有机电荷产生层对叠层磷光OLED器件性能的影响

采用C60/pentanece作为非掺杂电荷产生层,并在其两边各插入Al和MoOs薄层作为C60和pentanece的电子注入层和空穴注入层,在此基础上制备了结构为ITO/NPB/mCP∶8wt％Ir (ppy) 3/TPBi/Al/C60/pentanece/MoOs/NPB/mCP∶8wt％Ir (ppy) 3/TPBi/Cs2CO3/Al的双发光单元叠层绿色磷光有机发光器件(OLED).实验表明,增加Al和MoO3电荷注入层,可有效改善有机电荷产生层的电荷注入能力,提高叠层OLED器件的发光亮度和电流效率.叠层器件的启亮电压明显低于单个器件的1/2,但电流效率是单层器件的两倍以上.当Al/C60/pentanece/MoO3的厚度分别是3、15、25和1 nm时,叠层OLED器件具有最佳的光电性能,其最大亮度和最大电流效率分别是7 920.0 cd/m2和16.4 cd/A.     

高效叠层有机电致发光器件

采用Cs2CO3:Alq3/MoO3作电荷产生层,制备出高效双单元串联型叠层有机发光器件.双单元叠层有机发光器件发光性能受电荷产生层MoO3的厚度影响很大.当MoO3厚度为30 nm时,叠层器件表现出最好的器件性能,最大电流效率达到14.5 cd/A.在相当宽的低电流密度范围内,30 nm MoO3叠层器件的电流效率是...     

NPB厚度对堆叠式白光OLED性能的影响

主要研究了NPB厚度对堆叠式白色有机电致发光器件性能的影响。实验制备了四组结构为ITO/2-TNATA(15 nm)/NPB(Tnm)/ADN(30 nm):TBPe(2%):DCJTB(1%)/Alq3(20 nm)/LiF(1 nm)/Al(100 nm)(其中T分别为15,30,35和40 nm)的OLED器件,比较了不同厚度情况下OLED器件的电致发光特性,结果表明:改变NPB(4,4-N,N-bis-N-1-naphthy1-N-pheny1-amino-bipheny1)的厚度能够明显提高器件的发光亮度和发光效率,并调节载流子复合区域的位置,有效提高载流子的注入效果。同时发光器件的颜色也可通过调节NPB层的厚度来改变,这种器件使用NPB作为空穴传输层显示出了色纯度高、亮度好、效率较高的白光发射,其具有CIE色坐标(x=0.301 6,y=0.338 5),最高亮度和最大发光效率分别达到14 020 cd/m2与2.94 lm/W。     

不同荧光蓝光层厚度的OLED的制备与光电性能

采用蓝色荧光材料1p-TDPVBi结合绿色磷光材料2Ir(ppy)3掺杂到母体材料CBP作为绿光发光层,并且采用3BPhen作为电子传输层和激子阻挡层制备结构为ITO/m-MTDATA(50nm)/NPB(10nm)/p-TDPVBi(dnm)/CBP∶Ir(ppy)38%7nm/BPhen(60nm)/LiF(1nm)/Al的有机发光器件。实验结果表明:通过改变蓝光发光层p-TDPVBi的厚度,得到了高效率的有机发光器件,当p-TDPVBi厚度为5nm时,器件的电流效率和功率效率在4V时达到32.3cd/A和25.3lm/W,亮度在11V时达到31 020cd/m2。研究了p-TDPVBi厚度由3nm变化到9nm,OLED器件的电流密度-电压特性曲线、亮度-电压曲线及电流效率-电压和功率效率-电压等光电性能的变化。     

Alq3厚度以及沉积速率对OLED性能的影响

以ITO为透明电极，NPB为空穴传输层，Alq3为发光层，制备出ITO／NPB／Alq3／LiF／Al结构的有机电致发光显示器。通过比较Alq3发光层厚度以及沉积速率对OLED的亮度、发光效率的影响，确定了Alq3层的厚度为65nm，沉积速率为0．3nm／s，得到起亮电压为3．01V、发光亮度为12800cd／m^2、发光效率达到4．421cd／A的器件，并对其影响因素进行了分析。     

