C波段160W连续波GaN HEMT内匹配功率器件研制

基于GaN功率器件工艺自主研发的大栅宽GaN高电子迁移率晶体管(HEMT)管芯,采用内匹配技术和宽带功率合成技术相结合的方法,研制出了一款C波段160 W连续波GaN HEMT内匹配功率器件。通过优化管芯的结构,设计出了满足连续波使用要求的大功率GaN管芯,然后进行了内匹配器件的设计,在设计中首先采用负载牵引法进行了器件参数提取,并以此为基础设计了阻抗变换网络进行阻抗变换和功率合成。研制出了工作频率为4.4~5.0 GHz、工作电压32 V、连续波输出功率大于160 W、功率附加效率大于50%、功率增益大于12 dB的GaN HEMT内匹配功率管,具有广阔的工程应用前景。     

S波段大功率、高效率GaN HEMT器件研究

基于国产的SiC衬底GaN外延材料,研制出大栅宽GaN HEMT单胞管芯。通过使用源牵引和负载牵引技术仿真出所设计模型器件的输入输出阻抗,推导出本器件所用管芯的输入输出阻抗。使用多节λ/4阻抗变换线设计了宽带Wilkinson功率分配/合成器,对原理图进行仿真,优化匹配网络的S参数,对生成版图进行电磁场仿真,通过LC T型网络提升管芯输入输出阻抗。采用内匹配技术,成功研制出铜-钼-铜结构热沉封装的四胞内匹配GaN HEMT。在频率为2.7～3.5 GHz、脉宽为3 ms、占空比为50%、栅源电压Vgs为-3 V和漏源电压Vds为28 V下测试器件,得到最大输出功率Pout大于100 W(50 dBm),PAE大于47%,功率增益大于13 dB。     

X波段300 W GaN功率器件技术

介绍一种基于国产氮化镓(GaN)外延材料的X波段300 W GaN高效率内匹配器件技术。该技术采用大栅宽芯片的大信号有源模型和封装管壳、键合引线、电容等无源模型,开展X波段300 W内匹配功率器件的设计。采用四胞匹配合成电路,使用L-C网络提升器件阻抗,通过λ/4阻抗变换网络进行阻抗变换和功率合成,实现阻抗50 Ω匹配,功率分配器和匹配电容使用高Q值陶瓷基片实现。仿真实验证明,该器件在9.5~10.5 GHz频率内输出功率大于300 W,功率增益大于9 dB,功率附加效率大于38.9%。同时研究了器件输出功率和功率附加效率随工作电压、脉冲宽度、占空比变化情况。     

X波段GaN千瓦级功率放大器的设计

为满足新型雷达对千瓦级大功率放大器的需求,采用0.25μm GaN HEMT工艺研制了一款输出功率大于2 000 W的X波段内匹配功率放大器。通过背势垒层结构与双场板结构提高器件击穿电压,使GaN HEMT管芯的工作电压达到60 V。通过负载牵引得到管芯最优阻抗,采用T型匹配网络和功率分配/合成器将管芯阻抗匹配到50Ω。在工作电压60 V、占空比1‰、脉宽5μs测试条件下,9.0～9.4 GHz频段内输出功率大于2 000 W,最大功率密度达到10.4 W/mm,功率增益大于7 dB,功率附加效率大于37.2%。     

L波段高效率内匹配GaN HEMT

研究了一种基于国产SiC衬底的L波段GaN高效率内匹配器件。利用在片微波测试和直流测试相结合方法获得器件的小信号模型,外推得到大信号模型,并进行负载牵引方法验证。在此基础上设计两胞匹配电路,采用电感-电容匹配网络,器件阻抗提升到12Ω,利用改进型威尔金森功率分配器和功率合成器将阻抗由12Ω提升到50Ω,功率分配器和匹配电容使用高Q值陶瓷基片加工。研制的内匹配GaN HEMT器件在测试频率为1.20~1.32 GHz时,输出功率大于80 W,功率增益大于16.2 dB,最大功率附加效率达到72.1%。     

C波段大功率GaN HEMT内匹配器件

基于GaN微波功率器件工艺制作了大栅宽GaN高电子迁移率晶体管(HEMT)管芯,通过负载牵引及建模技术提取了管芯的输入阻抗、输出阻抗.采用二项式多节阻抗匹配变换器实现了宽带功率分配器及合成器电路的制作,通过采用LC网络提升了管芯输入阻抗、输出阻抗,加入了稳定网络,实现了50 Ω阻抗匹配.采用高热导率金属陶瓷外壳,提高了器件散热能力.最终研制成功大功率GaN HEMT内匹配器件,器件采用四胞管芯功率合成技术,总栅宽为40 mm.测试结果表明,频率为4.5～4.8 GHz,脉宽300μs,占空比10％,工作电压VDSs为28 V,器件的输出功率大于120 W,功率附加效率大于50％,功率增益大于11 dB.     

