MOCVD生长的GaN:Mg外延膜的光电性质

用MOCVD技术生长GaN:Mg外延膜,在550～950℃温度范围内,对样品进行热退火,并进行室温Hall、光致发光谱(PL)测试.Hall测试结果表明,850℃退火后空穴浓度达到8×1017 cm-3以上,电阻率降到0.8Ω·cm以下.室温PL谱有两个缺陷相关发光峰,位于2.8eV的蓝光峰(BL)以及3.27eV附近的紫外峰(UVL).蓝光峰对紫外峰的相对强度(BL/UVL)在550℃退火后升高,之后随着退火温度的升高(650～850℃)而下降,继续提高退火温度至950℃,BL/UVL急剧上升.空穴浓度先随着Mg掺杂浓度的增加而升高;但继续增加Mg掺杂浓度,空穴浓度反而下降.这些结果表明要实现空穴浓度达1018 cm-3,不仅要考虑H的钝化作用,还要考虑Mg受主的自补偿效应.     

MOCVD生长Mg掺杂GaN的退火研究

用MOCVD技术在50mm蓝宝石衬底(0001)面上生长了GaN∶Mg外延膜,对样品进行热退火处理并作了Hall、双晶X射线衍射(DCXRD)和室温光致发光谱(PL)测试.Hall测试结果表明,950℃退火后空穴浓度达到5×1017cm-3以上,电阻率降到2.5Ω·cm;(0002)面DCXRD测试发现样品退火前、后的半峰宽均约为4′;室温PL谱中发光峰位于2.85eV处,退火后峰的强度比退火前增强了8倍以上,表明样品中大量被H钝化的受主Mg原子在退火后被激活.     

MOCVD生长Mg掺杂GaN的退火研究

用MOCVD技术在50mm蓝宝石衬底（0001）面上生长了GaN∶Mg外延膜，对样品进行热退火处理并作了Hall、双晶X射线衍射(DCXRD)和室温光致发光谱(PL)测试．Hall测试结果表明，950℃退火后空穴浓度达到5e17cm－3以上，电阻率降到2.5Ω·cm；(0002)面DCXRD测试发现样品退火前、后的半峰宽均约为4′；室温PL谱中发光峰位于2.85eV处，退火后峰的强度比退火前增强了8倍以上，表明样品中大量被H钝化的受主Mg原子在退火后被激活．     

不同Mg掺杂浓度的GaN材料的光致发光

研究了用低压金属有机物化学沉积方法生长得到的具有不同Mg掺杂浓度的GaN样品薄膜,经不同温度退火处理后的发光特性.实验发现随着退火温度的升高,不同掺杂浓度的Mg∶GaN材料的光致发光谱蓝带峰能量相差变小,经850℃退火后蓝带集中在2.92eV附近.利用Mg∶GaN材料内部补偿模型对此现象进行了分析,同时认为对于掺杂浓度较高的样品,850℃为最佳的退火温度.     

不同Mg掺杂浓度的GaN材料的光致发光

研究了用低压金属有机物化学沉积方法生长得到的具有不同Mg掺杂浓度的GaN样品薄膜,经不同温度退火处理后的发光特性.实验发现随着退火温度的升高,不同掺杂浓度的Mg∶GaN材料的光致发光谱蓝带峰能量相差变小,经850℃退火后蓝带集中在2.92eV附近.利用Mg∶GaN材料内部补偿模型对此现象进行了分析,同时认为对于掺杂浓度较高的样品,850℃为最佳的退火温度.     

p型GaN的渐变δ掺杂研究

采用MOCVD技术及渐变δ-Mg掺杂方法生长了p型GaN薄膜,对样品进行了两步退火处理以对Mg进行激活.通过Hall测试发现,经过950℃下的第一次退火后,样品空穴浓度为1.64×1016cm-3,电阻率为77.9Ω·cm.经过750℃下的第二次退火后,样品的空穴浓度增大了10倍,电阻率减小为原来的1/20.分析认为,渐变δ掺杂减小了Mg的自补偿效应,两步退火提高了Mg的激活效率,从而显著提高了样品的空穴浓度和降低了电阻率.实验还发现,经过750℃下15min的第二次退火后得到的样品的空穴浓度最大,达5.13×1017cm-3.     

