湿法化学刻蚀技术处理抛光熔石英元件

为了提高熔石英元件的抗激光损伤能力,采用基于氢氟酸刻蚀的湿法化学技术去除元件内的激光损伤诱因。利用不同的氢氟酸溶液处理经氧化铈抛光的熔石英元件,并对元件的刻蚀速率、表面洁净度、粗糙度、透过率和激光损伤性能进行评价。研究结果表明,与传统的静态刻蚀相比,在质量分数为6%的氢氟酸刻蚀溶液中引入能量密度约为0.6 W/cm^2的兆声能量对元件的溶解速率和激光损伤性能没有明显的提升作用;化学刻蚀产生的沉积物对元件表面粗糙度和透过率均有不利影响,且沉积物比例与所用的刻蚀液成分和浓度密切相关;经质量分数6%或12%的纯氢氟酸溶液刻蚀(5±1)μm深度后,熔石英元件的激光损伤阈值相比于未刻蚀元件提升了约1.9倍;熔石英元件的激光损伤性能与表面粗糙度和透过率之间不是简单的线性关系,但激光损伤阈值较理想的元件(>20 J/cm^2@3ns)往往具有较光滑的表面,即表面粗糙度<2 nm,由此可以确定有利于熔石英元件激光损伤性能的刻蚀条件,并获得元件表面粗糙度的控制指标。     

高抗激光损伤阈值光栅后处理抛光技术研究

脉冲压缩光栅是实现高能量激光的核心光学元器件,其制造过程中产生的表面污染物和微结构缺陷成为限制高功率激光系统发展的技术瓶颈,为了提升光栅的激光诱导损伤阈值,提出利用磁性复合流体进行脉冲压缩光栅(PCG)后处理抛光研究。对抛光前后光栅样品的微观结构,表面形貌、表面粗糙度、衍射效率和激光诱导损伤阈值等参数进行测量,进行抛光前后光栅表面质量和光栅性能的评估。研究发现,磁性复合流体抛光能够在不破坏实际光栅结构的前提下抑制加工过程产生的毛刺,微结构缺陷等;经3 min抛光后,光栅顶部表面粗糙度从21.36 nm下降到3.73 nm;激光诱导损伤阈值从2.8 J/cm²提高到3.8 J/cm²,抗激光损伤性能提升35.7%,且不影响衍射效率。实验结果表明：磁性复合流体抛光是一种可以提高光栅元件表面质量,提升光栅元件光学性能的有效方法。     

光学元件改性处理对激光损伤阈值的影响

针对355nm激光作用于熔石英光学元件后其损伤阈值容易变差的问题,提出使用1.7%纯HF溶液和0.4%HF与1.2%NH4F混合的BOE溶液对样品进行处理来提高它们的激光诱导损伤阈值(LIDT)。在相同的条件下将熔石英光学元件浸没到上述两种不同的刻蚀溶液中进行处理,通过测量刻蚀过程中元件重量变化来计算刻蚀速率,利用Zygo轮廓仪测试元件表面粗糙度,然后对355nm激光照射下熔石英元件的损伤阈值情况进行研究。损伤测试表明,LIDT与元件的材料去除深度有关系,用两种刻蚀液刻蚀去除一定深度后,LIDT均有增加,但是进一步去除会显著地降低元件的LIDT。在处理过程中,这两种刻蚀液的去除速率都很稳定,分别为85.9nm/min和58.6nm/min左右。另外,元件表面的粗糙度会随着刻蚀时间的增加而变大。在刻蚀过程中还通过纳米技术测量了熔石英元件表面的硬度及杨氏系数,不过没有证据表明其与激光诱导损伤有明确的关系。     

飞秒激光正交线扫描诱导表面微纳结构

通过控制激光偏振与扫描方向,利用飞秒脉冲激光正交线扫描的微加工方式,在硅和不锈钢表面诱导出了规则分布的复合表面微纳结构并分析了激光能量密度对微纳表面结构形成的影响。实验显示:当激光的能量密度接近材料烧蚀阈值时,在硅表面诱导出了周期条纹嵌套纳米孔的双层复合二维结构,在不锈钢表面则诱导出了依赖于激光偏振方向的纳米点阵列分布,分析认为纳米点阵列是由周期条纹结构边缘发生断裂而生成的。另外,当激光的能量密度大于材料烧蚀阈值时,在硅和不锈钢表面会烧蚀出规则分布的微米级孔洞结构。实验结果表明:第一次扫描诱导出的表面微纳结构增加了对入射激光的吸收,促进入射激光与表面等离子体波的耦合,加强了后扫描的烧蚀效果,使得后扫描诱导出的微纳结构占主导。文中提出的正交线扫描的加工方式为微纳表面结构的制备提供了新的思路。     