14～14.5 GHz 20 W GaAs PHEMT内匹配微波功率管

介绍了一种Ku波段内匹配微波功率场效应晶体管.采用GaAs PHEMT 0.25μm T型栅工艺,研制出总栅宽为14.4 mm的功率PHEMT管芯.器件由四管芯合成,在14～14.5 GHz频率范围内,输出功率大于20 W,附加效率大于27%,功率增益大于6 dB,增益平坦度为±0.3 dB.     

Ku波段60W AlGaN/GaN功率管

针对Ku波段60W氮化镓内匹配功率管,开展了内匹配电路的设计、合成以及内匹配电路的测试等研究工作,实现了GaN功率HEMT在Ku波段60W输出功率的内匹配电路,并使整个电路的输入、输出电路阻抗提升至50Ω。该功率管采用南京电子器件研究所研制的两个10.8mm栅宽管芯进行合成,最终研制的GaN Ku波段内匹配功率管在28V漏电压、1ms周期、10%占空比及14.0~14.5GHz频带内输出功率大于60W,最高功率输出66W,带内功率增益大于6dB,最大功率附加效率33.1%,充分显示了GaN功率器件在Ku波段应用的性能优势。     

X波段400 W GaN内匹配功率管北大核心CSCD

报道了X波段脉冲输出功率超过400 W的GaN HEMT内匹配功率管。该器件内部包含了4只14.4mm栅宽GaN HEMT管芯。输入输出同时采用了一级L-C阻抗变换和两级微带阻抗变换器。该器件在9.0~10.0GHz频带内,在漏极电压为50V、脉冲宽度100μs、占空比10%测试条件下,输出功率达到了400 W以上,功率增益大于9dB,附加效率高于37.7%,带内峰值输出功率450 W。     

13.7～14.5GHz内匹配型GaAs大功率器件

经过对器件结构、钝化等工艺的改进,成功研制出总栅宽为19.2mm的GaAs功率HFET.两管芯合成的内匹配器件,当Vds=9V,输入功率Pin=35dBm时,在f=13.7～14.5 GHz频段内,输出功率Po＞42dBm(15.8W),功率增益Gp＞7dB,功率附加效率PAE＞35%,两管芯合成效率大于90%,其中在14.3GHz频率点,输出功率达到42.54dBm(17.9W),增益7.54dB.     

X波段8W,14W内匹配器件研究

对Ｘ波段ＧａＡｓ大栅宽器件的匹配及多胞功率合成技术进行了研究, 做出了两胞合成８Ｗ、增益６ｄＢ和四胞合成１４Ｗ、增益５ｄＢ的内匹配器件,功率附加效率约为２２％ 。     

Design of Millimeter-Wave Power Divider with Coupled Line

A novel 35GHz 3dB power divider using coupled transmission line is presented. Unlike conventional Wilkinson divider circuit, only the 50 Ω transmission lines are used in the design. The impedance matching can be achieved by coupled transmission line even mode characteristic impedance. The predicated and measured performances agree well.     

Monolithically integrated high-power broad-band RF switch based on III-N insulated gate transistors

We report on the high-performance monolithically integrated RF switch based on metal-oxide-semiconductor III-N heterostructure field-effect transistors (MOSHFETs). The radio frequency (RF) switch microwave monolithic integrated circuit (MMIC) consists of three submicron-gate MOSHFETs connected into /spl pi/-type configuration. In the 0-10 GHz frequency range, the insertion loss is less than 1dB and the isolation is better than 20 dB. The switching powers well exceed 20 W per 1mm of the active element width. The high performance parameters of the switch are achieved due to unique properties of III-nitride MOSHFET, which combines a low channel resistance and high breakdown voltage features of AlGaN/GaN HFETs and extremely low gate leakage currents, large gate voltage swing and low gate capacitance specific to insulated gate design. The combination of these parameters makes MOSHFETs excellent candidates for high-power switching. The experimental data obtained from the RF switch are in close agreement with the results of simulations.     