MOCVD生长的p型GaN薄膜中Mg掺杂的优化与分析

通过优化Mg流晕增强了MoCVD生长的GaN薄膜的p型电导并改善了晶体质量.Hall测量结果表明卒穴浓度首先随着Mg流量的升高而升高,达到极大值后开始降低;迁移率始终随Mg流量的升高而降低.最优的样品在室温下空穴浓度达到4.1×1017cm-3,电阻率降至1Ω·cm.考虑施主型缺陷MGaVN的自补偿作用,计算了空穴浓度随掺杂浓度变化的曲线关系.计算结果表明自补偿系数随掺杂浓度的增大而增大;空穴浓度首先随掺杂浓度的增大而增加,存受主浓度为NA≈4×1019左右时达到极大值,之后随着掺杂浓度的增大而迅速降低.XRD数据表明在实验范围内晶体缺陷密度随着掺杂浓度的降低而降低.     

MOCVD生长的p型GaN薄膜中Mg掺杂的优化与分析

通过优化Mg流晕增强了MoCVD生长的GaN薄膜的p型电导并改善了晶体质量.Hall测量结果表明卒穴浓度首先随着Mg流量的升高而升高,达到极大值后开始降低;迁移率始终随Mg流量的升高而降低.最优的样品在室温下空穴浓度达到4.1×1017cm-3,电阻率降至1Ω·cm.考虑施主型缺陷MGaVN的自补偿作用,计算了空穴浓度随掺杂浓度变化的曲线关系.计算结果表明自补偿系数随掺杂浓度的增大而增大;空穴浓度首先随掺杂浓度的增大而增加,存受主浓度为NA≈4×1019左右时达到极大值,之后随着掺杂浓度的增大而迅速降低.XRD数据表明在实验范围内晶体缺陷密度随着掺杂浓度的降低而降低.     

Al掺杂ZnO薄膜的表面形貌和光学性质

用原子力显微镜、紫外-可见分光光度计和荧光光谱仪观察采用溶胶-凝胶法制备的Al掺杂ZnO薄膜的表面形貌、透射光谱和光致发光谱.结果表明,Al掺杂量为0.5at 9/6的ZnO薄膜经550℃退火处理后,粗糙度为1.817,Al掺杂量为1.0at%的ZnO薄膜经600℃退火处理后,粗糙度增大到4.625.样品在可见光范围内的平均透过率均大于80%.当激发波长为325 nm时,在397 nm(3.13 eV)附近出现紫外发光峰;当激发波长为360 nm时,在443 nm(2.80 eV)附近出现蓝色发光峰.探讨了样品的蓝光发光机制.     

退火对MOCVD法生长ZnO薄膜性能的影响

采用MOCVD方法在(001)Si衬底上生长ZnO薄膜,并在空气中800℃退火1 h.生长及退火样品的XRD图谱均显示了较强的(002)ZnO衍射峰,表明ZnO薄膜为c轴高取向生长.光电子能谱(XPS)分析显示,退火后ZnO薄膜从富Zn生长变为富O生长.在样品的室温PL 谱中,观察到未退火样品的紫外发射峰的中心为3.28 eV,并观察到退火样品位于3.30 eV的自由激子发射峰和位于3.23 eV的施主-受主对的复合发光峰.实验结果表明,退火后ZnO薄膜的晶体质量得到提高.     