准分子激光脉冲直写刻蚀速率与能量密度的关系

为了探索低成本、大深宽比加工方法,建立了实用的准分子激光微加工系统.以玻璃为实验靶材,用精密微动平台准确调节靶材位置,利用波长248nm的KrF准分子激光器,研究了准分子激光直写刻蚀过程中平均刻蚀速率与激光脉冲能量密度之间的关系.加工出的沟槽剖面形状均呈现锥型,单脉冲烧蚀速率随脉冲数的增加而减小,激光脉冲对材料的刻蚀具有能量阈值,加工槽的深度具有上限值.采用平行激光束或对加工过程进行动态控制还可实现矩形深槽或圆柱深孔的加工.     

用于强激光系统的光栅偏振器

针对强激光系统中常用的1 053nm激光器进行了偏振光栅结构的优化设计。利用严格耦合波理论分析了光栅偏振器的衍射特性及消光比,分析显示偏振光栅周期为600nm,占宽比为0.535~0.55,槽形深度为1 395nm~1 420nm时,可保证其在1 053nm波长下,透射率高于95%,消光比大于1 500。基于分析结果,利用全息光刻技术制作了高质量光刻胶光栅掩模,并采用倾斜转动的离子束刻蚀结合反应离子束刻蚀的方法对该光刻胶光栅掩模进行图形转移,制作了底部占宽比为0.54,槽形深度为1 400nm的光栅偏振器。实验测量显示其透射率为92.9%,消光比达到160。与其他制作光栅偏振器方法相比,采用单光刻胶光栅掩模结合倾斜转动的离子束刻蚀工艺,不但简化了制作工艺,而且具有激光损伤阈值高、成本低的优点。由于该技术可制作大面积光栅,特别利于在强激光系统中应用。     

工作波长为13.9nm的Laminar分合束光栅研制

目的：基于衍射光栅分合束元件的软X射线Mach－Zehnder干涉系统在惯性约束聚变,X射线激光等领域都有重要的应用前景。针对该干涉系统的特点设计、制作了工作波长为13.9nm的矩形分合束光栅。方法：利用全息曝光－离子束刻蚀工艺制作了特定参数的矩形光栅,利用长行程面型仪（LTP）对其线密度进行了测量,利用原子力显微镜测量其槽深与占宽比,利用国家同步辐射实验室（NSRL）U27实验站测量其衍射效率。结果：该矩形光栅的参数为线密度1000l/mm,槽深13±0.2nm,占宽比0.4±10%,Au膜厚度为40±0.5nm;在工作波长为13.9nm,81.2°入射时,其0级与-1级衍射光衍射效率乘积的最大值为8.6％,同时0级与-1级衍射效率亦接近,约为27％和30％。结论：测量结果充分证明矩形光栅作为13.9nm激光的分合束元件是能够获得高分合束效率(>7%),且矩形分合束元件易于制作。     

Ion beam etching of large aperture diffractive optical elements

总结了大尺寸衍射光学元件离子束刻蚀技术的研究进展.针对自行研制的KZ-400离子束刻蚀装置,提出了组合石墨束阑结构和多位置分步刻蚀策略来提高离子束刻蚀深度的均匀性,目前在450 mm尺寸内的刻蚀深度均匀性最高可达±1％.建立了针对多层介质膜光栅的衍射强度一维空间分布在线检测系统以及用于透射衍射光学元件离子束刻蚀深度的等厚干涉在线检测系统,实现了对大尺寸衍射光学元件离子束刻蚀终点的定量、科学控制,提高了元件离子束刻蚀工艺的成功率.利用上述技术,成功研制出一系列尺寸的多层介质膜光栅、光束采样光栅、色分离光栅以及同步辐射光栅等多种衍射光学元件.     