NPB层嵌入MgF_2超薄层对OLED性能的影响

将MgF2超薄层嵌入有机电致发光器件(OLED)的空穴传输层NPB中,制备了结构为ITO/NPB(10nm)/MgF2(xnm)/NPB(20nm)/Alq3(30nm)/Al(30nm)的一系列OLED。测试结果表明,合适厚度的MgF2可有效降低器件启亮电压,提高器件的发光效率。MgF2厚度为0.5nm的器件启亮电压只有2.3V,较未嵌入MgF2器件降低2V;MgF2厚度为1.0nm的器件最大电流效率达到3.93cd/A,最大光功率效率达到1.58lm/W,较未嵌入MgF2器件分别提高95%和110%。     

LiF层对ITD/Alq~3/LiF∶Al器件性能的影响

分别制备了4种有机电致发光器件(OLEDs):ITO/Alq3/Al;ITO/Alq3/LiF(1.0nm):Al;ITO/Alq3/LiF(1.5nm)∶Al;ITO/Alq3/LiF∶(2.0nm)Al。研究了LiF的引入对金属电极与发光层界面的影响以及各种不同的界面态对器件发光性能的影响。研究结果表明:适当的LiF厚度的引入不仅可以改善器件的界面特性,而且可以提高器件的发光亮度及发光效率。     

基于混合配体Znq(DBM)的单色和白色OLED

以8-羟基喹啉(q)和1,3-二苯基-1,3-丙二酮定向合成了有机小分子配合物Znq(DBM),将其作为发光层制备了单色有机电致发光器件(OLED)。在结构为ITO/m-MTDATA(5nm)/NPB(40nm)/Znq(DBM)(60nm)/LiF(0.5nm)/Al(100nm)的器件中,启亮电压为5V,最大亮度达到4 575cd/m2。同时又在器件中引入间隔层BCP,研究其不同厚度对OLED性能的影响。在结构为ITO/m-MTDATA(5nm)/NPB(40nm)/BCP(x nm)/Znq(DBM)(60nm)/LiF(0.5nm)/Al(100nm)的器件中,当BCP层厚为0nm时,发光颜色为黄绿色;当BCP层厚为1nm时,发光颜色为白色,色坐标为(0.29,0.33),最大亮度为2 231cd/m2;当BCP层厚为5nm时,发光颜色为蓝色。根据器件结构和性能,讨论了其内部机理。     

BCP的厚度对OLED性能的影响

设计了一种有机电致发光器件（OLED）结构：ITO／NPB（50nm）／BCP（x）／Alq3（50mm）／LiF（0．5mm）／Al（120nm）。在实验中改变BCP的厚度,调整电子和空穴的注入平衡,控制发光层（EML）。研究发现：当BCP的厚度为0nm时,器件为典型的双层OLED结构,光谱为绿色的Alq3特征光谱;当厚度为8nm或8nm以上时,发光区完全基于NPB层,器件为蓝色发光;当厚度在1nm到8nm时,NPB层和Alq3层对发光都有贡献,EL谱线包括蓝光发射和绿光发射。BCP层起到了调节载流子复合区域和改变器件发光颜色的作用,因此控制BCP的厚度可以改善器件的性能。     

具有新型电荷产生层的叠层有机发光器件

研究了采用薄层WO3作为叠层有机发光器件电荷产生层时的性能并对其厚度进行了优化,器件的电荷产生层由Li掺杂的电子注入层和高透明的WO3组成.研究表明,薄层WO3具有很高的透明度,并能有效地产生和注入空穴.叠层器件性能与单发光单元器件相比较,其亮度及效率均有大幅提高,叠层器件的最大电流效率达到了4.2 cd/A,在相同的电流密度下,叠层器件的效率约为传统器件的2倍;同时,电荷产生层的性能与WO3薄膜厚度密切相关,WO3薄膜厚度为3 nm时,器件的效率在整个电流范围内都保持稳定.采用薄层WO3作为电荷产生层为制备高效叠层有机发光器件提供了一条有效的途径.     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Ta/NiFe/Cu/NiFe/FeMn/Ta自旋阀多层膜的X射线光电子能谱的研究