集总元件宽带Wilkinson功分器的研究

提出了一种集总元件宽带Wilkinson功分器的分析及设计方法。从功分器的奇偶模阻抗理论分析出发,将功分器设计转化为在偶模下求解阻抗比为2:1的宽带阻抗变换和在奇模下求解宽带阻抗匹配的问题,采用LC阻抗变换节取代传统电路的λ/4传输线,减小功分器体积,并推导出两级功分器的元件解算公式。经ADS仿真验证,由解算公式得到的两级功分器,在760～1240MHz的带宽内功率分配损耗小于0.1dB,隔离度大于20dB,输入输出端口反射系数均小于-20dB,可用带宽fH/fL为1.64,实现了Wilkinson功分器小尺寸、带宽大的优点。     

Fully integrated unequal Wilkinson power divider with EBG CPW

In this paper, a CPW with electromagnetic bandgap (EBG CPW) is newly proposed for designing a transmission line with high impedance. After designing, fabricating, and evaluating the characteristic impedance of the proposed EBG CPW transmission line, it will be applied to an integrated unequal Wilkinson power divider. In the EM simulation, the EBG-CPW transmission line with 10 /spl mu/m in line width has the same characteristic impedance as a CPW with a line width of 2.5 /spl mu/m. The insertion and return losses of the fabricated power divider with a power ratio of 1 to 3 are less than -0.7 dB and -15 dB, respectively. It also has excellent isolation characteristics with more than -20 dB. The experimental results are good agreement with the simulation.     

Power Stability of AlGaN/GaN HFETs at 20 W/mm in the Pinched-Off Operation Mode

High power-added efficiency (PAE) (ap74%) and rf-power (20 W/mm) operation of Schottky and insulated-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) is reported at 2 GHz. In the pinched-off mode of operation, the PAE increases from a value of 55% to 74% when the drain bias is changed from 35 to 60 V. While both the Schottky and the insulated HFETs show high powers and PAE values, only the insulated-gate devices are stable at 20-W/mm output powers during a 60-h continuous wave rf-stress test. Their power drop of less than 0.1 dB is much smaller than the 0.8-dB drop for identical geometry Schottky-gate HFETs. The superior stability of the insulated-gate HFETs is attributed to the low forward gate currents     

一种基于内匹配器件的功率分配器设计

介绍了一种基于内匹配功率管的Wilkinson微带功率分配器设计新思路。传统Wilkinson微带功率分配器在低频段体积大,用于内匹配功率管时很难在规定的尺寸范围内使用,采用高介电常数陶瓷基片辐射损耗大,直流转换效率低。适当引入不连续性,提高端口阻抗值,端口阻抗引入的虚部参与后续匹配网络的新型Wilkinson微带功率分配器,与传统Wilkinson功率分配器相比,体积更小,效率更高,有很好的实用价值。设计的工作频段在5.2～5.8 GHz的Wilkinson微带功率分配器,在整个频带内输出功率大于50 dBm,饱和功率增益高于7 dB,功率附加效率大于30%。     

微波治疗脑瘤用宽带功分器的设计

为了能够在颅内微波治疗脑瘤中,采用分区加热的方式,设计了一种宽带一分二Wilkinson型功分器。这种功分器的工作带宽为0.8G到2.6G,采用三节阶梯阻抗方式。通过对等效电路的阻抗分析,给出设计参数,并基于ADS 软件对其结构进行仿真与优化,根据设计制作了一个功分器并进行了测试。仿真结果和实物测试结果比较接近,该功分器在整个频带范围内具有良好的性能指标,传输损耗低至0.9dB,隔离度高于20dB。该功分器实现了宽带化以及小型化,完全满足颅内微波热疗系统的应用。     

GaAs heterostructure FET frequency dividers fabricated with high-yield 0.5 mu m direct-write trilevel-gate-resist

Frequency dividers and FET test structures have been fabricated on selectively doped n/sup +/AlGaAs/GaAs heterostructure FETs (HFETs) with 0.5 mu m gate length electron-beam direct-writing on a novel trilevel resist, EBR-9/Ge/PMGI. A divide-by-two master-slave frequency divider fabricated with direct-coupled FET logic gates operated up to 9.3 GHz. The input frequency range of a divide-by-two transmission-gate frequency divider was from 3.2 to 12.2 GHz, with a supply voltage of 1.2 V at room temperature. The average propagation delay (fan-in and fan-out=1) was 18.2 ps/gate, with a power dissipation of 3.9 mW/stage. With a 3.5 mu m source-drain spacing, a peak transconductance of 360 mS/mm was measured. The functional yield of both discrete devices and circuits was 92% across 2 in-diameter wafers.<>