化学镀Ni-W-P纳米晶镀层工艺的研究

化学镀镍基二元、三元非晶态合金镀层的性能近年来得到了广泛和深入的研究,本文拟在此基础上,开发出化学镀Ni-W-P三元合金纳米晶镀层工艺.试验通过控制镀液的一些关键工艺参数,如镀液中配位体的种类和含量、镍次比和pH值等,来获得两种不同晶粒尺寸的Ni-W-P纳米晶层.并从镀液组成、镀层的X射线图谱和SEM图对两种不同晶粒尺寸的纳米晶镀层进行了对比分析,同时还辅以Ni-W-P非晶态镀层做比较,找出两种不同晶粒尺寸的Ni-W-P纳米晶镀层之间以及Ni-W-P纳米晶镀层与非晶态镀层之间在镀液组成、镀层结构和表面形貌上的差别.本试验获得Ni-W-P纳米晶镀层的工艺可靠、稳定,且镀速较高,镀液无自分解现象.     

印制电路板甲基磺酸盐化学镀锡工艺

印制电路板的可焊性镀锡常采用热浸Sn-Pb合金工艺,不符合清洁生产要求.为此,研究了一种甲基磺酸盐化学镀锡工艺,探索了镀液中主盐、配位剂、还原剂、防氧化剂、表面活性剂等组分对化学镀锡层性能的影响.研究结果表明,在优化的工艺条件下可获得厚度0.8～2.0μm、可焊性优良的银白色锡镀层,该工艺可替代传统的印制电路板热浸Sn-Pb合金热风整平工艺(HASL).     

甲基磺酸体系电镀铅锡合金工艺的研究

为了减少环境污染,降低生产成本并提高镀层质量,采用甲基磺酸体系电镀铅锡合金.介绍了对甲基磺酸盐体系电镀锡铅合金的工艺研究,对体系镀液成分与镀层成分变化的关系、共沉积特征及甲基磺酸体系电镀锡铅合金工艺中各因素对镀层质量的影响进行了研究,测定了镀液的分散能力、覆盖能力及镀层的结合力.结果表明,镀液中加入氯苯甲醛,可增加电流过程阴极极化并改善镀层性能.甲基磺酸体系镀液成分简单、性能稳定、无毒无害,具有广泛的应用前景.     

焦磷酸盐低锡青铜合金电镀工艺及辅助配位剂的功能

为了提高焦磷酸铜．焦磷酸亚锡电镀低锡青铜合金工艺的性能,在其镀液中加入辅助配位剂柠檬酸盐。用电化学、X射线衍射、腐蚀膏试验等方法对镀液及镀层性能进行分析。结果表明：合金镀液具有良好的分散能力,可在较宽的电流密度范围内获得色泽一致、锡含量约为10％的低锡合金镀层;电镀初始过程可实现钢铁表面的电位活化,提高了镀层与铁基体的...     

低磷化学镀镍液补加方式对镀层的影响

低磷化学镀镍层具有较高的熔点和较好的脱模性,适用于电子元件的可焊性和高硬度处理.为了促进其在工业生产中的应用,对镀液的补加方式进行了研究.首先通过化学分析法,确定了补加液的组成,再分别考察了按时补加和在线补加两种不同的镀液补加方式对镀液的镀速、周期稳定系数、镀层磷含量、可焊性和耐蚀性的影响.结果表明,采用在线补加方式时除耐蚀性外,其他镀液、镀层性能均优于按时补加或与按时补加持平;通过选择合适的补加工艺,可以使镀液在经过4个MTO后稳定性保持良好,镀速保持在15 μm/h以上,镀层中磷含量低于4.5%,保证了镀层良好的可焊性.     

2种配位剂对镁合金化学镀镍锡磷合金的影响

在镁合金上以硫酸镍和锡酸钠为主盐沉积了镍锡磷镀层.探讨了在碱性镀液中,以柠檬酸钠和碳酸钠为配位剂对化学镀镍锡磷镀层性能的影响.结果表明:此三元合金镀层为非晶态,含2.48%Sn,8.51%P,平整致密;柠檬酸钠与镍生成了稳定常数大的配位化合物,有利于镀层的快速生长;锡元素的加入增强了二元镍磷合金的耐蚀性.     

光亮锡镍合金镀层的制备及其耐腐蚀性能研究

采用氨基酸类添加剂在焦磷酸盐体系中电沉积出锡含量67%、颜色与镍镀层相仿、耐腐蚀性能优异的Sn-Ni合金镀层.研究了镀液中添加剂含量变化对锡镍合金镀层含量、表面形貌和耐蚀性的影响.结果表明:当添加荆用量为2.0 g/L时,对镀液的稳定性和镀层锡含量均有显著影响,耐蚀性能显著提高.同时中性盐雾试验测试结果表明,Sn-Ni合金镀层的耐蚀性比单金属镍镀层更为优异.     