真空紫外硅闪耀光栅的制作

利用单晶硅在KOH溶液中的各向异性刻蚀特性,在相对Si(111)面切偏角为5°的单晶片上制作了1200gr/mm的真空紫外闪耀光栅。结合全息干涉曝光以及光刻胶灰化技术,在单晶硅表面得到了小占宽比的高质量光刻胶掩模,用湿法刻蚀将光栅掩模图形转移到单晶硅表面的天然氧化层上,并将其作为硅各向异性湿法刻蚀的掩模,成功获得了接近于理想锯齿槽形的闪耀光栅。用原子力显微镜分析光栅闪耀面,结果表明其表面均方根粗糙度约为0.2nm。在真空紫外波段对其进行衍射效率测量,发现光栅在135nm波长处显示出良好的闪耀特性。此方法可以应用于真空紫外和软X射线波段的光栅制作,在获得较高的槽形效率的同时,可以大大减少其制作难度及成本。     

大尺寸衍射光学元件的扫描离子束刻蚀

总结了大尺寸衍射光学元件离子束刻蚀技术的研究进展。针对自行研制的KZ-400离子束刻蚀装置,提出了组合石墨束阑结构和多位置分步刻蚀策略来提高离子束刻蚀深度的均匀性,目前在450mm尺寸内的刻蚀深度均匀性最高可达±1%。建立了针对多层介质膜光栅的衍射强度一维空间分布在线检测系统以及用于透射衍射光学元件离子束刻蚀深度的等厚干涉在线检测系统,实现了对大尺寸衍射光学元件离子束刻蚀终点的定量、科学控制,提高了元件离子束刻蚀工艺的成功率。利用上述技术,成功研制出一系列尺寸的多层介质膜光栅、光束采样光栅、色分离光栅以及同步辐射光栅等多种衍射光学元件。     

〈111〉晶向标定方法及其在湿法刻蚀硅光栅中的应用

在利用单晶硅的各向异性腐蚀制作光栅的过程中,掩模与硅晶向的精密对准是获取大尺寸光栅结构的前提条件,高对准精度将显著降低光栅槽型侧壁粗糙度。设计并制作了一种扇形图案,通过以该图案为掩模的预刻蚀,可快速准确发现硅基底内晶格取向。通过此方法进行晶向标定,并利用紫外光刻与湿法刻蚀,成功研制了尺寸为15mm×15mm、高度为48.3μm、周期为5μm、高宽比为20的矩形光栅结构,线条侧壁粗糙度RMS值为0.404nm;利用全息光刻与湿法刻蚀成功研制了大高宽比深槽矩形光栅及三角形槽光栅。矩形槽光栅尺寸为50mm×60mm,高度为4.8μm,周期为333nm,高宽比为100,侧壁粗糙度RMS值为0.267nm。三角形槽光栅周期为2.5μm,侧壁粗糙度RMS值为0.406nm。     

Homogenous and ultra-shallow lithium niobate etching by focused ion beam

Focused ion beam (FIB) milling has been used for fast prototyping of lithium niobate (LiNbO₃, LN) devices with feature size from sub-to hundreds of micrometers. However, a promising and challenging depth range of tens-of-nanometers or below is rarely attended. Moreover, the surface roughness, related closely with device performances, is particularly non-negligible for such an ultra-shallow etching. Here, the surface roughness evolution was studied on ultra-shallow FIB etched LN structures. It was found that the inhomogeneous etching of the metallic film, coated on LN surface to avoid charge accumulation, had a detrimental effect on the LN surface roughness control. By thinning the gold thickness to 7 nm, sub-nanometer surface roughness was reported for etching depth of several nanometers. This work paves the way towards a homogenous and ultra-shallow FIB milling of LN nano-structures.     

Comparative study of conventional and micro WEDM based on machining of meso/micro Sized Spur Gear

This paper discusses the comparison of micro machining process using conventional and micro wire electrical discharge machining (WEDM) for fabrication of miniaturized components. Seventeen toothed miniaturized spur gear of 3.5 and 1.2 mm outside diameter were fabricated by conventional and micro WEDM respectively. The process parameters for both conventional and micro WEDM were optimized by preliminary experiments and analysis. The gears were investigated for the quality of surface finish and dimensional accuracy which were used as the criteria for the process evaluation. An average surface roughness (R_a) of 50 nm and dimensional accuracy of 0.1–1 μm were achieved in micro WEDM. Whenever applied conventional WEDM for meso/micro fabrication, a R_a surface roughness of 1.8 μm and dimensional accuracy of 2–3 μm were achieved. However, this level of surface roughness and dimensional accuracy are acceptable in many applications of micro engineering. A window of conventional WEDM consisting of low energy discharge parameters is identified for micromachining.     