Al掺杂半导体Mg2Si薄膜的制备及光学带隙研究

用磁控溅射方法在Si衬底上制备了Al掺杂Mg2Si薄膜,通过X射线衍射仪(XRD)、扫描电镜(SEM)、原子力显微镜(AFM)和分光光度计研究了掺杂含量对Mg2Si薄膜组分、表面形貌、粗糙度及光学带隙值的影响,XRD结果表明随着Al掺杂量的增加, Mg2Si衍射峰先增强后减弱. SEM及AFM的结果表明随掺杂量的增加,结晶度先增加后降低,晶粒尺寸减小,粗糙度先增加后降低.得到掺杂后薄膜间接跃迁带隙范围为0.423～0.495 eV,直接跃迁带隙范围为0.72～0.748 eV,掺杂前薄膜间接跃迁带隙和直接跃迁带隙分别为0.53 eV、0.833 eV.     

离子束溅射氧化钽薄膜光学特性的热处理效应

主要研究了离子束溅射制备的氧化钽薄膜在大气氛围下热处理对其光学特性的影响规律。实验中热处理温度范围的选择为150~550℃,间隔为200℃。研究中分别采用介电常数的Cody-Lorentz色散模型和振子模型对氧化钽薄膜的能带特性（1~4 eV）和红外波段（400~4 000 cm-1）的微结构振动特性进行了表征。研究结果表明,在150℃和350℃之间出现热处理温度转折点,即热处理温度高于此值时消光系数增加。Urbach能量的变化与消光系数趋势相同,而禁带宽度的变化与消光系数恰好相反。通过红外微结构振动特性分析,薄膜中仍存在亚氧化物的化学计量缺陷。     

InGaN∶Mg薄膜的电学特性研究

利用MOCVD生长了InGaN:Mg薄膜,研究了生长温度、掺Mg量对InGaN:Mg薄膜电学特性的影响。结果表明,空穴浓度随着生长温度的降低而升高。在相同的生长温度下,空穴浓度随掺Mg量的增加,先升高后降低。通过对这两个生长条件的优化,在760°C、CP2Mg与TMGa摩尔流量之比为2.2‰时制备出了空穴浓度高达2.4×1019cm-3的p-InGaN∶Mg薄膜。这对进一步提高GaN基电子器件与光电子器件的性能有重要意义。     

Mg掺杂AlGaN的特性研究

采用金属有机物化学气相淀积方法在Al2O3衬底上生长不同浓度Mg掺杂的AlxGa1-xN合金薄膜,并在750℃、N2气氛下对Mg进行热退火激活。用X射线衍射ω-2θ扫描计算确定样品的Al组分,发现Mg摩尔掺杂浓度和退火对Al组分均未产生明显影响。X射线衍射摇摆曲线与原子力显微镜扫描表明随Mg摩尔掺杂浓度增加,样品晶体质量下降,样品表面凹坑增加,但热退火对薄膜表面形貌有明显的改善。阴极射线发光测量发现带边峰强度随掺杂浓度增加而减弱,退火后样品的施主-受主对复合发射与导带受主的复合发射均有增强,验证了热退火对钝化受主杂质的激活作用,对实现高效AlGaN的p型掺杂具有重要意义。     

表面粗化高空穴浓度InGaN:Mg性能及其发光二极管应用

利用金属有机物化学气相淀积(MOCVD)技术在蓝宝石衬底上生长了InGaN:Mg薄膜,对不同源流量InGaN:Mg材料特件进行了研究.光学和电学特性观测表明,当外延生长温度在760℃,三甲基铟(TMIn)摩尔流量不变时,随CP2Mg和Ⅲ族源摩尔比([CP2Mg]/[Ⅲ])增加,当In摩尔成分增加,空穴浓度也线性增加;当...     

Polycrystalline GaSb thin films grown by co-evaporation

We report optical and electrical properties of polycrystalline GaSb thin films which were successfully grown by co-evaporation on soda-lime glass substrates. The thin films have preferential orientation of the (111)direction. SEM results indicate that the average grain size of GaSb thin film is 500 nm with the substrate temperature of 560 ℃. The average reflectance of GaSb thin film is about 30% and the absorption coefficient is of the order of 104 cm-1. The optical bandgap of GaSb thin film is 0.726 eV. The hole concentration shows a clear increasing trend as the Ga-evaporation-temperature/Sb-evaporation-temperature (TGa/TSb) ratio increases. When the Ga crucible temperature is 810 ℃ and the antinomy crucible temperature is 415 ℃, the hole concentration of polycrystalline GaSb is 2 x 1017 cm-3 and the hole mobility is 130 cm2/(V-s). These results suggest that polycrystalline GaSb thin film is a good candidate for the use as a cheap material in TPV cells.     