化学镀Ni-Sn-P中锡的析出行为

化学镀Ni-Sn-P层锡的含量对其性能有较大的影响,过去对锡的析出研究不多.为此,利用电子能谙(EDS)等方法分析了化学镀液中锡含量对镀速和镀层中锡、磷含量的影响,用扫描电镜(SEM)、电子能谱(EDS)对施镀不同时间的镀层形貌、组成进行了分析.结果表明:沉积速度随镀液中锡含量的增加而减小,镀层中的锡含量随着镀液中锡含...     

化学镀Ni－Sn－P三元合金的工艺和性能的研究

在确定的化学镀Ｎｉ－Ｓｎ－Ｐ镀液组成的条件下，研究了工艺参数（镀液温度和ｐＨ）对沉积速度和镀层中含锡量及含磷量的影响，并对该合金镀层的结构、孔隙率及耐蚀性能进行了测试。结果表明：在一定的工艺条件下获得的非晶态合金镀层具有较小的孔隙率和良好的耐蚀性能。     

聚丙烯塑料低温化学镀Ni-P工艺的研究

研究了Ni-P化学镀液的主要成分、pH值和温度工艺参数对化学沉积Ni-P合金镀层镀速的影响.通过选择合适的镀液成分和工艺参数,在PP塑料基体上低温化学镀Ni-P合金工艺中获得中磷含量合金镀层,探讨了镀液组分对镀层性能的影响,优化了工艺参数.利用扫描电镜测得镀层的含磷量为8.057%,所以为非晶态的镀层.     

Microstructural study of co-electroplated Au/Sn alloys

Gold-tin eutectic solder (20 wt% Sn), because of its excellent mechanical and thermal properties, is utilized for flip chip and laser bonding in optoelectronic applications. Coelectroplating of Au and Sn has been investigated as an alternative to conventional methods for depositing Au/Sn alloys. Pulse current (PC) and direct current (DC) plating tests have been performed and compared using a suitably stable plating solution. Plating conditions, including current density and ON and OFF times (for PC plating), have been varied to optimize the process. Reproducibility tests have also been performed. It is shown that a range of alloy compositions can be deposited, including eutectic and near-eutectic compositions, with compositional and microstructural uniformity potentially suitable for microelectronic and optoelectronic solder applications.     

新型酸性光亮镀锡铜合金镀液中锡的测定

为消除Cu2 的干扰,防止Sn2 ,Sn4 的水解,建立了一套采用解蔽返滴定法,不经分离对新型酸性光亮镀锡铜合金镀液中的锡进行测定的分析方法.在pH值为5.5的醋酸-吡啶缓冲溶液中,用2.5 g NH4F解蔽,4滴XO、1 mL CPB指示终点,锌盐返滴定镀液中的锡.结果表明,选择3.0 mL H2O2,1.0 mL甘油,加热6 min对测定结果无影响.1.0 mL抗坏血酸,2.0 mL硫脲可掩蔽Fe3 及Cu2 的干扰.该法操作简便快速,准确度高,加标回收率达99.80%以上.适合镀锡、锡铜合金镀液中锡的测定.     

铜导线表面热浸镀PbSn合金镀层的组织与性能

为了改善铜导线的可焊性和耐蚀性,采用热浸镀技术在铜导线表面制备Pb40Sn60和Pb37Sn63两种成分的低熔点合金镀层,利用扫描电镜(SEM)、能谱分析(EDS)、X射线衍射(XRD)等分析手段和电阻率检测实验、拉伸实验、中性盐雾实验等方法,系统研究其微观组织、相成分、电阻率、力学性能及耐蚀性。结果表明:Pb40Sn60和Pb37Sn63两种成分的合金镀层均由α相和β相两相组成,镀层的电阻率分别约为2.6832×10^-3,2.5929×10^-3Ω·m,均高于铜基体。铜导线热浸镀Pb40Sn60和Pb37Sn63两种成分合金镀层后的表面硬度分别为13.4,12.6HV0.2;抗拉强度分别为193,180 MPa;伸长率分别为35%和37%,与铜基体相比均降低。铜导线表面热浸镀PbSn合金镀层具有良好的导电性、力学性能及耐腐蚀性等综合性能。随着Pb含量的降低或Sn含量的增加,PbSn合金镀层中α相的相对量减少、β相的相对量增大,其电阻率、硬度和强度降低,塑性略有增大,耐蚀性增强。Pb40Sn60比Pb37Sn63合金镀层的腐蚀速率较高,分别为2.44×10^-2,3.65×10^-3 g·cm^-2·a^-1,耐腐蚀性较差。PbSn合金镀层中α相比β相的腐蚀程度更为严重,α相比β相的耐蚀性要差。     

