| 甲基磺酸体系电镀铅锡合金工艺的研究 |
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| 引用本文： | 李国斌,令玉林.甲基磺酸体系电镀铅锡合金工艺的研究[J].材料保护,2006,39(3):29-31. |
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| 作者姓名： | 李国斌 令玉林 |
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| 作者单位： | 湖南科技大学化学化工学院,湖南,湘潭,411201 |
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| 摘 要： | 为了减少环境污染,降低生产成本并提高镀层质量,采用甲基磺酸体系电镀铅锡合金.介绍了对甲基磺酸盐体系电镀锡铅合金的工艺研究,对体系镀液成分与镀层成分变化的关系、共沉积特征及甲基磺酸体系电镀锡铅合金工艺中各因素对镀层质量的影响进行了研究,测定了镀液的分散能力、覆盖能力及镀层的结合力.结果表明,镀液中加入氯苯甲醛,可增加电流过程阴极极化并改善镀层性能.甲基磺酸体系镀液成分简单、性能稳定、无毒无害,具有广泛的应用前景.
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| 关 键 词： | 电镀 氯苯甲醛 锡铅合金 甲基磺酸 |
| 文章编号： | 1001-1560（2006）03-0029-03 |
| 收稿时间： | 11 23 2005 12:00AM |
| 修稿时间： | 2005-11-23 |
Methylsulfonate Sn-Pb Alloy Electroplating Technology |
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| LI Guo-bin,LING Yu-lin.Methylsulfonate Sn-Pb Alloy Electroplating Technology[J].Journal of Materials Protection,2006,39(3):29-31. |
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| Authors: | LI Guo-bin LING Yu-lin |
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| Abstract: | Methylsulfonate Sn-Pb alloy electroplating technology was studied, and the variety of plating elements with the bath compositions, codepositing characteristics and effects of various process conditions on the plating quality were investigated. At the same time the throwing power and covering power of bath and the adhesion of coating were measured. The bath has the extensive application prospects for its stability and simple compositions, nontoxic and harmless. |
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| Keywords: | electroplating Sn-Pb alloy methylsulfonic acid |
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