实验表明：Ta／NiFe／FeMn／Ta多层膜的交换耦合场(Hex)要大于Ta／NiFe／Cu／NiFe／FeMn／Ta自旋阀多层膜中的以Hex。为了寻找其原因，用X射线光电子能谱(XPS)研究了Ta(12nm)／NiFe(7nm)，Ta(12nm)／NiFe(7nm))／Cu(4nm)和Ta(12nm)／NiFe(7nm)／Cu(3nm)／NiFe(5nm)3种样品，研究结果表明，前两种样品表面无任何来自下层的元素偏聚；但在第3种样品最上层的NiFe表面上，探测到从下层偏聚上来的Cu原子。我们认为：Cu在NiFe／FeMn层间的存在是Ta／NiFe／Cu／NiFe／FeMn／Ta自旋阀多层膜的Hex低于Ta／NiFe／FeMn／Ta多层膜Hex的一个重要原因。     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Thermoelectric Properties of Triple-Filled BaxYbyInzCo4Sb12 Skutterudites

Indium-filled skutterudites are promising power generation thermoelectric materials due to the presence of an InSb nanostructure that lowers the thermal conductivity. In this work, we have investigated thermoelectric properties of triple-filled Ba _x Yb _y In _z Co₄Sb₁₂ (0 ≤ x, y, z ≤ 0.14 actual) compounds by measuring their Seebeck coefficient, electrical conductivity, thermal conductivity, and Hall coefficient. All samples were prepared by a melting–annealing–spark plasma sintering method, and their structure was characterized by x-ray diffraction and transmission electron microscopy (TEM). TEM results show the development of an InSb nanostructure with a grain size of 30 nm to 500 nm. The nanostructure is present in all samples containing In and is also detected by specific heat measurements. The Seebeck and Hall coefficients indicate that the compounds are n-type semiconductors. Electrical conductivity increases with increasing Ba content. Thermal conductivity is strongly suppressed upon the presence of In in the skutterudite structure, likely due to enhanced boundary scattering of phonons on the nanometer-scale InSb inclusions. The highest thermoelectric figure of merit is achieved with Ba_0.09Yb_0.07In_0.06Co₄Sb_11.97, reaching ZT = 1.25 at 800 K.     

Broadband microwave noise characteristics of high-linearity composite-channel Al/sub 0.3/Ga/sub 0.7/N/Al/sub 0.05/Ga/sub 0.95/N/GaN HEMTs

We report broadband microwave noise characteristics of a high-linearity composite-channel HEMT (CC-HEMT). Owing to the novel composite-channel design, the CC-HEMT exhibits high gain and high linearity such as an output third-order intercept point (OIP3) of 33.2 dBm at 2 GHz. The CC-HEMT also exhibits excellent microwave noise performance. For 1-/spl mu/m gate-length devices, a minimum noise figure (NF/sub min/) of 0.7 dB and an associated gain (G/sub a/) of 19 dB were observed at 1 GHz, and an (NF/sub mi/) of 3.3 dB and a G/sub a/ of 10.8 dB were observed at 10 GHz. The dependence of the noise characteristics on the physical design parameters, such as the gate-source and gate-drain spacing, is also presented.     