Raman Scattering and Photoluminescence in Ge-implanted GaN Films

The investigations on Ge-implanted GaN films grown by MOCVD and then annealed at 1100℃ under ammonia ambient have been carried out. With increasing Ge implantation dose, four additional peaks arise at wave numbers of 260, 314, 428 and 670cm-1 in Ramam spectra. In PL spectra, the relative intensity of the band-edge emission compared to the PL-band centered at 2.66eV and the yellow band decreases with increase of Ge-implanted dose. The modes of 260 and 314cm-1 are attributed to disorder-activated Raman scattering, whereas the modes of 428 and 670cm-1 are assigned to local vibrations of vacancies and vacancy-related complexes. The PL-band centered at 2.66eV and the yellow band is also related to these vacancy defects. The new Raman peak at 301cm-1 for the sample annealed only 5min originates from Ge clusters due to deficient annealing.     

High doping level by rapid thermal annealing of Mg-implanted GaAs/GaAlAs for heterojunction bipolar transistors

Rapid thermal annealing (RTA) of Mg-implanted GaAS/ GaAlAs to contact the base layer of heterojunction bipolar transistors (HBT's) is reported. Annealing cycles with time durations of a few seconds and temperature in the range of 850-950°C have been tested. Electrical properties of the annealed samples have been investigated using an electrochemical measurement technique. It was found that hole concentrations as high as 4 × 10¹⁹cm^-3and electrical activities up to 70 percent can be obtained when high doses of Mg are implanted. This high doping level is very important since the final objective is to realize a contact region to the p-type base layer of HBT's through a highly doped n+ GaAs contact layer.     

硅中离子注入层退火后残留深能级缺陷的DLTS研究

本文将DLTS测试技术用于低剂量B~+注入MOS结构,并给出了计算方法.对通过920(?)SiO_2膜、注入剂量为5×10~(11)B~+ cm~(-2),经480℃、15分钟热处理的样品测到了E_T-E_V=0.19eV,E_T-E_V=0.26eV和E_T-E_V=0.33eV三个深能级;对于1×10~(12)B~+ cm~(-2)注入,经常规热退火(950℃、30分钟)和红外瞬态退火(辐照源温1150℃,40秒)后分别测到了深能级E_T-E_V=0.24eV和E_T-E_V=0.29eV;对引入这些深能级的残留缺陷进行了讨论.     

Schottky barrier parameters and structural properties of rapidly annealed Zr Schottky electrode on p-type GaN

The Schottky barrier junction parameters and structural properties of Zr/p-GaN Schottky diode are explored at various annealing temperatures. Experimental analysis showed that the barrier height (BH) of the Zr/pGaN Schottky diode increases with annealing at 400℃ (0.92 eV (I-V)/1.09 eV (C-V)compared to the asdeposited one (0.83 eV (I-V)/0.93 eV (C-V). However, the BH decreases after annealing at 500℃. Also, at different annealing temperatures, the series resistance and BH are assessed by Cheung''s functions and their values compared. Further, the interface state density (N_SS)of the diode decreases after annealing at 400℃ and then somewhat rises upon annealing at 500℃. Analysis reveals that the maximum BH is obtained at 400℃, and thus the optimum annealing temperature is 400℃ for the diode. The XPS and XRD analysis revealed that the increase in BH may be attributed to the creation of Zr-N phases with increasing annealing up to 400℃. The BH reduces for the diode annealed at 500℃, which may be due to the formation of Ga-Zr phases at the junction. The AFM measurements reveal that the overall surface roughness of the Zr film is quite smooth during rapid annealing process.