Micro/meso ultra precision grinding of fibre optic connectors

The present paper reports on the development of a micro/meso grinding technology using inclined resin bond diamond cup wheels for machining spherical end faces of fibre optic connectors. The ground spherical end faces obtained using the wheel of grit size of 4 μm have an average roughness (R_a) value of 7 nm in the fibre area and a profile error of below 0.4 μm. The corresponding average return and insertion losses are 55 and 0.1 dB, respectively. The results are competitive to those obtained from the polishing process that is currently used in industries. Furthermore, this study has revealed the relationships between the ground surface quality characterized by roughness and profile accuracy and the optic performance evaluated by insertion and return losses.     

HfO2薄膜的离子束刻蚀特性研究

实验研究了HfO₂薄膜特性以及掩模材料AZ1350以Ar为工作气体下的离子束的刻蚀特性.给出了离子能量、离子束流密度和离子束入射角等因素与刻蚀速率的关系曲线,用最小二乘法拟合了上述因素与刻蚀斜率的函数关系方程;分析了光刻胶和基片在刻蚀过程中随刻蚀深度的变化对图形转移精度的影响,用AFM的Tapping模式测量了刻蚀前后HfO₂薄膜表面质量的变化.结果表明刻蚀速率与离子能量的平方根,及速流密度成正比,并随离子束入射角变化而变化;与刻蚀前相比,刻蚀工艺降低了因HfO₂薄膜刻蚀深度的增加引起图形转移精度下降,因此提高刻蚀选择比是获得高分辨率图形的前提.研究结果已应用到了在HfO₂/SiO₂多层膜衍射光栅的制作中.     

Laser illuminator based on diffraction elements for training systems

The use of a diffractive optical element (DOE) in the optical scheme of a laser illuminator of a shooting simulator exposing the target is studied. It is proposed to use the DOE in the optical projection system to form a laser beam with a special intensity profile. The use of the DOE with binary amplitude transmission allows simplification of the manufacture of this block with simultaneous improvement of its performance. The DOE is used as a diffraction attenuator of laser radiation with a period of 2.5 µm and a minimum bandwidth of about 0.8 µm. Results of an experimental study of the laser radiation distribution generated using the DOE and its comparison with distribution of radiation obtained in the usual way are presented.     

衍射光学器件的激光辅助制造

衍射光学器件 DOE是基于衍射光学原理制成的微光学器件。采用类似于微电子加工手段的激光辅助制造技术——激光直写技术 ,可以制作具有高衍射效率的 DOE。激光直写系统的性能 ,比如光强控制、坐标定位以及自动对焦等 ,直接影响制成器件的衍射效率。最后对曲面衍射光学器件激光辅助制造的关键技术进行了分析     

Highly efficient smoothing of Inconel 718 via electrochemical-based isotropic etching polishing

For the highly efficient and versatile polishing of metals, isotropic etching polishing (IEP), which is based on the merging of isotropic etching holes, has been developed. In this study, the feasibility and mechanism of isotropic etching polishing of nickel-based superalloy Inconel 718 (IN718) and the polishing characteristics have been studied. The potentiodynamic experiments revealed similar trends of the cathodic, passive, second passivation, and transpassive regions in all the electrolytes, while the corrosion susceptibility of IN718 successively decreased with the increasing H₂SO₄ concentration in the electrolyte. The etching anisotropy of the IN718 precipitated with different phases can be experimentally transmuted to isotropic etching by modulating the electrolyte concentration and keeping electrolyte temperature equal or above the room temperature. Because of the positive correlation of the etching current with isotropic holes density and diameter, etching at higher currents is promoted for the rapid and proficient polishing. The surface evolution mechanism during IEP has been confirmed. The surface roughness initially increased due to the formation of etching holes, then decreased abruptly owing to the rapid merging of etching holes and finally achieved a smooth surface. The wet grounded surface of IN718 with a roughness of Sa 62.7 nm has been transformed into a mirror-like smooth surface with a roughness of Sa 0.86 nm within 300 s of IEP at optimized conditions and a high MRR of 2.73 mm³/min has been achieved.