M／PS／Si／M结构的电致发光

用阳极氧化工艺制作了多孔硅膜，采用第二次阳极氧化的方法看到了多孔硅的电致发光现象，并制作了一个Ｍ／ＰＳ／Ｓｉ／Ｍ类肖特基结构的发光二极管，观察到其电致发光，但其电致发光效率与强度很低，寿命很短，提出了研制实用化的多孔硅电致发光器件的努力方向。     

Temperature dependent current-voltage characteristics of n-MgxZn1−xO/p-GaN junction diodes

This study investigates the temperature dependence of the current-voltage (I-V) characteristics of n-Mg_xZn_1−xO/p-GaN junction diodes. The n-Mg_xZn_1−xO films were deposited on p-GaN using a radio-frequency (rf) magnetron sputtering system followed by annealing at 500, 600, 700, and 800 °C in nitrogen ambient for 60 s, respectively. The n-Mg_xZn_1−xO/p-GaN diode at a substrate temperature of 25 °C had the lowest leakage current in reverse bias. However, the leakage current of the diodes increased with an increase in annealing temperatures. The temperature sensitivity coefficients of the I-V characterizations were obtained at different substrate temperatures (25, 50, 75 100, and 125 °C) providing extracted values of 26.4, 27.2, 17.9, and 0.0 mV/°C in forward bias and 168.8, 143.4, 84.6, and 6.4 mV/°C in reverse bias, respectively. The n-Mg_xZn_1−xO/p-GaN junction diode fabricated with Mg_xZn_1−xO annealed at 800 °C demonstrated the lowest temperature dependence. Based on these findings, the n-Mg_xZn_1−xO/p-GaN junction diode is feasible for GaN-based heterojunction bipolar transistors (HBTs).     

Effect of Mg doping on the superconducting properties of Cu/sub 1-x/Tl/sub x/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta//

Superconducting properties of Cu/sub 1-x/Tl/sub x/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta// (Cu/sub 1-x/Tl/sub x/Mg/sub y/-1234) material have been studied in the composition range y=0,1.5,2.25. The zero resistivity critical temperature [T/sub c/(R=0)] was found to increase with the increased concentration of Mg in the unit cell; for y=1.5 [T/sub c/(R=0)]=131 K was achieved which is hitherto highest in Cu/sub 1-x/Tl/sub x/-based superconductors. The X-ray diffraction analyses have shown the formation of a predominant single phase of Cu/sub 0.5/Tl/sub 0.5/Ba/sub 2/Ca/sub 3-y/Mg/sub y/Cu/sub 4/O/sub 12-/spl delta// superconductor with an inclusion of impurity phase. It is observed from the convex shape of the resistivity versus temperature measurements that our as-prepared material was in the region of carrier over-doping, and the number of carriers was optimized by postannealing experiments in air at 400/spl deg/C, 500/spl deg/C, and 600/spl deg/C. The T/sub c/(R=0) was found to increase with postannealing and the best postannealing temperature was found to be 600/spl deg/C. The mechanism of increased T/sub c/(R=0) is understood by carrying out infrared absorption measurements. It was observed through softening of Cu(2)-O/sub A/-Tl apical oxygen mode that improved interplane coupling was a possible source of enhancement of T/sub c/(R=0) to 131 K.     

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

A ternary WN_xC_y system was deposited in a thermal ALD (atomic layer deposition) reactor from ASM at 300 °C in a process sequence using tungsten hexafluoride (WF₆), triethyl borane (TEB) and ammonia (NH₃) as precursors. The WC_x layers were deposited by a novel ALD process at a process temperature of 250 °C. The WN_x layers were deposited at 375 °C using bis(tert-butylimido)-bis-(dimethylamido)tungsten (^tBuN)₂(Me₂N)₂W (imido-amido) and NH₃ as precursors. WN_x grows faster on plasma enhanced chemical vapor deposition (PECVD) oxide than WC_x does on chemical oxide. WN_xC_y grows better on PECVD oxide than on thermal oxide, which is opposite of what is seen for WN_x. In the case of the ternary WN_xC_y system, the scalability towards thinner layers and galvanic corrosion behavior are disadvantages for the incorporation of the layer into Cu interconnects. ALD WC_x based barriers have a low resistivity, but galvanic corrosion in a model slurry solution of 15% peroxide (H₂O₂) is a potential problem. Higher resistivity values are determined for the binary WN_x layers. WN_x shows a constant composition and density throughout the layer.