glasses

Rutherfordα-particles backscattering technique was employed for measurements of diffusion rates in metallic glasses. Effects of relaxation, crystallization and plastic deformation on diffusion rates were also investigated. It has been observed that the diffusion rates of a metallic solute are of the same orders of magnitude in both metal-metal and metal-metalloid glasses. A higher diffusivity is likely if there is a large difference between melting points of the solute and matrix. Relaxation has no effect on diffusion, however, diffusivity increases on crystallization. An increase in diffusivity is also observed on plastic deformation of metallic glass.     

用超声处理在石墨表面形成梯度孔洞

研究了超声处理对石墨表面状况的影响。超声处理初期，增加超声处理时间使石墨显气孔率增加，表面孔洞数量增多，尺寸变大；超声处理5min后，超声处理时间增加，显气孔率和孔洞状态基本不变。用超声处理能在石墨表面内层附近形成比较理想的梯度分布孔洞。     

Filler-induced failure mechanism in plastic-encapsulated microelectronic packages

Based on empirical data, the present work provides a model to prevent filler-induced reliability degradation in plastic-encapsulated LOC (lead-on-chip) packages. According to the model, the maximum size of the silica fillers included in the plastic package body should be smaller than one half of the inter-distance between the device and its overlying lead-frame. In particular, it is shown in the model that the spherical silica particles, which are sometimes trapped in the space between the top surface of the device and the bottom of the lead-frame during the encapsulating process, can induce huge compressive stress on a specific site of the integrated circuit pattern due to the thermal shrinkage of the plastic package body. Further, the present model suggests that tiny fillers squeezed beneath a large trapping filler might directly attack the brittle layer of the device pattern because the compressive force from the large filler particle can develop into huge compressive stress due to the reduced load-carrying area.     

Microstructural changes accompanying repair welding in 5xxx aluminium alloys and their effect on the mechanical properties

At the shipyards, the aluminium alloy 5083 is welded with a multi-pass sequence using the metal inert gas technique. If, while checking the weld integrity either after welding or during service, defects are detected in the vicinity of the weldment, repairs are usually employed to extend the service life.

The repair method involves removal of the upper passes, depending on the thickness and re-welding under the same conditions.

Purpose of this paper is to examine the microstructural changes accompanying repair welding, define their effect on properties of primary importance and set, if possible, an upper limit as far as the number of repairs is concerned.     

三体磨料塑变磨损中磨粒运动方式的研究

对三体磨料磨损中磨粒的运动方式做了进一步的理论分析，基于三体磨料磨损中塑变疲劳磨损起主要作用，为突出塑变疲劳磨损的作用，选择圆形磨料进行研究，分析了圆整磨料在三体磨料磨损界面中滚动、滑动的判定，提出了相对滑动界面的判定。     

纳米镓/聚甲基丙烯酸甲酯复合材料的原位超声合成与表征

超声作用于低熔点金属镓,使其超细化为纳米级的镓粒子,并采用无引发剂的乳液聚合方法制备出GA/聚甲基丙烯酸甲酯(PMMA)纳米复合粒子,并分析了其微观结构。结果表明纳米镓的形态和结构因有无表面改性剂而不同;乳液聚合得到的纳米镓复合粒子是核壳结构型,粒子大小为50~80 NM,内核金属镓粒径为30~50 NM,与聚合物存在一定的化学作用。     

Microstructural change of ultrafine-grained aluminum during high-speed plastic deformation

Effect of strain rate on microstructural change in deformation of the ultrafine grained (UFG) aluminum produced by severe plastic deformation (SPD) was studied. Commercial purity 1100 aluminum sheets were highly strained up to an equivalent strain of 4.8 by the Accumulative Roll-Bonding (ARB) process at ambient temperature. The ARB-processed sheets were found to be filled with pancake-shaped ultrafine grains surrounded by high-angle grain boundaries. The ultrafine grains had a mean grain thickness of 200 nm and a mean grain length of 1100 nm. The ultrafine-grained aluminum sheets were deformed at various strain rates ranging from 2 to 6.0×10⁴ s⁻¹ by conventional rolling, ultra-high-speed rolling, and impact compression. High-speed plastic deformation generates a large amount of heat, inducing coarsening of the ultrafine grains during and after deformation. On the other hand, it was also suggested that high-speed plastic deformation is effective for grain-subdivision, in other words, ultra-grain refinement, if the effect of heat generation is extracted.     

半导体元件清洗技术浅谈

随着社会的进步和科学技术的迅猛发展,对洗净技术的要求也越来越高。清洗方式多种多样,但最主要的是突出在喷射清洗和超声波清洗两大方面,应用于全国各行各业,并且也得到了明显进步。     

焊补法带压堵漏技术与不停车带压堵漏技术的应用

介绍了传统的焊补法堵漏及目前常用的不停车带压堵漏技术的基本原理、操作步骤以及密封剂类型，并对两种方法进行了比较。     

深井塑性水泥浆体系研究

在深井的固井过程中经帮会面临大段盐膏层固井问题。深井本身具有井深、温度高、水泥环薄的特点，再加上地层盐水的侵入而使水泥浆性能发生变化，加大了固井难度；而且一般水泥石本身具有硬和脆的性质，易受后续施工、射孔或地下复杂作用力的影响而发生脆裂，或与套管、井壁剥离。采用以改性纤维为主要材料的早强增塑剂QA研究出了深井抗盐塑性水泥浆体系。对塑性水泥浆的惜规性能和抗盐、抗温能力及密度可调性进行了试验分析研究。试验结果表明，加入QA的水泥浆的惜规性能指标与不加QA的水泥浆接近，但水泥石抗裂程度明显提高，抗压强度增加25％～30％，7d的抗冲击韧性提高16．6％～22．3％，抗折强度提高18％～21％，弹性模量降低约17％；而且水泥浆抗盐性能优良，使用温度和密度范围宽，与各类外加剂配伍性好，流变性好，直角稠化，强度发展快，粘接强度高，有利于复杂地层的固井施工；工艺简单，操作方便，适宜现场推广运用。