Sn40Pb共晶合金电镀工艺

目的对Sn40Pb共晶合金电镀工艺过程进行研究。方法采用电镀和超声辅助搅拌,Sn40Pb作为电镀阳极,在铜片上成功的制备了Sn40Pb共晶合金镀层。结果研究表明随着电流密度增大,镀层厚度增加,镀层中铅含量增加较快,电流密度过大时阴极析氢反应剧烈,锡铅镀层会变得粗糙,致密性变差。结论当电镀液成分为甲基磺酸为12 m L(24 g/L)、甲基磺酸锡为8 m L(16 g/L)、甲基磺酸铅为3.7 m L时,控制电流密度在4 A/dm~2、电镀时间为5 min左右,可以获得接近锡铅共晶的理想合金镀层。     

Martensitic transformation and shape memory properties of Ti-Ta-Sn high temperature shape memory alloys

The effects of Ta and Sn contents on the martensitic transformation temperature, crystal structure and thermal stability of Ti-Ta-Sn alloys are investigated in order to develop novel high temperature shape memory alloys. The martensitic transformation temperature significantly decreases by aging or thermal cycling due to the formation of ω phase in the Ti-Ta binary alloys. The addition of Sn is effective for suppressing the formation of ω phase and improves stability of shape memory effect during thermal cycling. The amount of Sn content necessary for suppressing aging effect increases with decreasing Ta content. High martensitic transformation temperature with good thermal stability can be achieved by adjustment of the Ta and Sn contents. Furthermore, the addition of Sn as a substitute of Ta with keeping the transformation temperature same increases the transformation strain in the Ti-Ta-Sn alloys. A Ti-20Ta-3.5Sn alloy reveals stable shape memory effect with a martensitic transformation start temperature about 440 K and a larger recovery strain when compared with a Ti-Ta binary alloy showing similar martensitic transformation temperature.     

空心微珠表面化学镀Ni-Co-P合金镀层研究

用化学镀的方法将空心微珠改性,使它具有电、磁等性能,是拓宽空心微珠应用领域的一种新方法.以AgNO3代替常见的贵金属盐PdCl2为活化剂,在空心微珠表面化学镀Ni-Co-P合金镀层,用X射线衍射仪、能谱仪和扫描电镜对其进行了分析表征.结果表明,以AgNO3活化剂代替常用的PdCl2活化剂,可在空心微珠表面得到Ni-Co-P合金镀层,同时分析了以AgNO3代替常用的PdCl2活化剂制备Ni-Co-P合金镀层的形成机理.本方法能改善Ni-Co-P合金镀层的性能,成本低,具有良好的应用前景.     

Effect of Cu/Zn on microstructure and mechanical properties of extruded Mg–Sn alloys

In this paper, the effect of Cu and Zn addition on mechanical properties of indirectly extruded Mg–2Sn alloy was investigated. Mg–2Sn–0.5Cu alloy exhibits a moderate yield strength (YS) of 225?MPa and an ultimate strength of 260?MPa, which are much higher than those of the binary Mg–2Sn alloy, and the elongation (EL) evolves as ～15.5%. Mechanical properties of the Mg–2Sn–0.5Cu alloy are deteriorated with more 3 wt-% Zn addition, and YS and EL are reduced as 160?MPa and ～10%. The detailed mechanism is discussed according to the work-hardening rate and strengthening effect related to the grain sizes, second phases and macro-textures. Grain refinement and proper texture are believed to play a critical role in both strength and ductility optimisation.     

镁锂合金表面处理技术研究现状及展望

镁锂合金具有优异性能,是部件轻量化的理想材料,但镁锂合金极易腐蚀,其应用受到限制。为提高镁锂合金耐蚀性,国内外对其表面处理进行了研究。综述了国内外镁锂合金表面处理技术的研究现状,介绍了化学转化、阳极氧化、金属镀（涂）层、气相沉积、有机涂层等表面防护技术的研究进展,并展望了镁锂合金表面处理理论与技术的发展趋势。     

Large‐Grain Tin‐Rich Perovskite Films for Efficient Solar Cells via Metal Alloying Technique

Fast research progress on lead halide perovskite solar cells has been achieved in the past a few years. However, the presence of lead (Pb) in perovskite composition as a toxic element still remains a major issue for large‐scale deployment. In this work, a novel and facile technique is presented to fabricate tin (Sn)‐rich perovskite film using metal precursors and an alloying technique. Herein, the perovskite films are formed as a result of the reaction between Sn/Pb binary alloy metal precursors and methylammonium iodide (MAI) vapor in a chemical vapor deposition process carried out at 185 °C. It is found that in this approach the Pb/Sn precursors are first converted to (Pb/Sn)I₂ and further reaction with MAI vapor leads to the formation of perovskite films. By using Pb–Sn eutectic alloy, perovskite films with large grain sizes up to 5 µm can be grown directly from liquid phase metal. Consequently, using an alloying technique and this unique growth mechanism, a less‐toxic and efficient perovskite solar cell with a power conversion efficiency (PCE) of 14.04% is demonstrated, while pure Sn and Pb perovskite solar cells prepared in this manner yield PCEs of 4.62% and 14.21%, respectively. It is found that this alloying technique can open up a new direction to further explore different alloy systems (binary or ternary alloys) with even lower melting point.